Adhesion in Microelectronics

Adhesion in Microelectronics

Author: K. L. Mittal

Publisher: John Wiley & Sons

Published: 2014-08-25

Total Pages: 293

ISBN-13: 1118831349

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This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings


Book Synopsis Adhesion in Microelectronics by : K. L. Mittal

Download or read book Adhesion in Microelectronics written by K. L. Mittal and published by John Wiley & Sons. This book was released on 2014-08-25 with total page 293 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings


Adhesives Technology for Electronic Applications

Adhesives Technology for Electronic Applications

Author: James J. Licari

Publisher: William Andrew

Published: 2011-06-24

Total Pages: 415

ISBN-13: 1437778909

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Approx.512 pages Approx.512 pages


Book Synopsis Adhesives Technology for Electronic Applications by : James J. Licari

Download or read book Adhesives Technology for Electronic Applications written by James J. Licari and published by William Andrew. This book was released on 2011-06-24 with total page 415 pages. Available in PDF, EPUB and Kindle. Book excerpt: Approx.512 pages Approx.512 pages


Materials study for interfacial adhesion and reliability of microelectronics packaging structures

Materials study for interfacial adhesion and reliability of microelectronics packaging structures

Author: Xiang Dai

Publisher:

Published: 1998

Total Pages: 328

ISBN-13:

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Book Synopsis Materials study for interfacial adhesion and reliability of microelectronics packaging structures by : Xiang Dai

Download or read book Materials study for interfacial adhesion and reliability of microelectronics packaging structures written by Xiang Dai and published by . This book was released on 1998 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt:


Adhesive Bonding in Photonics Assembly and Packaging

Adhesive Bonding in Photonics Assembly and Packaging

Author: B. G. Yacobi

Publisher: American Scientific Publishers

Published: 2003

Total Pages: 200

ISBN-13:

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Book Synopsis Adhesive Bonding in Photonics Assembly and Packaging by : B. G. Yacobi

Download or read book Adhesive Bonding in Photonics Assembly and Packaging written by B. G. Yacobi and published by American Scientific Publishers. This book was released on 2003 with total page 200 pages. Available in PDF, EPUB and Kindle. Book excerpt:


Ire Bonding in Microelectronics

Ire Bonding in Microelectronics

Author: George G. Harman

Publisher: McGraw Hill Professional

Published: 1997

Total Pages: 290

ISBN-13: 9780070326194

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The first edition of this work is considered a classic reference in the field. This new edition updates the entire work and adds 100 pages of information covering new materials and techniques such as fine pitch


Book Synopsis Ire Bonding in Microelectronics by : George G. Harman

Download or read book Ire Bonding in Microelectronics written by George G. Harman and published by McGraw Hill Professional. This book was released on 1997 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first edition of this work is considered a classic reference in the field. This new edition updates the entire work and adds 100 pages of information covering new materials and techniques such as fine pitch


Reliability and Quality in Microelectronic Manufacturing

Reliability and Quality in Microelectronic Manufacturing

Author: A. Christou

Publisher: RIAC

Published: 2006

Total Pages: 410

ISBN-13: 1933904151

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Book Synopsis Reliability and Quality in Microelectronic Manufacturing by : A. Christou

Download or read book Reliability and Quality in Microelectronic Manufacturing written by A. Christou and published by RIAC. This book was released on 2006 with total page 410 pages. Available in PDF, EPUB and Kindle. Book excerpt:


Interfacial Compatibility in Microelectronics

Interfacial Compatibility in Microelectronics

Author: Tomi Laurila

Publisher: Springer Science & Business Media

Published: 2012-01-10

Total Pages: 221

ISBN-13: 1447124707

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Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: solutions to several common reliability issues in microsystem technology, methods to understand and predict failure mechanisms at interfaces between dissimilar materials and an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA. Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.


Book Synopsis Interfacial Compatibility in Microelectronics by : Tomi Laurila

Download or read book Interfacial Compatibility in Microelectronics written by Tomi Laurila and published by Springer Science & Business Media. This book was released on 2012-01-10 with total page 221 pages. Available in PDF, EPUB and Kindle. Book excerpt: Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: solutions to several common reliability issues in microsystem technology, methods to understand and predict failure mechanisms at interfaces between dissimilar materials and an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA. Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.


Microelectronic Ultrasonic Bonding

Microelectronic Ultrasonic Bonding

Author: George G. Harman

Publisher:

Published: 1974

Total Pages: 116

ISBN-13:

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Book Synopsis Microelectronic Ultrasonic Bonding by : George G. Harman

Download or read book Microelectronic Ultrasonic Bonding written by George G. Harman and published by . This book was released on 1974 with total page 116 pages. Available in PDF, EPUB and Kindle. Book excerpt:


Semiconductor Wafer Bonding 9: Science, Technology, and Applications

Semiconductor Wafer Bonding 9: Science, Technology, and Applications

Author: Helmut Baumgart

Publisher: The Electrochemical Society

Published: 2006

Total Pages: 398

ISBN-13: 156677506X

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This issue of ECS Transactions covers state-of-the-art R&D results of the last 1.5 years in the field of semiconductor wafer bonding technology. Wafer Bonding Technology can be used to create novel composite materials systems and devices what would otherwise be unattainable. Wafer bonding today is rapidly expanding applications in such diverse fields as photonics, sensors, MEMS, X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI), and Nanotechnologies.


Book Synopsis Semiconductor Wafer Bonding 9: Science, Technology, and Applications by : Helmut Baumgart

Download or read book Semiconductor Wafer Bonding 9: Science, Technology, and Applications written by Helmut Baumgart and published by The Electrochemical Society. This book was released on 2006 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of ECS Transactions covers state-of-the-art R&D results of the last 1.5 years in the field of semiconductor wafer bonding technology. Wafer Bonding Technology can be used to create novel composite materials systems and devices what would otherwise be unattainable. Wafer bonding today is rapidly expanding applications in such diverse fields as photonics, sensors, MEMS, X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI), and Nanotechnologies.


Semiconductor Wafer Bonding : Science, Technology, and Applications V

Semiconductor Wafer Bonding : Science, Technology, and Applications V

Author: Charles E. Hunt

Publisher: The Electrochemical Society

Published: 2001

Total Pages: 496

ISBN-13: 9781566772587

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Book Synopsis Semiconductor Wafer Bonding : Science, Technology, and Applications V by : Charles E. Hunt

Download or read book Semiconductor Wafer Bonding : Science, Technology, and Applications V written by Charles E. Hunt and published by The Electrochemical Society. This book was released on 2001 with total page 496 pages. Available in PDF, EPUB and Kindle. Book excerpt: