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Advanced Adhesives in Electronics

Author: M O Alam

Publisher: Elsevier

Published: 2011-05-25

Total Pages: 279

ISBN-13: 0857092898

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Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques

Book Synopsis Advanced Adhesives in Electronics by : M O Alam

Download or read book Advanced Adhesives in Electronics written by M O Alam and published by Elsevier. This book was released on 2011-05-25 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques

Adhesives Technology for Electronic Applications

Author: James J. Licari

Publisher: William Andrew

Published: 2011-06-24

Total Pages: 415

ISBN-13: 1437778909

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Approx.512 pages Approx.512 pages

Book Synopsis Adhesives Technology for Electronic Applications by : James J. Licari

Download or read book Adhesives Technology for Electronic Applications written by James J. Licari and published by William Andrew. This book was released on 2011-06-24 with total page 415 pages. Available in PDF, EPUB and Kindle. Book excerpt: Approx.512 pages Approx.512 pages

Advanced Piezoelectric Materials

Author: Kenji Uchino

Publisher: Elsevier

Published: 2010-09-27

Total Pages: 696

ISBN-13: 1845699750

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Piezoelectric materials produce electric charges on their surfaces as a consequence of applying mechanical stress. They are used in the fabrication of a growing range of devices such as transducers (used, for example, in ultrasound scanning), actuators (deployed in such areas as vibration suppression in optical and microelectronic engineering), pressure sensor devices (such as gyroscopes) and increasingly as a way of producing energy. Their versatility has led to a wealth of research to broaden the range of piezoelectric materials and their potential uses. Advanced piezoelectric materials: science and technology provides a comprehensive review of these new materials, their properties, methods of manufacture and applications. After an introductory overview of the development of piezoelectric materials, Part one reviews the various types of piezoelectric material, ranging from lead zirconate titanate (PZT) piezo-ceramics, relaxor ferroelectric ceramics, lead-free piezo-ceramics, quartz-based piezoelectric materials, the use of lithium niobate and lithium in piezoelectrics, single crystal piezoelectric materials, electroactive polymers (EAP) and piezoelectric composite materials. Part two discusses how to design and fabricate piezo-materials with chapters on piezo-ceramics, single crystal preparation techniques, thin film technologies, aerosol techniques and manufacturing technologies for piezoelectric transducers. The final part of the book looks at applications such as high-power piezoelectric materials and actuators as well as the performance of piezoelectric materials under stress. With its distinguished editor and international team of expert contributors Advanced piezoelectric materials: science and technology is a standard reference for all those researching piezoelectric materials and using them to develop new devices in such areas as microelectronics, optical, sound, structural and biomedical engineering. Provides a comprehensive review of the new materials, their properties and methods of manufacture and application Explores the development of piezoelectric materials from the historical background to the present status Features an overview of manufacturing methods for piezoelectric ceramic materials including design considerations

Book Synopsis Advanced Piezoelectric Materials by : Kenji Uchino

Download or read book Advanced Piezoelectric Materials written by Kenji Uchino and published by Elsevier. This book was released on 2010-09-27 with total page 696 pages. Available in PDF, EPUB and Kindle. Book excerpt: Piezoelectric materials produce electric charges on their surfaces as a consequence of applying mechanical stress. They are used in the fabrication of a growing range of devices such as transducers (used, for example, in ultrasound scanning), actuators (deployed in such areas as vibration suppression in optical and microelectronic engineering), pressure sensor devices (such as gyroscopes) and increasingly as a way of producing energy. Their versatility has led to a wealth of research to broaden the range of piezoelectric materials and their potential uses. Advanced piezoelectric materials: science and technology provides a comprehensive review of these new materials, their properties, methods of manufacture and applications. After an introductory overview of the development of piezoelectric materials, Part one reviews the various types of piezoelectric material, ranging from lead zirconate titanate (PZT) piezo-ceramics, relaxor ferroelectric ceramics, lead-free piezo-ceramics, quartz-based piezoelectric materials, the use of lithium niobate and lithium in piezoelectrics, single crystal piezoelectric materials, electroactive polymers (EAP) and piezoelectric composite materials. Part two discusses how to design and fabricate piezo-materials with chapters on piezo-ceramics, single crystal preparation techniques, thin film technologies, aerosol techniques and manufacturing technologies for piezoelectric transducers. The final part of the book looks at applications such as high-power piezoelectric materials and actuators as well as the performance of piezoelectric materials under stress. With its distinguished editor and international team of expert contributors Advanced piezoelectric materials: science and technology is a standard reference for all those researching piezoelectric materials and using them to develop new devices in such areas as microelectronics, optical, sound, structural and biomedical engineering. Provides a comprehensive review of the new materials, their properties and methods of manufacture and application Explores the development of piezoelectric materials from the historical background to the present status Features an overview of manufacturing methods for piezoelectric ceramic materials including design considerations

Adhesives, Sealants and Coatings for the Electronics Industry

Author: Ernest W. Flick

Publisher: William Andrew

Published: 1992-12-31

Total Pages: 1038

ISBN-13:

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The second edition of this industrial guide contains descriptions of some 2,500 adhesive, sealants, and coatings, based on information provided by manufacturers and distributors of these products. The volume is divided into 11 sections based on end use: adhesives--general; adhesives--cyanocrylate; adhesives--epoxy; caulks and sealants; coatings; conductive compounds; encapsulating, potting, casting, impregnating compounds; films and tapes; insulating products; silicones; and miscellaneous. Each product lists, as available, company name and product category; tradename and product number; and product description/specification. Typical end uses may also be included. Includes a list of suppliers' addresses. Annotation copyrighted by Book News, Inc., Portland, OR

Book Synopsis Adhesives, Sealants and Coatings for the Electronics Industry by : Ernest W. Flick

Download or read book Adhesives, Sealants and Coatings for the Electronics Industry written by Ernest W. Flick and published by William Andrew. This book was released on 1992-12-31 with total page 1038 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second edition of this industrial guide contains descriptions of some 2,500 adhesive, sealants, and coatings, based on information provided by manufacturers and distributors of these products. The volume is divided into 11 sections based on end use: adhesives--general; adhesives--cyanocrylate; adhesives--epoxy; caulks and sealants; coatings; conductive compounds; encapsulating, potting, casting, impregnating compounds; films and tapes; insulating products; silicones; and miscellaneous. Each product lists, as available, company name and product category; tradename and product number; and product description/specification. Typical end uses may also be included. Includes a list of suppliers' addresses. Annotation copyrighted by Book News, Inc., Portland, OR

Electrical Conductive Adhesives with Nanotechnologies

Author: Yi (Grace) Li

Publisher: Springer Science & Business Media

Published: 2009-10-08

Total Pages: 445

ISBN-13: 0387887830

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“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.

Book Synopsis Electrical Conductive Adhesives with Nanotechnologies by : Yi (Grace) Li

Download or read book Electrical Conductive Adhesives with Nanotechnologies written by Yi (Grace) Li and published by Springer Science & Business Media. This book was released on 2009-10-08 with total page 445 pages. Available in PDF, EPUB and Kindle. Book excerpt: “Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.

Polymers in Organic Electronics

Author: Sulaiman Khalifeh

Publisher: Elsevier

Published: 2020-04-01

Total Pages: 617

ISBN-13: 192788568X

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Polymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental principles of polymers and electronics. Features information on concepts and optimized types of electronics and a classification system of electronic polymers, including piezoelectric and pyroelectric, optoelectronic, mechatronic, organic electronic complexes, and more. The book is designed to help readers select the optimized material for structuring their organic electronic system.Chapters discuss the most common properties of electronic polymers, methods of optimization, and polymeric-structured printed circuit boards. The polymeric structures of optoelectronics and photonics are covered and the book concludes with a chapter emphasizing the importance of polymeric structures for packaging of electronic devices. Provides key identifying details on a range of polymers, micro-polymers, nano-polymers, resins, hydrocarbons, and oligomers Covers the most common electrical, electronic, and optical properties of electronic polymers Describes the underlying theories on the mechanics of polymer conductivity Discusses polymeric structured printed circuit boards, including their rapid prototyping and optimizing their polymeric structures Shows optimization methods for both polymeric structures of organic active electronic components and organic passive electronic components

Book Synopsis Polymers in Organic Electronics by : Sulaiman Khalifeh

Download or read book Polymers in Organic Electronics written by Sulaiman Khalifeh and published by Elsevier. This book was released on 2020-04-01 with total page 617 pages. Available in PDF, EPUB and Kindle. Book excerpt: Polymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental principles of polymers and electronics. Features information on concepts and optimized types of electronics and a classification system of electronic polymers, including piezoelectric and pyroelectric, optoelectronic, mechatronic, organic electronic complexes, and more. The book is designed to help readers select the optimized material for structuring their organic electronic system.Chapters discuss the most common properties of electronic polymers, methods of optimization, and polymeric-structured printed circuit boards. The polymeric structures of optoelectronics and photonics are covered and the book concludes with a chapter emphasizing the importance of polymeric structures for packaging of electronic devices. Provides key identifying details on a range of polymers, micro-polymers, nano-polymers, resins, hydrocarbons, and oligomers Covers the most common electrical, electronic, and optical properties of electronic polymers Describes the underlying theories on the mechanics of polymer conductivity Discusses polymeric structured printed circuit boards, including their rapid prototyping and optimizing their polymeric structures Shows optimization methods for both polymeric structures of organic active electronic components and organic passive electronic components

Materials for Advanced Packaging

Author: Daniel Lu

Publisher: Springer

Published: 2016-11-18

Total Pages: 969

ISBN-13: 3319450980

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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Book Synopsis Materials for Advanced Packaging by : Daniel Lu

Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 969 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Adhesion in Microelectronics

Author: K. L. Mittal

Publisher: John Wiley & Sons

Published: 2014-08-25

Total Pages: 293

ISBN-13: 1118831349

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This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings

Book Synopsis Adhesion in Microelectronics by : K. L. Mittal

Download or read book Adhesion in Microelectronics written by K. L. Mittal and published by John Wiley & Sons. This book was released on 2014-08-25 with total page 293 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings

Adhesive Bonding

Author: R D Adams

Publisher: Elsevier

Published: 2005-03-08

Total Pages: 560

ISBN-13: 1845690753

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This important collection reviews key research on adhesive behaviour and applications in sectors as diverse as construction and automotive engineering. The book is divided into three main parts: fundamentals, mechanical properties and applications. Part one focuses on the basic properties of adhesives, surface assessment and treatment. Part two concentrates on understanding how adhesives perform under stress and the factors affecting fatigue and failure. The final part of the book reviews industry specific applications in areas such as building and construction, transport and electrical engineering. With its distinguished editor and international team of contributors, Adhesive bonding is a standard reference for all those concerned with the industrial application of adhesives. Essential information for all those concerned with the industrial application of adhesives This important collection examines adhesives and adhesive bonding for load-bearing applications Arranged in a user-friendly format with three main sections: fundamentals, generic uses and industry specific applications

Book Synopsis Adhesive Bonding by : R D Adams

Download or read book Adhesive Bonding written by R D Adams and published by Elsevier. This book was released on 2005-03-08 with total page 560 pages. Available in PDF, EPUB and Kindle. Book excerpt: This important collection reviews key research on adhesive behaviour and applications in sectors as diverse as construction and automotive engineering. The book is divided into three main parts: fundamentals, mechanical properties and applications. Part one focuses on the basic properties of adhesives, surface assessment and treatment. Part two concentrates on understanding how adhesives perform under stress and the factors affecting fatigue and failure. The final part of the book reviews industry specific applications in areas such as building and construction, transport and electrical engineering. With its distinguished editor and international team of contributors, Adhesive bonding is a standard reference for all those concerned with the industrial application of adhesives. Essential information for all those concerned with the industrial application of adhesives This important collection examines adhesives and adhesive bonding for load-bearing applications Arranged in a user-friendly format with three main sections: fundamentals, generic uses and industry specific applications

Structural Adhesives

Author: K. L. Mittal

Publisher: John Wiley & Sons

Published: 2023-03-23

Total Pages: 484

ISBN-13: 1394175582

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Structural Adhesives Uniquely provides up-to-date and comprehensive information on the topic in an easily-accessible form. A structural adhesive can be described as a high-strength adhesive material that is isotropic in nature and bonds two or more parts together in a load-bearing structure. A structural adhesive material must be capable of transmitting the stress/load without loss of structural integrity within design limits. There are many types of established structural adhesives, including epoxy, urethane, acrylic, silicone, etc. Structural Adhesives comprises nine chapters and is divided into two parts: Part 1, Preparation, Properties, and Characterization; Part 2, Applications. The topics covered include: structural epoxy adhesives; biological reinforcement of epoxies as structural adhesives; marble dust reinforced epoxy structural adhesive composites; characterization of various structural adhesive materials; effects of shear and peel stress distributions on the behavior of structural adhesives; the inelastic response of structural aerospace adhesives; structural reactive acrylic adhesives: their preparation, characterization, properties, and applications; application of structural adhesives in composite connections; and naval applications of structural adhesives. Audience This book should be of much use and interest to adhesionists, materials scientists, adhesive technologists, polymer scientists, and those working in the construction, railway, automotive, aviation, bridge, and shipbuilding industries.

Book Synopsis Structural Adhesives by : K. L. Mittal

Download or read book Structural Adhesives written by K. L. Mittal and published by John Wiley & Sons. This book was released on 2023-03-23 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt: Structural Adhesives Uniquely provides up-to-date and comprehensive information on the topic in an easily-accessible form. A structural adhesive can be described as a high-strength adhesive material that is isotropic in nature and bonds two or more parts together in a load-bearing structure. A structural adhesive material must be capable of transmitting the stress/load without loss of structural integrity within design limits. There are many types of established structural adhesives, including epoxy, urethane, acrylic, silicone, etc. Structural Adhesives comprises nine chapters and is divided into two parts: Part 1, Preparation, Properties, and Characterization; Part 2, Applications. The topics covered include: structural epoxy adhesives; biological reinforcement of epoxies as structural adhesives; marble dust reinforced epoxy structural adhesive composites; characterization of various structural adhesive materials; effects of shear and peel stress distributions on the behavior of structural adhesives; the inelastic response of structural aerospace adhesives; structural reactive acrylic adhesives: their preparation, characterization, properties, and applications; application of structural adhesives in composite connections; and naval applications of structural adhesives. Audience This book should be of much use and interest to adhesionists, materials scientists, adhesive technologists, polymer scientists, and those working in the construction, railway, automotive, aviation, bridge, and shipbuilding industries.