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Advanced Polyimide Materials

Author: Shi-Yong Yang

Publisher: Elsevier

Published: 2018-04-20

Total Pages: 498

ISBN-13: 0128126418

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Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. Reviews the latest research, development and future prospective of polyimides Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers Presents a highly organized work that is composed of different sections that are easily compared

Book Synopsis Advanced Polyimide Materials by : Shi-Yong Yang

Download or read book Advanced Polyimide Materials written by Shi-Yong Yang and published by Elsevier. This book was released on 2018-04-20 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. Reviews the latest research, development and future prospective of polyimides Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers Presents a highly organized work that is composed of different sections that are easily compared

Textile-Based Advanced Materials

Author: Thomas Bechtold

Publisher: MDPI

Published: 2021-03-17

Total Pages: 248

ISBN-13: 3036504206

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Developments in the science and technology of textiles are not only limited to apparel and fashion. Certainly, there are research efforts aimed at improving the construction and processing of textiles for clothing—such as studies on cleaner production to reduce environmental impact, increasing the utilization of fibers and process chemicals from renewable resources, and on the recycling of materials from post-consumer waste apparel back into the manufacturing of new clothing articles. In addition, technological concepts developed for the creation of clothing over the centuries are now being investigated for use in a diverse array of fields—such as in the manufacture of engineering composites, personal protective equipment, and medicine. Further, developments in other fields—such as electronics, nanotechnology, and information and communication technologies—are being investigated for their incorporation into apparel and clothing to create “smart textiles”. The aim of this Special Issue is to put together a collection of scientific reports on such efforts to highlight the range of scientific and technological issues that are being targeted and the ingenuity of the methodologies employed to find answers. It is hoped that readers of this issue will come away with an appreciation of the research being conducted in this area, and perhaps gain inspiration for their own scientific endeavors.

Book Synopsis Textile-Based Advanced Materials by : Thomas Bechtold

Download or read book Textile-Based Advanced Materials written by Thomas Bechtold and published by MDPI. This book was released on 2021-03-17 with total page 248 pages. Available in PDF, EPUB and Kindle. Book excerpt: Developments in the science and technology of textiles are not only limited to apparel and fashion. Certainly, there are research efforts aimed at improving the construction and processing of textiles for clothing—such as studies on cleaner production to reduce environmental impact, increasing the utilization of fibers and process chemicals from renewable resources, and on the recycling of materials from post-consumer waste apparel back into the manufacturing of new clothing articles. In addition, technological concepts developed for the creation of clothing over the centuries are now being investigated for use in a diverse array of fields—such as in the manufacture of engineering composites, personal protective equipment, and medicine. Further, developments in other fields—such as electronics, nanotechnology, and information and communication technologies—are being investigated for their incorporation into apparel and clothing to create “smart textiles”. The aim of this Special Issue is to put together a collection of scientific reports on such efforts to highlight the range of scientific and technological issues that are being targeted and the ingenuity of the methodologies employed to find answers. It is hoped that readers of this issue will come away with an appreciation of the research being conducted in this area, and perhaps gain inspiration for their own scientific endeavors.

Fillers and Reinforcements for Advanced Nanocomposites

Author: Yu Dong

Publisher: Woodhead Publishing

Published: 2015-07-02

Total Pages: 587

ISBN-13: 0081000820

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Fillers and Reinforcements for Advanced Nanocomposites reviews cutting-edge, state-of-the-art research on the effective use of nanoscaled fillers and reinforcements to enhance the performance of advanced nanocomposites, both in industrial and manufacturing applications. It covers a broad range of topics such as nanocelluloses, nanotubes, nanoplatelets, and nanoparticles, as well as their extensive applications. The chapters provide detailed information on how fillers and reinforcements are used in the fabrication, synthesis and characterization of advanced nanocomposites to achieve extraordinary performance of new materials and significant enhancements in their mechanical, thermal, structural and multi-functional properties. It also highlights new technologies for the fabrication of advanced nanocomposites using innovative electrospinning techniques. Covers topics such as nanocelluloses, nanotubes, nanoplatelets, and nanoparticles, as well as their extensive applications Discusses the latest research on the effective use of nanoscaled fillers and reinforcements to enhance the performance of advanced nanocomposites Explains how fillers and reinforcements are used in the fabrication, synthesis and characterization of advanced nanocomposites

Book Synopsis Fillers and Reinforcements for Advanced Nanocomposites by : Yu Dong

Download or read book Fillers and Reinforcements for Advanced Nanocomposites written by Yu Dong and published by Woodhead Publishing. This book was released on 2015-07-02 with total page 587 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fillers and Reinforcements for Advanced Nanocomposites reviews cutting-edge, state-of-the-art research on the effective use of nanoscaled fillers and reinforcements to enhance the performance of advanced nanocomposites, both in industrial and manufacturing applications. It covers a broad range of topics such as nanocelluloses, nanotubes, nanoplatelets, and nanoparticles, as well as their extensive applications. The chapters provide detailed information on how fillers and reinforcements are used in the fabrication, synthesis and characterization of advanced nanocomposites to achieve extraordinary performance of new materials and significant enhancements in their mechanical, thermal, structural and multi-functional properties. It also highlights new technologies for the fabrication of advanced nanocomposites using innovative electrospinning techniques. Covers topics such as nanocelluloses, nanotubes, nanoplatelets, and nanoparticles, as well as their extensive applications Discusses the latest research on the effective use of nanoscaled fillers and reinforcements to enhance the performance of advanced nanocomposites Explains how fillers and reinforcements are used in the fabrication, synthesis and characterization of advanced nanocomposites

Polymer-Based Advanced Functional Composites for Optoelectronic and Energy Applications

Author: Nithin Kundachira Subramani

Publisher: Elsevier

Published: 2021-05-28

Total Pages: 376

ISBN-13: 0128185090

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Polymer-Based Advanced Functional Composites for Optoelectronic and Energy Applications explains how polymer-based smart composites and nanocomposites can be prepared and utilized for novel optical, sensor and energy-related applications. The book begins with an introductory section on the fundamentals of smart polymer composites, including structure-property relationships and conjugated polymers. Other sections examine optical applications, including the use of polymer-based smart composites for luminescent solar concentrators, electro-chromic applications, light conversion applications, ultraviolet shielding applications, LED encapsulation applications, sensor applications, including gas-sensing, strain sensing, robotics and tactile sensors, with final sections covering energy-related applications, including energy harvesting, conversion, storage, vibrational energy harvesting, and more. This is an essential guide for researchers, scientists and advanced students in smart polymers and materials, polymer science, composites, nanocomposites, electronics and materials science. It is also a valuable book for scientists, R&D professionals and engineers working with products that could utilize smart polymer composites. Provides thorough coverage of the latest pioneering research in the field of polymer-based smart composites Offers an applications-oriented approach, enabling the reader to understand state-of-the-art optical, sensor and energy applications Includes an in-depth introductory section, covering important aspects such as structure-property relationships and the role of conjugated polymers

Book Synopsis Polymer-Based Advanced Functional Composites for Optoelectronic and Energy Applications by : Nithin Kundachira Subramani

Download or read book Polymer-Based Advanced Functional Composites for Optoelectronic and Energy Applications written by Nithin Kundachira Subramani and published by Elsevier. This book was released on 2021-05-28 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: Polymer-Based Advanced Functional Composites for Optoelectronic and Energy Applications explains how polymer-based smart composites and nanocomposites can be prepared and utilized for novel optical, sensor and energy-related applications. The book begins with an introductory section on the fundamentals of smart polymer composites, including structure-property relationships and conjugated polymers. Other sections examine optical applications, including the use of polymer-based smart composites for luminescent solar concentrators, electro-chromic applications, light conversion applications, ultraviolet shielding applications, LED encapsulation applications, sensor applications, including gas-sensing, strain sensing, robotics and tactile sensors, with final sections covering energy-related applications, including energy harvesting, conversion, storage, vibrational energy harvesting, and more. This is an essential guide for researchers, scientists and advanced students in smart polymers and materials, polymer science, composites, nanocomposites, electronics and materials science. It is also a valuable book for scientists, R&D professionals and engineers working with products that could utilize smart polymer composites. Provides thorough coverage of the latest pioneering research in the field of polymer-based smart composites Offers an applications-oriented approach, enabling the reader to understand state-of-the-art optical, sensor and energy applications Includes an in-depth introductory section, covering important aspects such as structure-property relationships and the role of conjugated polymers

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

Author: Beth Keser

Publisher: John Wiley & Sons

Published: 2019-02-12

Total Pages: 576

ISBN-13: 1119314135

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Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.

Book Synopsis Advances in Embedded and Fan-Out Wafer Level Packaging Technologies by : Beth Keser

Download or read book Advances in Embedded and Fan-Out Wafer Level Packaging Technologies written by Beth Keser and published by John Wiley & Sons. This book was released on 2019-02-12 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.

Polyimides and Other High Temperature Polymers: Synthesis, Characterization and Applications, Volume 3

Author: Kash L. Mittal

Publisher: CRC Press

Published: 2005-04-18

Total Pages: 582

ISBN-13: 9047415140

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Book Synopsis Polyimides and Other High Temperature Polymers: Synthesis, Characterization and Applications, Volume 3 by : Kash L. Mittal

Download or read book Polyimides and Other High Temperature Polymers: Synthesis, Characterization and Applications, Volume 3 written by Kash L. Mittal and published by CRC Press. This book was released on 2005-04-18 with total page 582 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume chronicles the proceedings of the Third International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization, and Applications, held in Orlando, December 17-19, 2003.This volume is divided into three parts. Part 1. a Synthesis, Properties and Bulk Characterizationa ; Part 2 a Hybrids and Compositesa

Polyimide for Electronic and Electrical Engineering Applications

Author: Sombel Diaham

Publisher: BoD – Books on Demand

Published: 2021-05-05

Total Pages: 336

ISBN-13: 1838800972

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Polyimide is one of the most efficient polymers in many industries for its excellent thermal, electrical, mechanical, and chemical properties as well as its easy processability. In the electronic and electrical engineering industries, polyimide has widely been used for decades thanks to its very good dielectric and insulating properties at the high electric field and at high temperatures of around 200°C in long term-service. Moreover, polyimide appears essential for the development of new electronic devices where further considerations such as high power density, integration, higher temperature, thermal conduction management, energy storage, reliability, or flexibility are required in order to sustain the growing global electrical energy consumption. This book gathers interdisciplinary chapters on polyimide in various topics through state-of-the-art and original ongoing research.

Book Synopsis Polyimide for Electronic and Electrical Engineering Applications by : Sombel Diaham

Download or read book Polyimide for Electronic and Electrical Engineering Applications written by Sombel Diaham and published by BoD – Books on Demand. This book was released on 2021-05-05 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: Polyimide is one of the most efficient polymers in many industries for its excellent thermal, electrical, mechanical, and chemical properties as well as its easy processability. In the electronic and electrical engineering industries, polyimide has widely been used for decades thanks to its very good dielectric and insulating properties at the high electric field and at high temperatures of around 200°C in long term-service. Moreover, polyimide appears essential for the development of new electronic devices where further considerations such as high power density, integration, higher temperature, thermal conduction management, energy storage, reliability, or flexibility are required in order to sustain the growing global electrical energy consumption. This book gathers interdisciplinary chapters on polyimide in various topics through state-of-the-art and original ongoing research.

High Performance Polymers - Polyimides Based

Author: Marc Abadie

Publisher: BoD – Books on Demand

Published: 2012-12-19

Total Pages: 260

ISBN-13: 9535108999

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The feature of polyimides and other heterocyclic polymers are now well-established and used for long term temperature durability in the range of 250 - 350'C. This book will review synthesis, mechanisms, ultimate properties, physico-chemical properties, processing and applications of such high performance materials needed in advanced technologies. It presents interdisciplinary papers on the state of knowledge of each topic under consideration through a combination of overviews and original unpublished research. The volume contains eleven chapters divided into three sections: Chemistry; Chemical and Physical Properties; and Applications.

Book Synopsis High Performance Polymers - Polyimides Based by : Marc Abadie

Download or read book High Performance Polymers - Polyimides Based written by Marc Abadie and published by BoD – Books on Demand. This book was released on 2012-12-19 with total page 260 pages. Available in PDF, EPUB and Kindle. Book excerpt: The feature of polyimides and other heterocyclic polymers are now well-established and used for long term temperature durability in the range of 250 - 350'C. This book will review synthesis, mechanisms, ultimate properties, physico-chemical properties, processing and applications of such high performance materials needed in advanced technologies. It presents interdisciplinary papers on the state of knowledge of each topic under consideration through a combination of overviews and original unpublished research. The volume contains eleven chapters divided into three sections: Chemistry; Chemical and Physical Properties; and Applications.

Emerging Nanoelectronic Devices

Author: An Chen

Publisher: John Wiley & Sons

Published: 2014-11-12

Total Pages: 576

ISBN-13: 1118958268

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Emerging Nanoelectronic Devices focuses on the future direction of semiconductor and emerging nanoscale device technology. As the dimensional scaling of CMOS approaches its limits, alternate information processing devices and microarchitectures are being explored to sustain increasing functionality at decreasing cost into the indefinite future. This is driving new paradigms of information processing enabled by innovative new devices, circuits, and architectures, necessary to support an increasingly interconnected world through a rapidly evolving internet. This original title provides a fresh perspective on emerging research devices in 26 up to date chapters written by the leading researchers in their respective areas. It supplements and extends the work performed by the Emerging Research Devices working group of the International Technology Roadmap for Semiconductors (ITRS). Key features: • Serves as an authoritative tutorial on innovative devices and architectures that populate the dynamic world of “Beyond CMOS” technologies. • Provides a realistic assessment of the strengths, weaknesses and key unknowns associated with each technology. • Suggests guidelines for the directions of future development of each technology. • Emphasizes physical concepts over mathematical development. • Provides an essential resource for students, researchers and practicing engineers.

Book Synopsis Emerging Nanoelectronic Devices by : An Chen

Download or read book Emerging Nanoelectronic Devices written by An Chen and published by John Wiley & Sons. This book was released on 2014-11-12 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt: Emerging Nanoelectronic Devices focuses on the future direction of semiconductor and emerging nanoscale device technology. As the dimensional scaling of CMOS approaches its limits, alternate information processing devices and microarchitectures are being explored to sustain increasing functionality at decreasing cost into the indefinite future. This is driving new paradigms of information processing enabled by innovative new devices, circuits, and architectures, necessary to support an increasingly interconnected world through a rapidly evolving internet. This original title provides a fresh perspective on emerging research devices in 26 up to date chapters written by the leading researchers in their respective areas. It supplements and extends the work performed by the Emerging Research Devices working group of the International Technology Roadmap for Semiconductors (ITRS). Key features: • Serves as an authoritative tutorial on innovative devices and architectures that populate the dynamic world of “Beyond CMOS” technologies. • Provides a realistic assessment of the strengths, weaknesses and key unknowns associated with each technology. • Suggests guidelines for the directions of future development of each technology. • Emphasizes physical concepts over mathematical development. • Provides an essential resource for students, researchers and practicing engineers.

Polyimides and Other High Temperature Polymers: Synthesis, Characterization and Applications

Author: Kash L. Mittal

Publisher: CRC Press

Published: 2005-04-18

Total Pages: 582

ISBN-13: 9067644226

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This volume chronicles the proceedings of the Third International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization, and Applications, held in Orlando, December 17-19, 2003. This volume is divided into three parts. Part 1. “Synthesis, Properties and Bulk Characterization”; Part 2 “Hybrids and Composites” and Part 3 “Applications and General Papers”. The topics covered include: Synthesis, characterization and processing (including some novel approaches) of a variety of polyimides and other high temperature polymers; structure-property relationships; hybrids and nanocomposites using these materials and their characterization, properties and applications; segmental dynamics in polyimide materials; photoalignable polyimides; photoconductivity and photosensitivity of polyimides; ultrafiltration membranes from polyetherimide; polyimide as a tunneling barrier; polymer materials for nonlinear optical applications; alignment of SWNTs in rigid-rod polymer compositions; surface modification of polyimide; adhesion of Cu to polyimide surfaces; and polyimide erosion in a low Earth orbit space environment.

Book Synopsis Polyimides and Other High Temperature Polymers: Synthesis, Characterization and Applications by : Kash L. Mittal

Download or read book Polyimides and Other High Temperature Polymers: Synthesis, Characterization and Applications written by Kash L. Mittal and published by CRC Press. This book was released on 2005-04-18 with total page 582 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume chronicles the proceedings of the Third International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization, and Applications, held in Orlando, December 17-19, 2003. This volume is divided into three parts. Part 1. “Synthesis, Properties and Bulk Characterization”; Part 2 “Hybrids and Composites” and Part 3 “Applications and General Papers”. The topics covered include: Synthesis, characterization and processing (including some novel approaches) of a variety of polyimides and other high temperature polymers; structure-property relationships; hybrids and nanocomposites using these materials and their characterization, properties and applications; segmental dynamics in polyimide materials; photoalignable polyimides; photoconductivity and photosensitivity of polyimides; ultrafiltration membranes from polyetherimide; polyimide as a tunneling barrier; polymer materials for nonlinear optical applications; alignment of SWNTs in rigid-rod polymer compositions; surface modification of polyimide; adhesion of Cu to polyimide surfaces; and polyimide erosion in a low Earth orbit space environment.