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Author: Gerald A. Walker
Publisher: Springer
Published: 2013-12-11
Total Pages: 342
ISBN-13: 1489973117
DOWNLOAD EBOOKDownload or read book Advances in Electronic Circuit Packaging written by Gerald A. Walker and published by Springer. This book was released on 2013-12-11 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author: Lawrence L. Rosine
Publisher: Springer
Published: 2013-12-01
Total Pages: 303
ISBN-13: 1489973079
DOWNLOAD EBOOKDownload or read book Advances in Electronic Circuit Packaging written by Lawrence L. Rosine and published by Springer. This book was released on 2013-12-01 with total page 303 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in electronic circuit packaging ; 1 written by and published by . This book was released on 1960 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author: Richard K. Ulrich
Publisher: John Wiley & Sons
Published: 2006-02-24
Total Pages: 852
ISBN-13: 0471466093
DOWNLOAD EBOOKAs in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Download or read book Advanced Electronic Packaging written by Richard K. Ulrich and published by John Wiley & Sons. This book was released on 2006-02-24 with total page 852 pages. Available in PDF, EPUB and Kindle. Book excerpt: As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Author: Lawrence L. Rosine
Publisher: Springer
Published: 2013-12-11
Total Pages: 463
ISBN-13: 1489973095
DOWNLOAD EBOOKDownload or read book Advances in Electronic Circuit Packaging written by Lawrence L. Rosine and published by Springer. This book was released on 2013-12-11 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author: MARESE M.
Publisher: Plenum Publishing Corporation
Published: 1995-12-31
Total Pages: 490
ISBN-13: 9780306370144
DOWNLOAD EBOOKDownload or read book Advances in Electronic Circuit Packaging written by MARESE M. and published by Plenum Publishing Corporation. This book was released on 1995-12-31 with total page 490 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Electronic Circuit Packaging written by Gerald A. Walker and published by . This book was released on 1965 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Electronic Circuit Packaging written by Gerald A. Walker and published by . This book was released on 1962 with total page 381 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author: Yong Liu
Publisher: Springer Science & Business Media
Published: 2012-02-15
Total Pages: 606
ISBN-13: 1461410533
DOWNLOAD EBOOKPower Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Download or read book Power Electronic Packaging written by Yong Liu and published by Springer Science & Business Media. This book was released on 2012-02-15 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Download or read book Advances in electronic circuit packaging ; 2 written by and published by . This book was released on 1961 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
