Die-stacking Architecture

Die-stacking Architecture

Author: Yuan Xie

Publisher: Springer Nature

Published: 2022-05-31

Total Pages: 113

ISBN-13: 3031017471

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The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.


Book Synopsis Die-stacking Architecture by : Yuan Xie

Download or read book Die-stacking Architecture written by Yuan Xie and published by Springer Nature. This book was released on 2022-05-31 with total page 113 pages. Available in PDF, EPUB and Kindle. Book excerpt: The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.

Progress in VLSI Design and Test

Progress in VLSI Design and Test

Author: Hafizur Rahaman

Publisher: Springer

Published: 2012-06-26

Total Pages: 427

ISBN-13: 3642314945

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This book constitutes the refereed proceedings of the 16th International Symposium on VSLI Design and Test, VDAT 2012, held in Shibpur, India, in July 2012. The 30 revised regular papers presented together with 10 short papers and 13 poster sessions were carefully selected from 135 submissions. The papers are organized in topical sections on VLSI design, design and modeling of digital circuits and systems, testing and verification, design for testability, testing memories and regular logic arrays, embedded systems: hardware/software co-design and verification, emerging technology: nanoscale computing and nanotechnology.


Book Synopsis Progress in VLSI Design and Test by : Hafizur Rahaman

Download or read book Progress in VLSI Design and Test written by Hafizur Rahaman and published by Springer. This book was released on 2012-06-26 with total page 427 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 16th International Symposium on VSLI Design and Test, VDAT 2012, held in Shibpur, India, in July 2012. The 30 revised regular papers presented together with 10 short papers and 13 poster sessions were carefully selected from 135 submissions. The papers are organized in topical sections on VLSI design, design and modeling of digital circuits and systems, testing and verification, design for testability, testing memories and regular logic arrays, embedded systems: hardware/software co-design and verification, emerging technology: nanoscale computing and nanotechnology.

Three-Dimensional Design Methodologies for Tree-based FPGA Architecture

Three-Dimensional Design Methodologies for Tree-based FPGA Architecture

Author: Vinod Pangracious

Publisher: Springer

Published: 2015-06-25

Total Pages: 226

ISBN-13: 3319191748

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This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.


Book Synopsis Three-Dimensional Design Methodologies for Tree-based FPGA Architecture by : Vinod Pangracious

Download or read book Three-Dimensional Design Methodologies for Tree-based FPGA Architecture written by Vinod Pangracious and published by Springer. This book was released on 2015-06-25 with total page 226 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.

Handbook of 3D Integration, Volume 4

Handbook of 3D Integration, Volume 4

Author: Paul D. Franzon

Publisher: John Wiley & Sons

Published: 2019-05-06

Total Pages: 488

ISBN-13: 3527338551

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This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.


Book Synopsis Handbook of 3D Integration, Volume 4 by : Paul D. Franzon

Download or read book Handbook of 3D Integration, Volume 4 written by Paul D. Franzon and published by John Wiley & Sons. This book was released on 2019-05-06 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

3D Integration in VLSI Circuits

3D Integration in VLSI Circuits

Author: Katsuyuki Sakuma

Publisher: CRC Press

Published: 2018-04-17

Total Pages: 219

ISBN-13: 1351779826

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Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.


Book Synopsis 3D Integration in VLSI Circuits by : Katsuyuki Sakuma

Download or read book 3D Integration in VLSI Circuits written by Katsuyuki Sakuma and published by CRC Press. This book was released on 2018-04-17 with total page 219 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.

Multi-Core Cache Hierarchies

Multi-Core Cache Hierarchies

Author: Rajeev Balasubramonian

Publisher: Morgan & Claypool Publishers

Published: 2011

Total Pages: 137

ISBN-13: 9781598297539

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A key determinant of overall system performance and power dissipation is the cache hierarchy since access to off-chip memory consumes many more cycles and energy than on-chip accesses. In addition, multi-core processors are expected to place ever higher bandwidth demands on the memory system. All these issues make it important to avoid off-chip memory access by improving the efficiency of the on-chip cache. Future multi-core processors will have many large cache banks connected by a network and shared by many cores. Hence, many important problems must be solved: cache resources must be allocated across many cores, data must be placed in cache banks that are near the accessing core, and the most important data must be identified for retention. Finally, difficulties in scaling existing technologies require adapting to and exploiting new technology constraints.The book attempts a synthesis of recent cache research that has focused on innovations for multi-core processors. It is an excellent starting point for early-stage graduate students, researchers, and practitioners who wish to understand the landscape of recent cache research.The book is suitable as a reference for advanced computer architecture classes as well as for experienced researchers and VLSI engineers.Table of Contents: Basic Elements of Large Cache Design / Organizing Data in CMP Last Level Caches / Policies Impacting Cache Hit Rates / Interconnection Networks within Large Caches / Technology / Concluding Remarks


Book Synopsis Multi-Core Cache Hierarchies by : Rajeev Balasubramonian

Download or read book Multi-Core Cache Hierarchies written by Rajeev Balasubramonian and published by Morgan & Claypool Publishers. This book was released on 2011 with total page 137 pages. Available in PDF, EPUB and Kindle. Book excerpt: A key determinant of overall system performance and power dissipation is the cache hierarchy since access to off-chip memory consumes many more cycles and energy than on-chip accesses. In addition, multi-core processors are expected to place ever higher bandwidth demands on the memory system. All these issues make it important to avoid off-chip memory access by improving the efficiency of the on-chip cache. Future multi-core processors will have many large cache banks connected by a network and shared by many cores. Hence, many important problems must be solved: cache resources must be allocated across many cores, data must be placed in cache banks that are near the accessing core, and the most important data must be identified for retention. Finally, difficulties in scaling existing technologies require adapting to and exploiting new technology constraints.The book attempts a synthesis of recent cache research that has focused on innovations for multi-core processors. It is an excellent starting point for early-stage graduate students, researchers, and practitioners who wish to understand the landscape of recent cache research.The book is suitable as a reference for advanced computer architecture classes as well as for experienced researchers and VLSI engineers.Table of Contents: Basic Elements of Large Cache Design / Organizing Data in CMP Last Level Caches / Policies Impacting Cache Hit Rates / Interconnection Networks within Large Caches / Technology / Concluding Remarks

Computer Performance Evaluation and Benchmarking

Computer Performance Evaluation and Benchmarking

Author: David Kaeli

Publisher: Springer

Published: 2009-01-20

Total Pages: 153

ISBN-13: 3540937994

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This book constitutes the proceedings of the SPEC Benchmark Workshop 2009 held in Austin, Texas, USA on January 25th, 2009. The 9 papers presented were carefully selected and reviewed for inclusion in the book. The result is a collection of high-quality papers discussing current issues in the area of benchmarking research and technology. The topics covered are: benchmark suites, CPU benchmarking, power/thermal benchmarking, and modeling and sampling techniques.


Book Synopsis Computer Performance Evaluation and Benchmarking by : David Kaeli

Download or read book Computer Performance Evaluation and Benchmarking written by David Kaeli and published by Springer. This book was released on 2009-01-20 with total page 153 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the proceedings of the SPEC Benchmark Workshop 2009 held in Austin, Texas, USA on January 25th, 2009. The 9 papers presented were carefully selected and reviewed for inclusion in the book. The result is a collection of high-quality papers discussing current issues in the area of benchmarking research and technology. The topics covered are: benchmark suites, CPU benchmarking, power/thermal benchmarking, and modeling and sampling techniques.

Architecture of Computing Systems – ARCS 2015

Architecture of Computing Systems – ARCS 2015

Author: Luís Miguel Pinho Pinho

Publisher: Springer

Published: 2015-03-10

Total Pages: 249

ISBN-13: 3319160869

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This book constitutes the proceedings of the 28th International Conference on Architecture of Computing Systems, ARCS 2015, held in Porto, Portugal, in March 2015. The 19 papers presented together with three invited papers were carefully reviewed and selected from 45 submissions. The papers are organized in six sessions covering the topics: hardware, design, applications, trust and privacy, real-time issues and a best papers session.


Book Synopsis Architecture of Computing Systems – ARCS 2015 by : Luís Miguel Pinho Pinho

Download or read book Architecture of Computing Systems – ARCS 2015 written by Luís Miguel Pinho Pinho and published by Springer. This book was released on 2015-03-10 with total page 249 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the proceedings of the 28th International Conference on Architecture of Computing Systems, ARCS 2015, held in Porto, Portugal, in March 2015. The 19 papers presented together with three invited papers were carefully reviewed and selected from 45 submissions. The papers are organized in six sessions covering the topics: hardware, design, applications, trust and privacy, real-time issues and a best papers session.

Computer Engineering and Technology

Computer Engineering and Technology

Author: Weixia Xu

Publisher: Springer

Published: 2016-01-13

Total Pages: 197

ISBN-13: 3662492830

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This book constitutes the refereed proceedings of the 19th CCF Conference on Computer Engineering and Technology, NCCET 2015, held in Hefei, China, in October 2015. The 18 papers presented were carefully reviewed and selected from 158 submissions. They are organized in topical sections on processor architecture; application specific processors; computer application and software optimization; technology on the horizon.


Book Synopsis Computer Engineering and Technology by : Weixia Xu

Download or read book Computer Engineering and Technology written by Weixia Xu and published by Springer. This book was released on 2016-01-13 with total page 197 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 19th CCF Conference on Computer Engineering and Technology, NCCET 2015, held in Hefei, China, in October 2015. The 18 papers presented were carefully reviewed and selected from 158 submissions. They are organized in topical sections on processor architecture; application specific processors; computer application and software optimization; technology on the horizon.

Architecture of Computing Systems -- ARCS 2014

Architecture of Computing Systems -- ARCS 2014

Author: Erik Maehle

Publisher: Springer

Published: 2014-02-17

Total Pages: 245

ISBN-13: 3319048910

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This book constitutes the proceedings of the 27th International Conference on Architecture of Computing Systems, ARCS 2014, held in Lübeck, Germany, in February 2014. The 20 papers presented in this volume were carefully reviewed and selected from 44 submissions. They are organized in topical sections named: parallelization: applications and methods; self-organization and trust; system design; system design and sensor systems; and virtualization: I/O, memory, cloud; dependability: safety, security, and reliability aspects.


Book Synopsis Architecture of Computing Systems -- ARCS 2014 by : Erik Maehle

Download or read book Architecture of Computing Systems -- ARCS 2014 written by Erik Maehle and published by Springer. This book was released on 2014-02-17 with total page 245 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the proceedings of the 27th International Conference on Architecture of Computing Systems, ARCS 2014, held in Lübeck, Germany, in February 2014. The 20 papers presented in this volume were carefully reviewed and selected from 44 submissions. They are organized in topical sections named: parallelization: applications and methods; self-organization and trust; system design; system design and sensor systems; and virtualization: I/O, memory, cloud; dependability: safety, security, and reliability aspects.