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Electronic Packaging of High Speed Circuitry

Author: Stephen G. Konsowski

Publisher: McGraw-Hill Professional Publishing

Published: 1997

Total Pages: 488

ISBN-13:

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A comprehensive guide to the packaging of high speed circuits for today's advanced electronic products. This is a unique and expert guide to the design and packaging of the high-frequency circuitry crucial to the performance of today's advanced electronic products, such as Pentium chips, HDTV, and mobile communications. Written by two of the leading innovators in the field, this book fully explains integrated design approaches that will enable you to take advantage of all the latest advances in electronic devices, circuit design, materials, and circuit packaging. You'll read about approaches that include basic signal transmission theory, digital circuit design, and how these are integrated with the packaging and interconnection characteristics. There is detailed coverage of signal behavior in both high speed digital circuits, as well as crucial aspects of materials selection and manufacturing. This state-of-the-art resource also provides you with practical design guidelines--plus information on the major issues of design verification and perfomance evaluation.

Book Synopsis Electronic Packaging of High Speed Circuitry by : Stephen G. Konsowski

Download or read book Electronic Packaging of High Speed Circuitry written by Stephen G. Konsowski and published by McGraw-Hill Professional Publishing. This book was released on 1997 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to the packaging of high speed circuits for today's advanced electronic products. This is a unique and expert guide to the design and packaging of the high-frequency circuitry crucial to the performance of today's advanced electronic products, such as Pentium chips, HDTV, and mobile communications. Written by two of the leading innovators in the field, this book fully explains integrated design approaches that will enable you to take advantage of all the latest advances in electronic devices, circuit design, materials, and circuit packaging. You'll read about approaches that include basic signal transmission theory, digital circuit design, and how these are integrated with the packaging and interconnection characteristics. There is detailed coverage of signal behavior in both high speed digital circuits, as well as crucial aspects of materials selection and manufacturing. This state-of-the-art resource also provides you with practical design guidelines--plus information on the major issues of design verification and perfomance evaluation.

High-Speed Electronics and Optoelectronics

Author: Sheila Prasad

Publisher: Cambridge University Press

Published: 2009-06-18

Total Pages: 441

ISBN-13: 0521862833

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This authoritative account of electronic and optoelectronic devices covers the fundamental principles of operation, and, uniquely, their circuit applications too.

Book Synopsis High-Speed Electronics and Optoelectronics by : Sheila Prasad

Download or read book High-Speed Electronics and Optoelectronics written by Sheila Prasad and published by Cambridge University Press. This book was released on 2009-06-18 with total page 441 pages. Available in PDF, EPUB and Kindle. Book excerpt: This authoritative account of electronic and optoelectronic devices covers the fundamental principles of operation, and, uniquely, their circuit applications too.

High-Frequency Characterization of Electronic Packaging

Author: Luc Martens

Publisher: Springer Science & Business Media

Published: 2013-11-27

Total Pages: 169

ISBN-13: 1461556236

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High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.

Book Synopsis High-Frequency Characterization of Electronic Packaging by : Luc Martens

Download or read book High-Frequency Characterization of Electronic Packaging written by Luc Martens and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 169 pages. Available in PDF, EPUB and Kindle. Book excerpt: High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.

Advances in Electronic Circuit Packaging

Author: Gerald A. Walker

Publisher: Springer

Published: 2013-12-11

Total Pages: 342

ISBN-13: 1489973117

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Book Synopsis Advances in Electronic Circuit Packaging by : Gerald A. Walker

Download or read book Advances in Electronic Circuit Packaging written by Gerald A. Walker and published by Springer. This book was released on 2013-12-11 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Author: Xing-Chang Wei

Publisher: CRC Press

Published: 2017-09-19

Total Pages: 266

ISBN-13: 1315305852

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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.

Book Synopsis Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging by : Xing-Chang Wei

Download or read book Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging written by Xing-Chang Wei and published by CRC Press. This book was released on 2017-09-19 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.

Electronic Packaging of High Speed Circuitry

Author: Stephen G. Konsowski

Publisher: McGraw Hill Professional

Published: 1997

Total Pages: 488

ISBN-13: 9780070359703

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Book Synopsis Electronic Packaging of High Speed Circuitry by : Stephen G. Konsowski

Download or read book Electronic Packaging of High Speed Circuitry written by Stephen G. Konsowski and published by McGraw Hill Professional. This book was released on 1997 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to the packaging of high speed circuits for today's advanced electronic products. This is a unique and expert guide to the design and packaging of the high-frequency circuitry crucial to the performance of today's advanced electronic products, such as Pentium chips, HDTV, and mobile communications. Written by two of the leading innovators in the field, this book fully explains integrated design approaches that will enable you to take advantage of all the latest advances in electronic devices, circuit design, materials, and circuit packaging. You'll read about approaches that include basic signal transmission theory, digital circuit design, and how these are integrated with the packaging and interconnection characteristics. There is detailed coverage of signal behavior in both high speed digital circuits, as well as crucial aspects of materials selection and manufacturing. This state-of-the-art resource also provides you with practical design guidelines--plus information on the major issues of design verification and perfomance evaluation.

Electronic Packaging for High Reliability, Low Cost Electronics

Author: R.R. Tummala

Publisher: Springer

Published: 2010-12-03

Total Pages: 0

ISBN-13: 9789048150854

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Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.

Book Synopsis Electronic Packaging for High Reliability, Low Cost Electronics by : R.R. Tummala

Download or read book Electronic Packaging for High Reliability, Low Cost Electronics written by R.R. Tummala and published by Springer. This book was released on 2010-12-03 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.

The Electronic Packaging Handbook

Author: Glenn R. Blackwell

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 648

ISBN-13: 9781420049848

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The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Book Synopsis The Electronic Packaging Handbook by : Glenn R. Blackwell

Download or read book The Electronic Packaging Handbook written by Glenn R. Blackwell and published by CRC Press. This book was released on 2017-12-19 with total page 648 pages. Available in PDF, EPUB and Kindle. Book excerpt: The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Author: Xing-Chang Wei

Publisher: CRC Press

Published: 2017-09-19

Total Pages: 322

ISBN-13: 1315305860

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Book Synopsis Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging by : Xing-Chang Wei

Download or read book Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging written by Xing-Chang Wei and published by CRC Press. This book was released on 2017-09-19 with total page 322 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.

Electrical Performance of Electronic Packaging

Author:

Publisher:

Published: 2004

Total Pages: 394

ISBN-13:

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Book Synopsis Electrical Performance of Electronic Packaging by :

Download or read book Electrical Performance of Electronic Packaging written by and published by . This book was released on 2004 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt: