Electronic Thin-Film Reliability

Electronic Thin-Film Reliability

Author: King-Ning Tu

Publisher: Cambridge University Press

Published: 2010-11-25

Total Pages: 412

ISBN-13: 9780521516136

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Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.


Book Synopsis Electronic Thin-Film Reliability by : King-Ning Tu

Download or read book Electronic Thin-Film Reliability written by King-Ning Tu and published by Cambridge University Press. This book was released on 2010-11-25 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.

Electronic Thin-Film Reliability

Electronic Thin-Film Reliability

Author: King-Ning Tu

Publisher: Cambridge University Press

Published: 2010-11-25

Total Pages: 413

ISBN-13: 1139492705

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Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.


Book Synopsis Electronic Thin-Film Reliability by : King-Ning Tu

Download or read book Electronic Thin-Film Reliability written by King-Ning Tu and published by Cambridge University Press. This book was released on 2010-11-25 with total page 413 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.

The Materials Science of Thin Films

The Materials Science of Thin Films

Author: Milton Ohring

Publisher: Academic Press

Published: 1992

Total Pages: 744

ISBN-13: 9780125249904

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Prepared as a textbook complete with problems after each chapter, specifically intended for classroom use in universities.


Book Synopsis The Materials Science of Thin Films by : Milton Ohring

Download or read book The Materials Science of Thin Films written by Milton Ohring and published by Academic Press. This book was released on 1992 with total page 744 pages. Available in PDF, EPUB and Kindle. Book excerpt: Prepared as a textbook complete with problems after each chapter, specifically intended for classroom use in universities.

Materials Science of Thin Films

Materials Science of Thin Films

Author: Milton Ohring

Publisher: Academic Press

Published: 2002

Total Pages: 817

ISBN-13: 0125249756

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This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.


Book Synopsis Materials Science of Thin Films by : Milton Ohring

Download or read book Materials Science of Thin Films written by Milton Ohring and published by Academic Press. This book was released on 2002 with total page 817 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.

Electromigration in Thin Films and Electronic Devices

Electromigration in Thin Films and Electronic Devices

Author: Choong-Un Kim

Publisher: Elsevier

Published: 2011-08-28

Total Pages: 353

ISBN-13: 0857093754

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Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area.Part one consists of three introductory chapters, covering modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure. Finally, part three covers electromigration in solder, with chapters discussing topics such as electromigration-induced microstructural evolution and electromigration in flip-chip solder joints.With its distinguished editor and international team of contributors, Electromigration in thin films and electronic devices is an essential reference for materials scientists and engineers in the microelectronics, packaging and interconnects industries, as well as all those with an academic research interest in the field. Provides up-to-date coverage of the continued development of advanced copper interconnects for integrated circuits Comprehensively reviews modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation, and x-ray microbeam studies of electromigration Deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure


Book Synopsis Electromigration in Thin Films and Electronic Devices by : Choong-Un Kim

Download or read book Electromigration in Thin Films and Electronic Devices written by Choong-Un Kim and published by Elsevier. This book was released on 2011-08-28 with total page 353 pages. Available in PDF, EPUB and Kindle. Book excerpt: Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area.Part one consists of three introductory chapters, covering modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure. Finally, part three covers electromigration in solder, with chapters discussing topics such as electromigration-induced microstructural evolution and electromigration in flip-chip solder joints.With its distinguished editor and international team of contributors, Electromigration in thin films and electronic devices is an essential reference for materials scientists and engineers in the microelectronics, packaging and interconnects industries, as well as all those with an academic research interest in the field. Provides up-to-date coverage of the continued development of advanced copper interconnects for integrated circuits Comprehensively reviews modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation, and x-ray microbeam studies of electromigration Deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure

Materials Science of Thin Films

Materials Science of Thin Films

Author: Milton Ohring

Publisher: Academic Press

Published: 2001-10

Total Pages: 794

ISBN-13: 9781493301720

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This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.


Book Synopsis Materials Science of Thin Films by : Milton Ohring

Download or read book Materials Science of Thin Films written by Milton Ohring and published by Academic Press. This book was released on 2001-10 with total page 794 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.

Reliability and Failure of Electronic Materials and Devices

Reliability and Failure of Electronic Materials and Devices

Author: Milton Ohring

Publisher: Academic Press

Published: 2014-10-14

Total Pages: 759

ISBN-13: 0080575528

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Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites


Book Synopsis Reliability and Failure of Electronic Materials and Devices by : Milton Ohring

Download or read book Reliability and Failure of Electronic Materials and Devices written by Milton Ohring and published by Academic Press. This book was released on 2014-10-14 with total page 759 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites

Thin Film Materials, Processes, and Reliability

Thin Film Materials, Processes, and Reliability

Author: Electrochemical Society. Meeting

Publisher: The Electrochemical Society

Published: 2001

Total Pages: 232

ISBN-13: 9781566773577

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Book Synopsis Thin Film Materials, Processes, and Reliability by : Electrochemical Society. Meeting

Download or read book Thin Film Materials, Processes, and Reliability written by Electrochemical Society. Meeting and published by The Electrochemical Society. This book was released on 2001 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Electronic Thin Film Science

Electronic Thin Film Science

Author: King-Ning Tu

Publisher: Prentice Hall

Published: 1992

Total Pages: 456

ISBN-13:

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Book Synopsis Electronic Thin Film Science by : King-Ning Tu

Download or read book Electronic Thin Film Science written by King-Ning Tu and published by Prentice Hall. This book was released on 1992 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Principles of Vapor Deposition of Thin Films

Principles of Vapor Deposition of Thin Films

Author: Professor K.S. K.S Sree Harsha

Publisher: Elsevier

Published: 2005-12-16

Total Pages: 1176

ISBN-13: 9780080480312

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The goal of producing devices that are smaller, faster, more functional, reproducible, reliable and economical has given thin film processing a unique role in technology. Principles of Vapor Deposition of Thin Films brings in to one place a diverse amount of scientific background that is considered essential to become knowledgeable in thin film depostition techniques. Its ultimate goal as a reference is to provide the foundation upon which thin film science and technological innovation are possible. * Offers detailed derivation of important formulae. * Thoroughly covers the basic principles of materials science that are important to any thin film preparation. * Careful attention to terminologies, concepts and definitions, as well as abundance of illustrations offer clear support for the text.


Book Synopsis Principles of Vapor Deposition of Thin Films by : Professor K.S. K.S Sree Harsha

Download or read book Principles of Vapor Deposition of Thin Films written by Professor K.S. K.S Sree Harsha and published by Elsevier. This book was released on 2005-12-16 with total page 1176 pages. Available in PDF, EPUB and Kindle. Book excerpt: The goal of producing devices that are smaller, faster, more functional, reproducible, reliable and economical has given thin film processing a unique role in technology. Principles of Vapor Deposition of Thin Films brings in to one place a diverse amount of scientific background that is considered essential to become knowledgeable in thin film depostition techniques. Its ultimate goal as a reference is to provide the foundation upon which thin film science and technological innovation are possible. * Offers detailed derivation of important formulae. * Thoroughly covers the basic principles of materials science that are important to any thin film preparation. * Careful attention to terminologies, concepts and definitions, as well as abundance of illustrations offer clear support for the text.