Foldable Flex and Thinned Silicon Multichip Packaging Technology

Foldable Flex and Thinned Silicon Multichip Packaging Technology

Author: John W. Balde

Publisher: Springer Science & Business Media

Published: 2013-11-27

Total Pages: 357

ISBN-13: 1461502314

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Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.


Book Synopsis Foldable Flex and Thinned Silicon Multichip Packaging Technology by : John W. Balde

Download or read book Foldable Flex and Thinned Silicon Multichip Packaging Technology written by John W. Balde and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 357 pages. Available in PDF, EPUB and Kindle. Book excerpt: Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

Silicon

Silicon

Author: Paul Siffert

Publisher: Springer Science & Business Media

Published: 2013-03-09

Total Pages: 552

ISBN-13: 3662098970

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With topics ranging from epitaxy through lattice defects and doping to quantum computation, this book provides a personalized survey of the development and use of silicon, the basis for the revolutionary changes in our lives sometimes called "The Silicon Age." Beginning with the very first developments more than 50 years ago, this reports on all aspects of silicon and silicon technology up to its use in exciting new technologies, including a glance at possible future developments.


Book Synopsis Silicon by : Paul Siffert

Download or read book Silicon written by Paul Siffert and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: With topics ranging from epitaxy through lattice defects and doping to quantum computation, this book provides a personalized survey of the development and use of silicon, the basis for the revolutionary changes in our lives sometimes called "The Silicon Age." Beginning with the very first developments more than 50 years ago, this reports on all aspects of silicon and silicon technology up to its use in exciting new technologies, including a glance at possible future developments.

Integrated Circuit Packaging, Assembly and Interconnections

Integrated Circuit Packaging, Assembly and Interconnections

Author: William Greig

Publisher: Springer Science & Business Media

Published: 2007-04-24

Total Pages: 312

ISBN-13: 0387339132

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Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.


Book Synopsis Integrated Circuit Packaging, Assembly and Interconnections by : William Greig

Download or read book Integrated Circuit Packaging, Assembly and Interconnections written by William Greig and published by Springer Science & Business Media. This book was released on 2007-04-24 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.

Optical Interconnects

Optical Interconnects

Author: Ray T. Chen

Publisher: Springer Nature

Published: 2022-05-31

Total Pages: 91

ISBN-13: 3031025539

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This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing.


Book Synopsis Optical Interconnects by : Ray T. Chen

Download or read book Optical Interconnects written by Ray T. Chen and published by Springer Nature. This book was released on 2022-05-31 with total page 91 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing.

Materials for Advanced Packaging

Materials for Advanced Packaging

Author: Daniel Lu

Publisher: Springer Science & Business Media

Published: 2008-12-17

Total Pages: 723

ISBN-13: 0387782192

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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.


Book Synopsis Materials for Advanced Packaging by : Daniel Lu

Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer Science & Business Media. This book was released on 2008-12-17 with total page 723 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Proceedings, 2002 International Conference on Advanced Packaging and Systems

Proceedings, 2002 International Conference on Advanced Packaging and Systems

Author:

Publisher:

Published: 2002

Total Pages: 294

ISBN-13:

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Book Synopsis Proceedings, 2002 International Conference on Advanced Packaging and Systems by :

Download or read book Proceedings, 2002 International Conference on Advanced Packaging and Systems written by and published by . This book was released on 2002 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Proceedings

Proceedings

Author:

Publisher:

Published: 2004

Total Pages: 1220

ISBN-13:

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Book Synopsis Proceedings by :

Download or read book Proceedings written by and published by . This book was released on 2004 with total page 1220 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Proceedings of Technical Papers

Proceedings of Technical Papers

Author:

Publisher:

Published: 2005

Total Pages: 156

ISBN-13:

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Book Synopsis Proceedings of Technical Papers by :

Download or read book Proceedings of Technical Papers written by and published by . This book was released on 2005 with total page 156 pages. Available in PDF, EPUB and Kindle. Book excerpt:

The British National Bibliography

The British National Bibliography

Author: Arthur James Wells

Publisher:

Published: 2003

Total Pages: 1926

ISBN-13:

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Book Synopsis The British National Bibliography by : Arthur James Wells

Download or read book The British National Bibliography written by Arthur James Wells and published by . This book was released on 2003 with total page 1926 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Journal of Electronic Packaging

Journal of Electronic Packaging

Author:

Publisher:

Published: 2004

Total Pages: 248

ISBN-13:

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Book Synopsis Journal of Electronic Packaging by :

Download or read book Journal of Electronic Packaging written by and published by . This book was released on 2004 with total page 248 pages. Available in PDF, EPUB and Kindle. Book excerpt: