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Today's commercial, medical and military electronics are becoming smaller and smaller. At the same time these devices demand more power and currently this power requirement is met almost exclusively by battery power. This book includes coverage of ceramic hybrid separators for micro fuel cells and miniature fuel cells built with LTCC technology. It also covers novel fuel cells and discusses the application of fuel cell in microelectronics.
Book Synopsis Fuel Cell Electronics Packaging by : Ken Kuang
Download or read book Fuel Cell Electronics Packaging written by Ken Kuang and published by Springer Science & Business Media. This book was released on 2007-08-26 with total page 253 pages. Available in PDF, EPUB and Kindle. Book excerpt: Today's commercial, medical and military electronics are becoming smaller and smaller. At the same time these devices demand more power and currently this power requirement is met almost exclusively by battery power. This book includes coverage of ceramic hybrid separators for micro fuel cells and miniature fuel cells built with LTCC technology. It also covers novel fuel cells and discusses the application of fuel cell in microelectronics.
A MEMS-based fuel cell package and method thereof is disclosed. The fuel cell package comprises seven layers: (1) a sub-package fuel reservoir interface layer, (2) an anode manifold support layer, (3) a fuel/anode manifold and resistive heater layer, (4) a Thick Film Microporous Flow Host Structure layer containing a fuel cell, (5) an air manifold layer, (6) a cathode manifold support structure layer, and (7) a cap. Fuel cell packages with more than one fuel cell are formed by positioning stacks of these layers in series and/or parallel. The fuel cell package materials such as a molded plastic or a ceramic green tape material can be patterned, aligned and stacked to form three dimensional microfluidic channels that provide electrical feedthroughs from various layers which are bonded together and mechanically support a MEMS-based miniature fuel cell. The package incorporates resistive heating elements to control the temperature of the fuel cell stack. The package is fired to form a bond between the layers and one or more microporous flow host structures containing fuel cells are inserted within the Thick Film Microporous Flow Host Structure layer of the package.
Book Synopsis Method of Forming a Package for MEMS-based Fuel Cell by :
Download or read book Method of Forming a Package for MEMS-based Fuel Cell written by and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: A MEMS-based fuel cell package and method thereof is disclosed. The fuel cell package comprises seven layers: (1) a sub-package fuel reservoir interface layer, (2) an anode manifold support layer, (3) a fuel/anode manifold and resistive heater layer, (4) a Thick Film Microporous Flow Host Structure layer containing a fuel cell, (5) an air manifold layer, (6) a cathode manifold support structure layer, and (7) a cap. Fuel cell packages with more than one fuel cell are formed by positioning stacks of these layers in series and/or parallel. The fuel cell package materials such as a molded plastic or a ceramic green tape material can be patterned, aligned and stacked to form three dimensional microfluidic channels that provide electrical feedthroughs from various layers which are bonded together and mechanically support a MEMS-based miniature fuel cell. The package incorporates resistive heating elements to control the temperature of the fuel cell stack. The package is fired to form a bond between the layers and one or more microporous flow host structures containing fuel cells are inserted within the Thick Film Microporous Flow Host Structure layer of the package.
Today's professionals are constantly striving to create sensor technology and systems with lower cost and higher efficiency. Miniaturization and standardization have become critical drivers for cost reduction in the design and development process, giving rise to a new era of smart sensors and actuators. These devices contain more components, but normally provide significant cost savings due to wider applicability and mass production. This first-of-its-kind resource presents methods for cost optimization of smart microsystems to help you select highly cost-efficient implementation variants. Written by leading experts, the book offers detailed coverage of the key topics that you need to understand for your work in the field, such as methods for cost estimation, holistic design optimization, a methodology for a cost-driven design, and applied cost optimization. This practical book focuses on fundamental cost influences rather than absolute numbers, helping you appreciate relative values which reflect the competitive advantage of the various design implementations. Moreover, you find specific recommendations on which cost-reduction methods will be most advantageous in varying situations. This forward-looking volume provides keen insight into the underlying factors which drive the current economics and determine future trends of smart microsystems.
Book Synopsis Cost-driven Design of Smart Microsystems by : Michael Niedermayer
Download or read book Cost-driven Design of Smart Microsystems written by Michael Niedermayer and published by Artech House. This book was released on 2011-12 with total page 243 pages. Available in PDF, EPUB and Kindle. Book excerpt: Today's professionals are constantly striving to create sensor technology and systems with lower cost and higher efficiency. Miniaturization and standardization have become critical drivers for cost reduction in the design and development process, giving rise to a new era of smart sensors and actuators. These devices contain more components, but normally provide significant cost savings due to wider applicability and mass production. This first-of-its-kind resource presents methods for cost optimization of smart microsystems to help you select highly cost-efficient implementation variants. Written by leading experts, the book offers detailed coverage of the key topics that you need to understand for your work in the field, such as methods for cost estimation, holistic design optimization, a methodology for a cost-driven design, and applied cost optimization. This practical book focuses on fundamental cost influences rather than absolute numbers, helping you appreciate relative values which reflect the competitive advantage of the various design implementations. Moreover, you find specific recommendations on which cost-reduction methods will be most advantageous in varying situations. This forward-looking volume provides keen insight into the underlying factors which drive the current economics and determine future trends of smart microsystems.
Book Synopsis Automated Proton Exchange Membrane Fuel Cell Packaging Concepts by : Alexander F. Duggan
Download or read book Automated Proton Exchange Membrane Fuel Cell Packaging Concepts written by Alexander F. Duggan and published by . This book was released on 2005 with total page 47 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis An Inventory of Energy Research by : Oak Ridge National Laboratory
Download or read book An Inventory of Energy Research written by Oak Ridge National Laboratory and published by . This book was released on 1972 with total page 1136 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis An Inventory of Energy Research, Prepared for the Task Force on Energy of the Subcommittee on Science, Research, and Development..., by Oak Ridge National Laboratory with the Support of the National Science Foundation by : United States. Congress. House Science and Astronautics
Download or read book An Inventory of Energy Research, Prepared for the Task Force on Energy of the Subcommittee on Science, Research, and Development..., by Oak Ridge National Laboratory with the Support of the National Science Foundation written by United States. Congress. House Science and Astronautics and published by . This book was released on 1972 with total page 1772 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Explore the potential for nanotechnologies to transform future mobile and Internet communications. Based on a research collaboration between Nokia, Helsinki University of Technology, and the University of Cambridge, here leading researchers review the current state-of-the art and future prospects for: • Novel multifunctional materials, dirt repellent, self-healing surface materials, and lightweight structural materials capable of adapting their shape • Portable energy storage using supercapacitor-battery hybrids based on new materials including carbon nanohorns and porous electrodes, fuel cell technologies, energy harvesting and more efficient solar cells • Electronics and computing advances reaching beyond IC scaling limits, new computing approaches and architectures, embedded intelligence and future memory technologies. • Nanoscale transducers for mechanical, optical and chemical sensing, sensor signal processing, and nanoscale actuation • Nanoelectronics to create ultrafast and adaptive electronics for future radio technologies • Flat panel displays with greater robustness, improved resolution, brightness and contrast, and mechanical flexibility • Manufacturing and innovation processes, plus commercialization of nanotechnologies.
Book Synopsis Nanotechnologies for Future Mobile Devices by : Tapani Ryhänen
Download or read book Nanotechnologies for Future Mobile Devices written by Tapani Ryhänen and published by Cambridge University Press. This book was released on 2010-02-11 with total page 283 pages. Available in PDF, EPUB and Kindle. Book excerpt: Explore the potential for nanotechnologies to transform future mobile and Internet communications. Based on a research collaboration between Nokia, Helsinki University of Technology, and the University of Cambridge, here leading researchers review the current state-of-the art and future prospects for: • Novel multifunctional materials, dirt repellent, self-healing surface materials, and lightweight structural materials capable of adapting their shape • Portable energy storage using supercapacitor-battery hybrids based on new materials including carbon nanohorns and porous electrodes, fuel cell technologies, energy harvesting and more efficient solar cells • Electronics and computing advances reaching beyond IC scaling limits, new computing approaches and architectures, embedded intelligence and future memory technologies. • Nanoscale transducers for mechanical, optical and chemical sensing, sensor signal processing, and nanoscale actuation • Nanoelectronics to create ultrafast and adaptive electronics for future radio technologies • Flat panel displays with greater robustness, improved resolution, brightness and contrast, and mechanical flexibility • Manufacturing and innovation processes, plus commercialization of nanotechnologies.
This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations; Analyzes nanotubes, superhydrophobic self-clean Lotus surfaces; Covers nano chemistry for bio sensor/bio material device packaging. This second edition includes new chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging. Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.
Book Synopsis Nano-Bio- Electronic, Photonic and MEMS Packaging by : C. P.(Ching-Ping) Wong
Download or read book Nano-Bio- Electronic, Photonic and MEMS Packaging written by C. P.(Ching-Ping) Wong and published by Springer Nature. This book was released on 2021-03-17 with total page 582 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations; Analyzes nanotubes, superhydrophobic self-clean Lotus surfaces; Covers nano chemistry for bio sensor/bio material device packaging. This second edition includes new chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging. Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.
Book Synopsis Harsh Environment Electronics by : Ahmed Sharif
Download or read book Harsh Environment Electronics written by Ahmed Sharif and published by John Wiley & Sons. This book was released on 2019-04-09 with total page 505 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.
Reflecting the R&D efforts in the field that have resulted in a plethora of novel applications over the past decade, this handbook gives a comprehensive overview of the tangible benefits of nanotechnology in catalysis. By bridging fundamental research and industrial development, it provides a unique perspective on this scientifically and economically important field. While the first three parts are devoted to preparation and characterization of nanocatalysts, the final three provide in-depth insights into their applications in the fine chemicals industry, the energy industry, and for environmental protection, with expert authors reporting on real-life applications that are on the brink of commercialization. Timely reading for catalytic chemists, materials scientists, chemists in industry, and process engineers.
Book Synopsis Nanotechnology in Catalysis by : Bert Sels
Download or read book Nanotechnology in Catalysis written by Bert Sels and published by John Wiley & Sons. This book was released on 2017-06-20 with total page 1500 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reflecting the R&D efforts in the field that have resulted in a plethora of novel applications over the past decade, this handbook gives a comprehensive overview of the tangible benefits of nanotechnology in catalysis. By bridging fundamental research and industrial development, it provides a unique perspective on this scientifically and economically important field. While the first three parts are devoted to preparation and characterization of nanocatalysts, the final three provide in-depth insights into their applications in the fine chemicals industry, the energy industry, and for environmental protection, with expert authors reporting on real-life applications that are on the brink of commercialization. Timely reading for catalytic chemists, materials scientists, chemists in industry, and process engineers.
