Materials Reliability in Microelectronics II:

Materials Reliability in Microelectronics II:

Author: C. V. Thompson

Publisher: Cambridge University Press

Published: 2014-06-05

Total Pages: 344

ISBN-13: 9781107409682

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The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.


Book Synopsis Materials Reliability in Microelectronics II: by : C. V. Thompson

Download or read book Materials Reliability in Microelectronics II: written by C. V. Thompson and published by Cambridge University Press. This book was released on 2014-06-05 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.


Materials Reliability in Microelectronics II: Volume 265

Materials Reliability in Microelectronics II: Volume 265

Author: C. V. Thompson

Publisher:

Published: 1992-09-30

Total Pages: 352

ISBN-13:

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The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.


Book Synopsis Materials Reliability in Microelectronics II: Volume 265 by : C. V. Thompson

Download or read book Materials Reliability in Microelectronics II: Volume 265 written by C. V. Thompson and published by . This book was released on 1992-09-30 with total page 352 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.


Materials Reliability in Microelectronics

Materials Reliability in Microelectronics

Author:

Publisher:

Published: 1999

Total Pages: 336

ISBN-13:

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Book Synopsis Materials Reliability in Microelectronics by :

Download or read book Materials Reliability in Microelectronics written by and published by . This book was released on 1999 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt:


Materials Reliability in Microelectronics III: Volume 309

Materials Reliability in Microelectronics III: Volume 309

Author: Kenneth P. Rodbell

Publisher:

Published: 1993-08-31

Total Pages: 520

ISBN-13:

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The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.


Book Synopsis Materials Reliability in Microelectronics III: Volume 309 by : Kenneth P. Rodbell

Download or read book Materials Reliability in Microelectronics III: Volume 309 written by Kenneth P. Rodbell and published by . This book was released on 1993-08-31 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.


Electromigration in Metals

Electromigration in Metals

Author: Paul S. Ho

Publisher: Cambridge University Press

Published: 2022-05-12

Total Pages:

ISBN-13: 1009287796

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Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.


Book Synopsis Electromigration in Metals by : Paul S. Ho

Download or read book Electromigration in Metals written by Paul S. Ho and published by Cambridge University Press. This book was released on 2022-05-12 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.


Materials Reliability in Microelectronics V: Volume 391

Materials Reliability in Microelectronics V: Volume 391

Author: Anthony S. Oates

Publisher:

Published: 1995-10-24

Total Pages: 552

ISBN-13:

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This long-standing proceedings series is highly regarded as a premier forum for the discussion of microelectronics reliability issues. In this fifth book, emphasis is on the fundamental understanding of failure phenomena in thin-film materials. Special attention is given to electromigration and mechanical stress effects. The reliability of thin dielectrics and hot carrier degradation of transistors are also featured. Topics include: modeling and simulation of failure mechanisms; reliability issues for submicron IC technologies and packaging; stresses in thin films/lines; gate oxides; barrier layers; electromigration mechanisms; reliability issues for Cu metallizations; electromigration and microstructure; electromigration and stress voiding in circuit interconnects; and resistance measurements of electromigration damage.


Book Synopsis Materials Reliability in Microelectronics V: Volume 391 by : Anthony S. Oates

Download or read book Materials Reliability in Microelectronics V: Volume 391 written by Anthony S. Oates and published by . This book was released on 1995-10-24 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: This long-standing proceedings series is highly regarded as a premier forum for the discussion of microelectronics reliability issues. In this fifth book, emphasis is on the fundamental understanding of failure phenomena in thin-film materials. Special attention is given to electromigration and mechanical stress effects. The reliability of thin dielectrics and hot carrier degradation of transistors are also featured. Topics include: modeling and simulation of failure mechanisms; reliability issues for submicron IC technologies and packaging; stresses in thin films/lines; gate oxides; barrier layers; electromigration mechanisms; reliability issues for Cu metallizations; electromigration and microstructure; electromigration and stress voiding in circuit interconnects; and resistance measurements of electromigration damage.


Chemical Perspectives of Microelectronic Materials

Chemical Perspectives of Microelectronic Materials

Author:

Publisher:

Published: 1992

Total Pages: 762

ISBN-13:

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Book Synopsis Chemical Perspectives of Microelectronic Materials by :

Download or read book Chemical Perspectives of Microelectronic Materials written by and published by . This book was released on 1992 with total page 762 pages. Available in PDF, EPUB and Kindle. Book excerpt:


Hierachically Structured Materials: Volume 255

Hierachically Structured Materials: Volume 255

Author: Ilhan A. Aksay

Publisher:

Published: 1992-09-22

Total Pages: 472

ISBN-13:

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The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.


Book Synopsis Hierachically Structured Materials: Volume 255 by : Ilhan A. Aksay

Download or read book Hierachically Structured Materials: Volume 255 written by Ilhan A. Aksay and published by . This book was released on 1992-09-22 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.


Intermetallic Matrix Composites II: Volume 273

Intermetallic Matrix Composites II: Volume 273

Author: D. B. Miracle

Publisher: Mrs Proceedings

Published: 1992-11-06

Total Pages: 464

ISBN-13:

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The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.


Book Synopsis Intermetallic Matrix Composites II: Volume 273 by : D. B. Miracle

Download or read book Intermetallic Matrix Composites II: Volume 273 written by D. B. Miracle and published by Mrs Proceedings. This book was released on 1992-11-06 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.


Materials Theory and Modelling: Volume 291

Materials Theory and Modelling: Volume 291

Author: Jeremy Broughton

Publisher:

Published: 1993-05-07

Total Pages: 696

ISBN-13:

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The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.


Book Synopsis Materials Theory and Modelling: Volume 291 by : Jeremy Broughton

Download or read book Materials Theory and Modelling: Volume 291 written by Jeremy Broughton and published by . This book was released on 1993-05-07 with total page 696 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.