Mechanical Aspects in Electronics Systems Design

Mechanical Aspects in Electronics Systems Design

Author: Vinay Divakar

Publisher:

Published: 2014-08-27

Total Pages: 36

ISBN-13: 9783656730903

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Scientific Study from the year 2013 in the subject Engineering - Mechanical Engineering, grade: B+, course: Electronics Systems Design, language: English, abstract: In chapter 1, the present research carried on the mature laser technology i.e. GaAs, in order to improve its efficiency. The packaging principle used for receivers can be applied for the packaging of the laser driver circuit and the laser source in a single module. The concept of FRACAS (Failure Reporting, Analysis and Corrective Action System) has been described and failure analysis technique for Electrical overstress (EOS) is described. An industrial approach to calculating the reliability of a system with some known data is described. Some challenges with respect to packaging has been discussed in detail and some methods to overcome challenges such as lattice mismatch has been described. Every electronic components or electronic systems have certain specifications based on which it is developed and all components have datasheets of their own. The datasheets consists complete details related to the product such as product design specifications, packaging type, power ratings, dimensions etc. Any components can be selected for a particular application by referring their datasheets. In chapter 2, a datasheet for a DC power supply has been developed covering most of the important details that may be needed for designing and modeling using software tools. The schematic of the power supply is developed and practical tests are performed on the power supply, which has been described in details with the test results. The power supply has four interfaces and the functionality and usability of these interfaces has been shown and described in detail. Before the large scale manufacturing and production of any product, it is necessary to conduct two basic tests i.e. Thermal analysis and vibration tests for any given product. These tests help us to get an insight to the reliability of the product. In chapter 3, the


Book Synopsis Mechanical Aspects in Electronics Systems Design by : Vinay Divakar

Download or read book Mechanical Aspects in Electronics Systems Design written by Vinay Divakar and published by . This book was released on 2014-08-27 with total page 36 pages. Available in PDF, EPUB and Kindle. Book excerpt: Scientific Study from the year 2013 in the subject Engineering - Mechanical Engineering, grade: B+, course: Electronics Systems Design, language: English, abstract: In chapter 1, the present research carried on the mature laser technology i.e. GaAs, in order to improve its efficiency. The packaging principle used for receivers can be applied for the packaging of the laser driver circuit and the laser source in a single module. The concept of FRACAS (Failure Reporting, Analysis and Corrective Action System) has been described and failure analysis technique for Electrical overstress (EOS) is described. An industrial approach to calculating the reliability of a system with some known data is described. Some challenges with respect to packaging has been discussed in detail and some methods to overcome challenges such as lattice mismatch has been described. Every electronic components or electronic systems have certain specifications based on which it is developed and all components have datasheets of their own. The datasheets consists complete details related to the product such as product design specifications, packaging type, power ratings, dimensions etc. Any components can be selected for a particular application by referring their datasheets. In chapter 2, a datasheet for a DC power supply has been developed covering most of the important details that may be needed for designing and modeling using software tools. The schematic of the power supply is developed and practical tests are performed on the power supply, which has been described in details with the test results. The power supply has four interfaces and the functionality and usability of these interfaces has been shown and described in detail. Before the large scale manufacturing and production of any product, it is necessary to conduct two basic tests i.e. Thermal analysis and vibration tests for any given product. These tests help us to get an insight to the reliability of the product. In chapter 3, the

Mechanical Aspects in Electronics Systems Design

Mechanical Aspects in Electronics Systems Design

Author: Vinay Divakar

Publisher: GRIN Verlag

Published: 2014-08-27

Total Pages: 37

ISBN-13: 365673089X

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Scientific Study from the year 2013 in the subject Engineering - Mechanical Engineering, grade: B+, , course: Electronics Systems Design, language: English, abstract: In chapter 1, the present research carried on the mature laser technology i.e. GaAs, in order to improve its efficiency. The packaging principle used for receivers can be applied for the packaging of the laser driver circuit and the laser source in a single module. The concept of FRACAS (Failure Reporting, Analysis and Corrective Action System) has been described and failure analysis technique for Electrical overstress (EOS) is described. An industrial approach to calculating the reliability of a system with some known data is described. Some challenges with respect to packaging has been discussed in detail and some methods to overcome challenges such as lattice mismatch has been described. Every electronic components or electronic systems have certain specifications based on which it is developed and all components have datasheets of their own. The datasheets consists complete details related to the product such as product design specifications, packaging type, power ratings, dimensions etc. Any components can be selected for a particular application by referring their datasheets. In chapter 2, a datasheet for a DC power supply has been developed covering most of the important details that may be needed for designing and modeling using software tools. The schematic of the power supply is developed and practical tests are performed on the power supply, which has been described in details with the test results. The power supply has four interfaces and the functionality and usability of these interfaces has been shown and described in detail. Before the large scale manufacturing and production of any product, it is necessary to conduct two basic tests i.e. Thermal analysis and vibration tests for any given product. These tests help us to get an insight to the reliability of the product. In chapter 3, the power supply is modeled using the software tool ICEPACK v13, using which thermal analysis is performed on the critical components and the temperature variation curves along with the simulation results has been discussed. The method of casing used for the power supply for modeling and the types of conventions i.e. natural and forced convention systems has been compared and discussed. An experimental set up used for performing vibration testing on the power supply has been demonstrated and described in detail.


Book Synopsis Mechanical Aspects in Electronics Systems Design by : Vinay Divakar

Download or read book Mechanical Aspects in Electronics Systems Design written by Vinay Divakar and published by GRIN Verlag. This book was released on 2014-08-27 with total page 37 pages. Available in PDF, EPUB and Kindle. Book excerpt: Scientific Study from the year 2013 in the subject Engineering - Mechanical Engineering, grade: B+, , course: Electronics Systems Design, language: English, abstract: In chapter 1, the present research carried on the mature laser technology i.e. GaAs, in order to improve its efficiency. The packaging principle used for receivers can be applied for the packaging of the laser driver circuit and the laser source in a single module. The concept of FRACAS (Failure Reporting, Analysis and Corrective Action System) has been described and failure analysis technique for Electrical overstress (EOS) is described. An industrial approach to calculating the reliability of a system with some known data is described. Some challenges with respect to packaging has been discussed in detail and some methods to overcome challenges such as lattice mismatch has been described. Every electronic components or electronic systems have certain specifications based on which it is developed and all components have datasheets of their own. The datasheets consists complete details related to the product such as product design specifications, packaging type, power ratings, dimensions etc. Any components can be selected for a particular application by referring their datasheets. In chapter 2, a datasheet for a DC power supply has been developed covering most of the important details that may be needed for designing and modeling using software tools. The schematic of the power supply is developed and practical tests are performed on the power supply, which has been described in details with the test results. The power supply has four interfaces and the functionality and usability of these interfaces has been shown and described in detail. Before the large scale manufacturing and production of any product, it is necessary to conduct two basic tests i.e. Thermal analysis and vibration tests for any given product. These tests help us to get an insight to the reliability of the product. In chapter 3, the power supply is modeled using the software tool ICEPACK v13, using which thermal analysis is performed on the critical components and the temperature variation curves along with the simulation results has been discussed. The method of casing used for the power supply for modeling and the types of conventions i.e. natural and forced convention systems has been compared and discussed. An experimental set up used for performing vibration testing on the power supply has been demonstrated and described in detail.

Mechanical Design of Electronic Systems

Mechanical Design of Electronic Systems

Author: James W. Dally

Publisher: College House Enterprises

Published: 2008-01-01

Total Pages: 648

ISBN-13: 9780976241331

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Book Synopsis Mechanical Design of Electronic Systems by : James W. Dally

Download or read book Mechanical Design of Electronic Systems written by James W. Dally and published by College House Enterprises. This book was released on 2008-01-01 with total page 648 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Fundamentals of Electronic Systems Design

Fundamentals of Electronic Systems Design

Author: Jens Lienig

Publisher: Springer

Published: 2017-04-25

Total Pages: 241

ISBN-13: 3319558404

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This textbook covers the design of electronic systems from the ground up, from drawing and CAD essentials to recycling requirements. Chapter by chapter, it deals with the challenges any modern system designer faces: The design process and its fundamentals, such as technical drawings and CAD, electronic system levels, assembly and packaging issues and appliance protection classes, reliability analysis, thermal management and cooling, electromagnetic compatibility (EMC), all the way to recycling requirements and environmental-friendly design principles. "This unique book provides fundamental, complete, and indispensable information regarding the design of electronic systems. This topic has not been addressed as complete and thorough anywhere before. Since the authors are world-renown experts, it is a foundational reference for today’s design professionals, as well as for the next generation of engineering students." Dr. Patrick Groeneveld, Synopsys Inc.


Book Synopsis Fundamentals of Electronic Systems Design by : Jens Lienig

Download or read book Fundamentals of Electronic Systems Design written by Jens Lienig and published by Springer. This book was released on 2017-04-25 with total page 241 pages. Available in PDF, EPUB and Kindle. Book excerpt: This textbook covers the design of electronic systems from the ground up, from drawing and CAD essentials to recycling requirements. Chapter by chapter, it deals with the challenges any modern system designer faces: The design process and its fundamentals, such as technical drawings and CAD, electronic system levels, assembly and packaging issues and appliance protection classes, reliability analysis, thermal management and cooling, electromagnetic compatibility (EMC), all the way to recycling requirements and environmental-friendly design principles. "This unique book provides fundamental, complete, and indispensable information regarding the design of electronic systems. This topic has not been addressed as complete and thorough anywhere before. Since the authors are world-renown experts, it is a foundational reference for today’s design professionals, as well as for the next generation of engineering students." Dr. Patrick Groeneveld, Synopsys Inc.

Practical Guide to the Packaging of Electronics

Practical Guide to the Packaging of Electronics

Author: Ali Jamnia

Publisher: CRC Press

Published: 2016-12-01

Total Pages: 374

ISBN-13: 1498754023

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Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration. Additionally, the author: Addresses various cross-discipline issues in the design of electromechanical products Provides a solid foundation for heat transfer, vibration, and life expectancy calculations Identifies reliability issues and concerns Develops the ability to conduct a more thorough analysis for the final design Includes design tips and guidelines for each aspect of electronics packaging Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, – electrical or quality engineering.


Book Synopsis Practical Guide to the Packaging of Electronics by : Ali Jamnia

Download or read book Practical Guide to the Packaging of Electronics written by Ali Jamnia and published by CRC Press. This book was released on 2016-12-01 with total page 374 pages. Available in PDF, EPUB and Kindle. Book excerpt: Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration. Additionally, the author: Addresses various cross-discipline issues in the design of electromechanical products Provides a solid foundation for heat transfer, vibration, and life expectancy calculations Identifies reliability issues and concerns Develops the ability to conduct a more thorough analysis for the final design Includes design tips and guidelines for each aspect of electronics packaging Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, – electrical or quality engineering.

Mechatronic Systems Design and Solid Materials

Mechatronic Systems Design and Solid Materials

Author: Satya Bir Singh

Publisher: Apple Academic Press

Published: 2021

Total Pages: 248

ISBN-13: 9781003045748

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This volume elaborates on mechatronics as the synergistic integration of mechanical engineering with electronics and intelligent computer control in the design and manufacturing of industrial products and processes. It considers the integration of mechanical systems (mechanical elements, components, machines), electronic systems (microelectronics, sensor and actuator technology), and information technology. The book's chapters present the principles of mechatronic systems design and solid materials in small elementary steps, provide an abundance of examples, and feature problems that are as practical as possible without becoming too involved with many extraneous details.


Book Synopsis Mechatronic Systems Design and Solid Materials by : Satya Bir Singh

Download or read book Mechatronic Systems Design and Solid Materials written by Satya Bir Singh and published by Apple Academic Press. This book was released on 2021 with total page 248 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume elaborates on mechatronics as the synergistic integration of mechanical engineering with electronics and intelligent computer control in the design and manufacturing of industrial products and processes. It considers the integration of mechanical systems (mechanical elements, components, machines), electronic systems (microelectronics, sensor and actuator technology), and information technology. The book's chapters present the principles of mechatronic systems design and solid materials in small elementary steps, provide an abundance of examples, and feature problems that are as practical as possible without becoming too involved with many extraneous details.

Practical Guide to the Packaging of Electronics, Second Edition

Practical Guide to the Packaging of Electronics, Second Edition

Author: Ali Jamnia

Publisher: CRC Press

Published: 2008-11-20

Total Pages: 336

ISBN-13: 1439870926

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As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest. Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.


Book Synopsis Practical Guide to the Packaging of Electronics, Second Edition by : Ali Jamnia

Download or read book Practical Guide to the Packaging of Electronics, Second Edition written by Ali Jamnia and published by CRC Press. This book was released on 2008-11-20 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest. Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.

Electrical Drives for Direct Drive Renewable Energy Systems

Electrical Drives for Direct Drive Renewable Energy Systems

Author: Markus Mueller

Publisher: Elsevier

Published: 2013-03-25

Total Pages: 280

ISBN-13: 0857097490

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Wind turbine gearboxes present major reliability issues, leading to great interest in the current development of gearless direct-drive wind energy systems. Offering high reliability, high efficiency and low maintenance, developments in these direct-drive systems point the way to the next generation of wind power, and Electrical drives for direct drive renewable energy systems is an authoritative guide to their design, development and operation. Part one outlines electrical drive technology, beginning with an overview of electrical generators for direct drive systems. Principles of electrical design for permanent magnet generators are discussed, followed by electrical, thermal and structural generator design and systems integration. A review of power electronic converter technology and power electronic converter systems for direct drive renewable energy applications is then conducted. Part two then focuses on wind and marine applications, beginning with a commercial overview of wind turbine drive systems and an introduction to direct drive wave energy conversion systems. The commercial application of these technologies is investigated via case studies on the permanent magnet direct drive generator in the Zephyros wind turbine, and the Archimedes Wave Swing (AWS) direct drive wave energy pilot plant. Finally, the book concludes by exploring the application of high-temperature superconducting machines to direct drive renewable energy systems. With its distinguished editors and international team of expert contributors, Electrical drives for direct drive renewable energy systems provides a comprehensive review of key technologies for anyone involved with or interested in the design, construction, operation, development and optimisation of direct drive wind and marine energy systems. An authorative guide to the design, development and operation of gearless direct drives Discusses the principles of electrical design for permanent magnet generators and electrical, thermal and structural generator design and systems integration Investigates the commercial applications of wind turbine drive systems


Book Synopsis Electrical Drives for Direct Drive Renewable Energy Systems by : Markus Mueller

Download or read book Electrical Drives for Direct Drive Renewable Energy Systems written by Markus Mueller and published by Elsevier. This book was released on 2013-03-25 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: Wind turbine gearboxes present major reliability issues, leading to great interest in the current development of gearless direct-drive wind energy systems. Offering high reliability, high efficiency and low maintenance, developments in these direct-drive systems point the way to the next generation of wind power, and Electrical drives for direct drive renewable energy systems is an authoritative guide to their design, development and operation. Part one outlines electrical drive technology, beginning with an overview of electrical generators for direct drive systems. Principles of electrical design for permanent magnet generators are discussed, followed by electrical, thermal and structural generator design and systems integration. A review of power electronic converter technology and power electronic converter systems for direct drive renewable energy applications is then conducted. Part two then focuses on wind and marine applications, beginning with a commercial overview of wind turbine drive systems and an introduction to direct drive wave energy conversion systems. The commercial application of these technologies is investigated via case studies on the permanent magnet direct drive generator in the Zephyros wind turbine, and the Archimedes Wave Swing (AWS) direct drive wave energy pilot plant. Finally, the book concludes by exploring the application of high-temperature superconducting machines to direct drive renewable energy systems. With its distinguished editors and international team of expert contributors, Electrical drives for direct drive renewable energy systems provides a comprehensive review of key technologies for anyone involved with or interested in the design, construction, operation, development and optimisation of direct drive wind and marine energy systems. An authorative guide to the design, development and operation of gearless direct drives Discusses the principles of electrical design for permanent magnet generators and electrical, thermal and structural generator design and systems integration Investigates the commercial applications of wind turbine drive systems

Mechatronics '98

Mechatronics '98

Author: J. Adolfsson

Publisher: Elsevier

Published: 1998-08-28

Total Pages: 941

ISBN-13: 0080552854

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Mechatronics, a synergistic combination of mechanical, electronic and computing engineering technologies, is a truly multidisciplinary approach to engineering. New products based on mechatronic principles are demonstrating reduced mechanical complexity, increased performance and often previously impossible capabilities. This book contains the papers presented at the UK Mechatronics Forum's 6th International Conference, held in Skövde, Sweden, in September 1998. Many of these high-quality papers illustrate the tremendous influence of mechatronics on such areas as manufacturing machinery, automotive engineering, textiles manufacture, robotics, and real-time control and vision systems. There are also papers describing developments in sensors, actuators, control and data processing techniques, such as fuzzy logic and neural networks, all of which have practical application to mechatronic systems.


Book Synopsis Mechatronics '98 by : J. Adolfsson

Download or read book Mechatronics '98 written by J. Adolfsson and published by Elsevier. This book was released on 1998-08-28 with total page 941 pages. Available in PDF, EPUB and Kindle. Book excerpt: Mechatronics, a synergistic combination of mechanical, electronic and computing engineering technologies, is a truly multidisciplinary approach to engineering. New products based on mechatronic principles are demonstrating reduced mechanical complexity, increased performance and often previously impossible capabilities. This book contains the papers presented at the UK Mechatronics Forum's 6th International Conference, held in Skövde, Sweden, in September 1998. Many of these high-quality papers illustrate the tremendous influence of mechatronics on such areas as manufacturing machinery, automotive engineering, textiles manufacture, robotics, and real-time control and vision systems. There are also papers describing developments in sensors, actuators, control and data processing techniques, such as fuzzy logic and neural networks, all of which have practical application to mechatronic systems.

Micro Electro Mechanical System Design

Micro Electro Mechanical System Design

Author: James J. Allen

Publisher: CRC Press

Published: 2005-07-08

Total Pages: 492

ISBN-13: 1420027751

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It is challenging at best to find a resource that provides the breadth of information necessary to develop a successful micro electro mechanical system (MEMS) design. Micro Electro Mechanical System Design is that resource. It is a comprehensive, single-source guide that explains the design process by illustrating the full range of issues involved,


Book Synopsis Micro Electro Mechanical System Design by : James J. Allen

Download or read book Micro Electro Mechanical System Design written by James J. Allen and published by CRC Press. This book was released on 2005-07-08 with total page 492 pages. Available in PDF, EPUB and Kindle. Book excerpt: It is challenging at best to find a resource that provides the breadth of information necessary to develop a successful micro electro mechanical system (MEMS) design. Micro Electro Mechanical System Design is that resource. It is a comprehensive, single-source guide that explains the design process by illustrating the full range of issues involved,