Mechanical Design of Electronic Systems

Mechanical Design of Electronic Systems

Author: James W. Dally

Publisher: College House Enterprises

Published: 2008-01-01

Total Pages: 648

ISBN-13: 9780976241331

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Book Synopsis Mechanical Design of Electronic Systems by : James W. Dally

Download or read book Mechanical Design of Electronic Systems written by James W. Dally and published by College House Enterprises. This book was released on 2008-01-01 with total page 648 pages. Available in PDF, EPUB and Kindle. Book excerpt:


Fundamentals of Electronic Systems Design

Fundamentals of Electronic Systems Design

Author: Jens Lienig

Publisher: Springer

Published: 2017-04-25

Total Pages: 241

ISBN-13: 3319558404

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This textbook covers the design of electronic systems from the ground up, from drawing and CAD essentials to recycling requirements. Chapter by chapter, it deals with the challenges any modern system designer faces: The design process and its fundamentals, such as technical drawings and CAD, electronic system levels, assembly and packaging issues and appliance protection classes, reliability analysis, thermal management and cooling, electromagnetic compatibility (EMC), all the way to recycling requirements and environmental-friendly design principles. "This unique book provides fundamental, complete, and indispensable information regarding the design of electronic systems. This topic has not been addressed as complete and thorough anywhere before. Since the authors are world-renown experts, it is a foundational reference for today’s design professionals, as well as for the next generation of engineering students." Dr. Patrick Groeneveld, Synopsys Inc.


Book Synopsis Fundamentals of Electronic Systems Design by : Jens Lienig

Download or read book Fundamentals of Electronic Systems Design written by Jens Lienig and published by Springer. This book was released on 2017-04-25 with total page 241 pages. Available in PDF, EPUB and Kindle. Book excerpt: This textbook covers the design of electronic systems from the ground up, from drawing and CAD essentials to recycling requirements. Chapter by chapter, it deals with the challenges any modern system designer faces: The design process and its fundamentals, such as technical drawings and CAD, electronic system levels, assembly and packaging issues and appliance protection classes, reliability analysis, thermal management and cooling, electromagnetic compatibility (EMC), all the way to recycling requirements and environmental-friendly design principles. "This unique book provides fundamental, complete, and indispensable information regarding the design of electronic systems. This topic has not been addressed as complete and thorough anywhere before. Since the authors are world-renown experts, it is a foundational reference for today’s design professionals, as well as for the next generation of engineering students." Dr. Patrick Groeneveld, Synopsys Inc.


Mechanical Analysis of Electronic Packaging Systems

Mechanical Analysis of Electronic Packaging Systems

Author: Mckeown

Publisher: CRC Press

Published: 1999-04-06

Total Pages: 382

ISBN-13: 9780824770334

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"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."


Book Synopsis Mechanical Analysis of Electronic Packaging Systems by : Mckeown

Download or read book Mechanical Analysis of Electronic Packaging Systems written by Mckeown and published by CRC Press. This book was released on 1999-04-06 with total page 382 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."


Practical Guide to the Packaging of Electronics

Practical Guide to the Packaging of Electronics

Author: Ali Jamnia

Publisher: CRC Press

Published: 2002-10-08

Total Pages: 200

ISBN-13: 1482275848

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Whether you are designing a new system or troubleshooting a current one, this ingenious text offers a wealth of valuable information. The author focuses on reliability problems and the design of systems with incomplete criteria and components and provides a simple approach for estimating thermal and mechanical characteristics of electronic systems.


Book Synopsis Practical Guide to the Packaging of Electronics by : Ali Jamnia

Download or read book Practical Guide to the Packaging of Electronics written by Ali Jamnia and published by CRC Press. This book was released on 2002-10-08 with total page 200 pages. Available in PDF, EPUB and Kindle. Book excerpt: Whether you are designing a new system or troubleshooting a current one, this ingenious text offers a wealth of valuable information. The author focuses on reliability problems and the design of systems with incomplete criteria and components and provides a simple approach for estimating thermal and mechanical characteristics of electronic systems.


Practical Guide to the Packaging of Electronics

Practical Guide to the Packaging of Electronics

Author: Ali Jamnia

Publisher: CRC Press

Published: 2016-12-01

Total Pages: 374

ISBN-13: 1498754023

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Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration. Additionally, the author: Addresses various cross-discipline issues in the design of electromechanical products Provides a solid foundation for heat transfer, vibration, and life expectancy calculations Identifies reliability issues and concerns Develops the ability to conduct a more thorough analysis for the final design Includes design tips and guidelines for each aspect of electronics packaging Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, – electrical or quality engineering.


Book Synopsis Practical Guide to the Packaging of Electronics by : Ali Jamnia

Download or read book Practical Guide to the Packaging of Electronics written by Ali Jamnia and published by CRC Press. This book was released on 2016-12-01 with total page 374 pages. Available in PDF, EPUB and Kindle. Book excerpt: Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration. Additionally, the author: Addresses various cross-discipline issues in the design of electromechanical products Provides a solid foundation for heat transfer, vibration, and life expectancy calculations Identifies reliability issues and concerns Develops the ability to conduct a more thorough analysis for the final design Includes design tips and guidelines for each aspect of electronics packaging Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, – electrical or quality engineering.


Handbook of Electronic Package Design

Handbook of Electronic Package Design

Author: Michael Pecht

Publisher: CRC Press

Published: 2018-10-24

Total Pages: 904

ISBN-13: 1351838415

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Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development


Book Synopsis Handbook of Electronic Package Design by : Michael Pecht

Download or read book Handbook of Electronic Package Design written by Michael Pecht and published by CRC Press. This book was released on 2018-10-24 with total page 904 pages. Available in PDF, EPUB and Kindle. Book excerpt: Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development


Mechanical Design of Machine Components

Mechanical Design of Machine Components

Author: Ansel C. Ugural

Publisher: Taylor & Francis

Published: 2018-09-03

Total Pages: 990

ISBN-13: 1315362260

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Analyze and Solve Real-World Machine Design Problems Using SI Units Mechanical Design of Machine Components, Second Edition: SI Version strikes a balance between method and theory, and fills a void in the world of design. Relevant to mechanical and related engineering curricula, the book is useful in college classes, and also serves as a reference for practicing engineers. This book combines the needed engineering mechanics concepts, analysis of various machine elements, design procedures, and the application of numerical and computational tools. It demonstrates the means by which loads are resisted in mechanical components, solves all examples and problems within the book using SI units, and helps readers gain valuable insight into the mechanics and design methods of machine components. The author presents structured, worked examples and problem sets that showcase analysis and design techniques, includes case studies that present different aspects of the same design or analysis problem, and links together a variety of topics in successive chapters. SI units are used exclusively in examples and problems, while some selected tables also show U.S. customary (USCS) units. This book also presumes knowledge of the mechanics of materials and material properties. New in the Second Edition: Presents a study of two entire real-life machines Includes Finite Element Analysis coverage supported by examples and case studies Provides MATLAB solutions of many problem samples and case studies included on the book’s website Offers access to additional information on selected topics that includes website addresses and open-ended web-based problems Class-tested and divided into three sections, this comprehensive book first focuses on the fundamentals and covers the basics of loading, stress, strain, materials, deflection, stiffness, and stability. This includes basic concepts in design and analysis, as well as definitions related to properties of engineering materials. Also discussed are detailed equilibrium and energy methods of analysis for determining stresses and deformations in variously loaded members. The second section deals with fracture mechanics, failure criteria, fatigue phenomena, and surface damage of components. The final section is dedicated to machine component design, briefly covering entire machines. The fundamentals are applied to specific elements such as shafts, bearings, gears, belts, chains, clutches, brakes, and springs.


Book Synopsis Mechanical Design of Machine Components by : Ansel C. Ugural

Download or read book Mechanical Design of Machine Components written by Ansel C. Ugural and published by Taylor & Francis. This book was released on 2018-09-03 with total page 990 pages. Available in PDF, EPUB and Kindle. Book excerpt: Analyze and Solve Real-World Machine Design Problems Using SI Units Mechanical Design of Machine Components, Second Edition: SI Version strikes a balance between method and theory, and fills a void in the world of design. Relevant to mechanical and related engineering curricula, the book is useful in college classes, and also serves as a reference for practicing engineers. This book combines the needed engineering mechanics concepts, analysis of various machine elements, design procedures, and the application of numerical and computational tools. It demonstrates the means by which loads are resisted in mechanical components, solves all examples and problems within the book using SI units, and helps readers gain valuable insight into the mechanics and design methods of machine components. The author presents structured, worked examples and problem sets that showcase analysis and design techniques, includes case studies that present different aspects of the same design or analysis problem, and links together a variety of topics in successive chapters. SI units are used exclusively in examples and problems, while some selected tables also show U.S. customary (USCS) units. This book also presumes knowledge of the mechanics of materials and material properties. New in the Second Edition: Presents a study of two entire real-life machines Includes Finite Element Analysis coverage supported by examples and case studies Provides MATLAB solutions of many problem samples and case studies included on the book’s website Offers access to additional information on selected topics that includes website addresses and open-ended web-based problems Class-tested and divided into three sections, this comprehensive book first focuses on the fundamentals and covers the basics of loading, stress, strain, materials, deflection, stiffness, and stability. This includes basic concepts in design and analysis, as well as definitions related to properties of engineering materials. Also discussed are detailed equilibrium and energy methods of analysis for determining stresses and deformations in variously loaded members. The second section deals with fracture mechanics, failure criteria, fatigue phenomena, and surface damage of components. The final section is dedicated to machine component design, briefly covering entire machines. The fundamentals are applied to specific elements such as shafts, bearings, gears, belts, chains, clutches, brakes, and springs.


Cost Analysis of Electronic Systems

Cost Analysis of Electronic Systems

Author: Peter Sandborn

Publisher: World Scientific

Published: 2013

Total Pages: 440

ISBN-13: 981438335X

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Understanding the cost ramifications of design, manufacturing and life-cycle management decisions is of central importance to businesses associated with all types of electronic systems. Cost Analysis of Electronic Systems contains carefully developed models and theory that practicing engineers can directly apply to the modeling of costs for real products and systems. In addition, this book brings to light and models many contributions to life-cycle costs that practitioners are aware of but never had the tools or techniques to address quantitatively in the past.Cost Analysis of Electronic Systems melds elements of traditional engineering economics with manufacturing process and life-cycle cost management concepts to form a practical foundation for predicting the cost of electronic products and systems. Various manufacturing cost analysis methods are addressed including: process-flow, parametric, cost of ownership, and activity-based costing. The effects of learning curves, data uncertainty, test and rework processes, and defects are considered. Aspects of system sustainment and life-cycle cost modeling including reliability (warranty, burn-in), maintenance (sparing and availability), and obsolescence are treated. Finally, total cost of ownership of systems and return on investment are addressed.Real life design scenarios from integrated circuit fabrication, electronic systems assembly, substrate fabrication, and electronic systems managementare used as examples of the application of the cost estimation methods developed within the book.


Book Synopsis Cost Analysis of Electronic Systems by : Peter Sandborn

Download or read book Cost Analysis of Electronic Systems written by Peter Sandborn and published by World Scientific. This book was released on 2013 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt: Understanding the cost ramifications of design, manufacturing and life-cycle management decisions is of central importance to businesses associated with all types of electronic systems. Cost Analysis of Electronic Systems contains carefully developed models and theory that practicing engineers can directly apply to the modeling of costs for real products and systems. In addition, this book brings to light and models many contributions to life-cycle costs that practitioners are aware of but never had the tools or techniques to address quantitatively in the past.Cost Analysis of Electronic Systems melds elements of traditional engineering economics with manufacturing process and life-cycle cost management concepts to form a practical foundation for predicting the cost of electronic products and systems. Various manufacturing cost analysis methods are addressed including: process-flow, parametric, cost of ownership, and activity-based costing. The effects of learning curves, data uncertainty, test and rework processes, and defects are considered. Aspects of system sustainment and life-cycle cost modeling including reliability (warranty, burn-in), maintenance (sparing and availability), and obsolescence are treated. Finally, total cost of ownership of systems and return on investment are addressed.Real life design scenarios from integrated circuit fabrication, electronic systems assembly, substrate fabrication, and electronic systems managementare used as examples of the application of the cost estimation methods developed within the book.


Integrated Electrical and Electronic Engineering for Mechanical Engineers

Integrated Electrical and Electronic Engineering for Mechanical Engineers

Author: Charles Fraser

Publisher: McGraw-Hill Companies

Published: 1994

Total Pages: 560

ISBN-13:

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Basic electrical technology. Analogue electronics. Electrical actuators.


Book Synopsis Integrated Electrical and Electronic Engineering for Mechanical Engineers by : Charles Fraser

Download or read book Integrated Electrical and Electronic Engineering for Mechanical Engineers written by Charles Fraser and published by McGraw-Hill Companies. This book was released on 1994 with total page 560 pages. Available in PDF, EPUB and Kindle. Book excerpt: Basic electrical technology. Analogue electronics. Electrical actuators.


Mechanical Aspects in Electronics Systems Design

Mechanical Aspects in Electronics Systems Design

Author: Vinay Divakar

Publisher: GRIN Verlag

Published: 2014-08-27

Total Pages: 37

ISBN-13: 365673089X

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Scientific Study from the year 2013 in the subject Engineering - Mechanical Engineering, grade: B+, , course: Electronics Systems Design, language: English, abstract: In chapter 1, the present research carried on the mature laser technology i.e. GaAs, in order to improve its efficiency. The packaging principle used for receivers can be applied for the packaging of the laser driver circuit and the laser source in a single module. The concept of FRACAS (Failure Reporting, Analysis and Corrective Action System) has been described and failure analysis technique for Electrical overstress (EOS) is described. An industrial approach to calculating the reliability of a system with some known data is described. Some challenges with respect to packaging has been discussed in detail and some methods to overcome challenges such as lattice mismatch has been described. Every electronic components or electronic systems have certain specifications based on which it is developed and all components have datasheets of their own. The datasheets consists complete details related to the product such as product design specifications, packaging type, power ratings, dimensions etc. Any components can be selected for a particular application by referring their datasheets. In chapter 2, a datasheet for a DC power supply has been developed covering most of the important details that may be needed for designing and modeling using software tools. The schematic of the power supply is developed and practical tests are performed on the power supply, which has been described in details with the test results. The power supply has four interfaces and the functionality and usability of these interfaces has been shown and described in detail. Before the large scale manufacturing and production of any product, it is necessary to conduct two basic tests i.e. Thermal analysis and vibration tests for any given product. These tests help us to get an insight to the reliability of the product. In chapter 3, the power supply is modeled using the software tool ICEPACK v13, using which thermal analysis is performed on the critical components and the temperature variation curves along with the simulation results has been discussed. The method of casing used for the power supply for modeling and the types of conventions i.e. natural and forced convention systems has been compared and discussed. An experimental set up used for performing vibration testing on the power supply has been demonstrated and described in detail.


Book Synopsis Mechanical Aspects in Electronics Systems Design by : Vinay Divakar

Download or read book Mechanical Aspects in Electronics Systems Design written by Vinay Divakar and published by GRIN Verlag. This book was released on 2014-08-27 with total page 37 pages. Available in PDF, EPUB and Kindle. Book excerpt: Scientific Study from the year 2013 in the subject Engineering - Mechanical Engineering, grade: B+, , course: Electronics Systems Design, language: English, abstract: In chapter 1, the present research carried on the mature laser technology i.e. GaAs, in order to improve its efficiency. The packaging principle used for receivers can be applied for the packaging of the laser driver circuit and the laser source in a single module. The concept of FRACAS (Failure Reporting, Analysis and Corrective Action System) has been described and failure analysis technique for Electrical overstress (EOS) is described. An industrial approach to calculating the reliability of a system with some known data is described. Some challenges with respect to packaging has been discussed in detail and some methods to overcome challenges such as lattice mismatch has been described. Every electronic components or electronic systems have certain specifications based on which it is developed and all components have datasheets of their own. The datasheets consists complete details related to the product such as product design specifications, packaging type, power ratings, dimensions etc. Any components can be selected for a particular application by referring their datasheets. In chapter 2, a datasheet for a DC power supply has been developed covering most of the important details that may be needed for designing and modeling using software tools. The schematic of the power supply is developed and practical tests are performed on the power supply, which has been described in details with the test results. The power supply has four interfaces and the functionality and usability of these interfaces has been shown and described in detail. Before the large scale manufacturing and production of any product, it is necessary to conduct two basic tests i.e. Thermal analysis and vibration tests for any given product. These tests help us to get an insight to the reliability of the product. In chapter 3, the power supply is modeled using the software tool ICEPACK v13, using which thermal analysis is performed on the critical components and the temperature variation curves along with the simulation results has been discussed. The method of casing used for the power supply for modeling and the types of conventions i.e. natural and forced convention systems has been compared and discussed. An experimental set up used for performing vibration testing on the power supply has been demonstrated and described in detail.