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Download or read book Metallization Systems for Integrated Circuits written by Rosemary P. Beatty and published by . This book was released on 1970 with total page 34 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author: Syd R. Wilson
Publisher: William Andrew
Published: 1993
Total Pages: 922
ISBN-13:
DOWNLOAD EBOOKIt is widely recognized that the successful design, development, and integration of multilevel metallization (MLM) systems is and will continue to be key to current and future VLSI technologies. All major semiconductor companies have significant ongoing research teams focused in this area. These teams must view multilevel metallization as a system rather than a collection of isolated process modules.
Download or read book Handbook of Multilevel Metallization for Integrated Circuits written by Syd R. Wilson and published by William Andrew. This book was released on 1993 with total page 922 pages. Available in PDF, EPUB and Kindle. Book excerpt: It is widely recognized that the successful design, development, and integration of multilevel metallization (MLM) systems is and will continue to be key to current and future VLSI technologies. All major semiconductor companies have significant ongoing research teams focused in this area. These teams must view multilevel metallization as a system rather than a collection of isolated process modules.
Author: Daniel Adams
Publisher: Springer Science & Business Media
Published: 2007-10-27
Total Pages: 132
ISBN-13: 1848000278
DOWNLOAD EBOOKHere is the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology. With the lowest resistivity of all metals, silver is an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the issues that have prevented silver from being used as an interconnect metal. The authors provide details on a wide range of experimental, characterization, and analysis techniques. The book is written for students, scientists, engineers, and technologists in the fields of integrated circuits and microelectronics research and development.
Download or read book Silver Metallization written by Daniel Adams and published by Springer Science & Business Media. This book was released on 2007-10-27 with total page 132 pages. Available in PDF, EPUB and Kindle. Book excerpt: Here is the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology. With the lowest resistivity of all metals, silver is an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the issues that have prevented silver from being used as an interconnect metal. The authors provide details on a wide range of experimental, characterization, and analysis techniques. The book is written for students, scientists, engineers, and technologists in the fields of integrated circuits and microelectronics research and development.
Author: Norman G. Einspruch
Publisher: Academic Press
Published: 2014-12-01
Total Pages: 491
ISBN-13: 1483217817
DOWNLOAD EBOOKVLSI Electronics Microstructure Science, Volume 15: VLSI Metallization discusses the various issues and problems related to VLSI metallization. It details the available solutions and presents emerging trends. This volume is comprised of 10 chapters. The two introductory chapters, Chapter 1 and 2 serve as general references for the electrical and metallurgical properties of thin conducting films. Subsequent chapters review the various aspects of VLSI metallization. The order of presentation has been chosen to follow the common processing sequence. In Chapter 3, some relevant metal deposition techniques are discussed. Chapter 4 presents the methods of VLSI lithography and etching. Conducting films are first deposited at the gate definition step; therefore, the issues related to gate metallization are discussed next in Chapter 5.In Chapter 6, contact metallization is elaborated, and Chapter 7 is devoted to multilevel metallization schemes. Long-time reliability is the subject of Chapter 8, which discusses the issues of contact and interconnect electromigration. GaAs metallization is tackled in Chapter 9. The volume concludes with a general discussion of the functions of interconnect systems in VLSI. Materials scientists, processing and design engineers, and device physicists will find the book very useful.
Download or read book VLSI Metallization written by Norman G. Einspruch and published by Academic Press. This book was released on 2014-12-01 with total page 491 pages. Available in PDF, EPUB and Kindle. Book excerpt: VLSI Electronics Microstructure Science, Volume 15: VLSI Metallization discusses the various issues and problems related to VLSI metallization. It details the available solutions and presents emerging trends. This volume is comprised of 10 chapters. The two introductory chapters, Chapter 1 and 2 serve as general references for the electrical and metallurgical properties of thin conducting films. Subsequent chapters review the various aspects of VLSI metallization. The order of presentation has been chosen to follow the common processing sequence. In Chapter 3, some relevant metal deposition techniques are discussed. Chapter 4 presents the methods of VLSI lithography and etching. Conducting films are first deposited at the gate definition step; therefore, the issues related to gate metallization are discussed next in Chapter 5.In Chapter 6, contact metallization is elaborated, and Chapter 7 is devoted to multilevel metallization schemes. Long-time reliability is the subject of Chapter 8, which discusses the issues of contact and interconnect electromigration. GaAs metallization is tackled in Chapter 9. The volume concludes with a general discussion of the functions of interconnect systems in VLSI. Materials scientists, processing and design engineers, and device physicists will find the book very useful.
Download or read book NASA Technical Note written by and published by . This book was released on 1970 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author: Thomas Moore
Publisher: Elsevier
Published: 2013-10-22
Total Pages: 293
ISBN-13: 1483292347
DOWNLOAD EBOOKChapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
Download or read book Characterization of Integrated Circuit Packaging Materials written by Thomas Moore and published by Elsevier. This book was released on 2013-10-22 with total page 293 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
Author: S. P. Murarka
Publisher: Butterworth-Heinemann
Published: 1993
Total Pages: 268
ISBN-13:
DOWNLOAD EBOOKThis title covers fundemental concepts, properties and applicabilities of metals and alloys for use in various metallization schemes. Metallizations form the key components on electronic circuits - controlling device properties and providing power and device interconnections with the outside world or with other devices. The recent advent of submicron dimensions and increasingly faster devices in the semiconductor have challenged researchers to keep metallization schemes in line with new demanding requirements.
Download or read book Metallization written by S. P. Murarka and published by Butterworth-Heinemann. This book was released on 1993 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt: This title covers fundemental concepts, properties and applicabilities of metals and alloys for use in various metallization schemes. Metallizations form the key components on electronic circuits - controlling device properties and providing power and device interconnections with the outside world or with other devices. The recent advent of submicron dimensions and increasingly faster devices in the semiconductor have challenged researchers to keep metallization schemes in line with new demanding requirements.
Author: Richard S. Muller
Publisher: John Wiley & Sons
Published: 2002-10-28
Total Pages: 564
ISBN-13: 0471593982
DOWNLOAD EBOOKFocusing specifically on silicon devices, the Third Edition of Device Electronics for Integrated Circuits takes students in integrated-circuits courses from fundamental physics to detailed device operation. Because the book focuses primarily on silicon devices, each topic can include more depth, and extensive worked examples and practice problems ensure that students understand the details.
Download or read book Device Electronics for Integrated Circuits written by Richard S. Muller and published by John Wiley & Sons. This book was released on 2002-10-28 with total page 564 pages. Available in PDF, EPUB and Kindle. Book excerpt: Focusing specifically on silicon devices, the Third Edition of Device Electronics for Integrated Circuits takes students in integrated-circuits courses from fundamental physics to detailed device operation. Because the book focuses primarily on silicon devices, each topic can include more depth, and extensive worked examples and practice problems ensure that students understand the details.
Author: Aris Christou
Publisher: RIAC
Published: 2006
Total Pages: 487
ISBN-13: 1933904194
DOWNLOAD EBOOKDownload or read book Reliability of Compound Analogue Semiconductor Integrated Circuits written by Aris Christou and published by RIAC. This book was released on 2006 with total page 487 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability Abstracts and Technical Reviews written by and published by . This book was released on 1967 with total page 644 pages. Available in PDF, EPUB and Kindle. Book excerpt:
