Methods and Materials in Microelectronic Technology

Methods and Materials in Microelectronic Technology

Author: Joachim Bargon

Publisher: Springer Science & Business Media

Published: 2013-03-09

Total Pages: 367

ISBN-13: 1468448471

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The papers collected in this volume were presented at the International Symposium on Methods and Materials in Microelectronic Technology. This symposium was sponsored by IBM Germany, and it was held September 29 - October 1, 1982, in Bad Neuenahr, West Germany. The progress of semiconductor and microelectronic technology has become so rapid and the field so sophisticated that it is imperative to exchange the latest insight gained as frequently as it can be accomplished. In addition, it is peculiar for this field that the bulk of the investigations are carried out at industrial research and development laboratories, which makes some of the results less readily accessible. Because of these circumstances, the academic community, which among other things, is supposed to communicate the prog ress in this field to students of different disciplines, finds it rather difficult to stay properly informed. It was the intent of this IBM sponsored symposium to bring together key scientists from academic institutions, primarily from Europe, with principal investigators of the industrial scene. Accordingly, this symposium exposed technologists to scientists and vice versa. Scientific advances often lead directly to technological innovations. In turn, new technologies are often arrived at empirically and, because of that, are initially poorly understood. Scientific inquiry then attempts to probe these processes and phenomena in order to achieve a better understanding. Thus science and technology are intricately interconnected, and it is important that technical exchange between technolo gists and scientists is facilitated, since the problems are typically interdiscipli nary in nature.


Book Synopsis Methods and Materials in Microelectronic Technology by : Joachim Bargon

Download or read book Methods and Materials in Microelectronic Technology written by Joachim Bargon and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 367 pages. Available in PDF, EPUB and Kindle. Book excerpt: The papers collected in this volume were presented at the International Symposium on Methods and Materials in Microelectronic Technology. This symposium was sponsored by IBM Germany, and it was held September 29 - October 1, 1982, in Bad Neuenahr, West Germany. The progress of semiconductor and microelectronic technology has become so rapid and the field so sophisticated that it is imperative to exchange the latest insight gained as frequently as it can be accomplished. In addition, it is peculiar for this field that the bulk of the investigations are carried out at industrial research and development laboratories, which makes some of the results less readily accessible. Because of these circumstances, the academic community, which among other things, is supposed to communicate the prog ress in this field to students of different disciplines, finds it rather difficult to stay properly informed. It was the intent of this IBM sponsored symposium to bring together key scientists from academic institutions, primarily from Europe, with principal investigators of the industrial scene. Accordingly, this symposium exposed technologists to scientists and vice versa. Scientific advances often lead directly to technological innovations. In turn, new technologies are often arrived at empirically and, because of that, are initially poorly understood. Scientific inquiry then attempts to probe these processes and phenomena in order to achieve a better understanding. Thus science and technology are intricately interconnected, and it is important that technical exchange between technolo gists and scientists is facilitated, since the problems are typically interdiscipli nary in nature.

Microelectromechanical Systems

Microelectromechanical Systems

Author: Committee on Advanced Materials and Fabrication Methods for Microelectromechanical Systems

Publisher: National Academies Press

Published: 1997-12-15

Total Pages: 76

ISBN-13: 0309591511

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Microelectromenchanical systems (MEMS) is a revolutionary field that adapts for new uses a technology already optimized to accomplish a specific set of objectives. The silicon-based integrated circuits process is so highly refined it can produce millions of electrical elements on a single chip and define their critical dimensions to tolerances of 100-billionths of a meter. The MEMS revolution harnesses the integrated circuitry know-how to build working microsystems from micromechanical and microelectronic elements. MEMS is a multidisciplinary field involving challenges and opportunites for electrical, mechanical, chemical, and biomedical engineering as well as physics, biology, and chemistry. As MEMS begin to permeate more and more industrial procedures, society as a whole will be strongly affected because MEMS provide a new design technology that could rival--perhaps surpass--the societal impact of integrated circuits.


Book Synopsis Microelectromechanical Systems by : Committee on Advanced Materials and Fabrication Methods for Microelectromechanical Systems

Download or read book Microelectromechanical Systems written by Committee on Advanced Materials and Fabrication Methods for Microelectromechanical Systems and published by National Academies Press. This book was released on 1997-12-15 with total page 76 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectromenchanical systems (MEMS) is a revolutionary field that adapts for new uses a technology already optimized to accomplish a specific set of objectives. The silicon-based integrated circuits process is so highly refined it can produce millions of electrical elements on a single chip and define their critical dimensions to tolerances of 100-billionths of a meter. The MEMS revolution harnesses the integrated circuitry know-how to build working microsystems from micromechanical and microelectronic elements. MEMS is a multidisciplinary field involving challenges and opportunites for electrical, mechanical, chemical, and biomedical engineering as well as physics, biology, and chemistry. As MEMS begin to permeate more and more industrial procedures, society as a whole will be strongly affected because MEMS provide a new design technology that could rival--perhaps surpass--the societal impact of integrated circuits.

Microelectronic Materials and Processes

Microelectronic Materials and Processes

Author: Roland Levy

Publisher: Springer Science & Business Media

Published: 1989-01-31

Total Pages: 1006

ISBN-13: 9780792301547

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The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.


Book Synopsis Microelectronic Materials and Processes by : Roland Levy

Download or read book Microelectronic Materials and Processes written by Roland Levy and published by Springer Science & Business Media. This book was released on 1989-01-31 with total page 1006 pages. Available in PDF, EPUB and Kindle. Book excerpt: The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.

Die-Attach Materials for High Temperature Applications in Microelectronics Packaging

Die-Attach Materials for High Temperature Applications in Microelectronics Packaging

Author: Kim S. Siow

Publisher: Springer

Published: 2019-01-29

Total Pages: 279

ISBN-13: 3319992562

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This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.


Book Synopsis Die-Attach Materials for High Temperature Applications in Microelectronics Packaging by : Kim S. Siow

Download or read book Die-Attach Materials for High Temperature Applications in Microelectronics Packaging written by Kim S. Siow and published by Springer. This book was released on 2019-01-29 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.

Microelectromechanical Systems

Microelectromechanical Systems

Author: National Research Council

Publisher: National Academies Press

Published: 1998-01-01

Total Pages: 76

ISBN-13: 0309059801

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Microelectromenchanical systems (MEMS) is a revolutionary field that adapts for new uses a technology already optimized to accomplish a specific set of objectives. The silicon-based integrated circuits process is so highly refined it can produce millions of electrical elements on a single chip and define their critical dimensions to tolerances of 100-billionths of a meter. The MEMS revolution harnesses the integrated circuitry know-how to build working microsystems from micromechanical and microelectronic elements. MEMS is a multidisciplinary field involving challenges and opportunites for electrical, mechanical, chemical, and biomedical engineering as well as physics, biology, and chemistry. As MEMS begin to permeate more and more industrial procedures, society as a whole will be strongly affected because MEMS provide a new design technology that could rivalâ€"perhaps surpassâ€"the societal impact of integrated circuits.


Book Synopsis Microelectromechanical Systems by : National Research Council

Download or read book Microelectromechanical Systems written by National Research Council and published by National Academies Press. This book was released on 1998-01-01 with total page 76 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectromenchanical systems (MEMS) is a revolutionary field that adapts for new uses a technology already optimized to accomplish a specific set of objectives. The silicon-based integrated circuits process is so highly refined it can produce millions of electrical elements on a single chip and define their critical dimensions to tolerances of 100-billionths of a meter. The MEMS revolution harnesses the integrated circuitry know-how to build working microsystems from micromechanical and microelectronic elements. MEMS is a multidisciplinary field involving challenges and opportunites for electrical, mechanical, chemical, and biomedical engineering as well as physics, biology, and chemistry. As MEMS begin to permeate more and more industrial procedures, society as a whole will be strongly affected because MEMS provide a new design technology that could rivalâ€"perhaps surpassâ€"the societal impact of integrated circuits.

Microelectronics to Nanoelectronics

Microelectronics to Nanoelectronics

Author: Anupama B. Kaul

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 464

ISBN-13: 1466509554

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Composed of contributions from top experts, Microelectronics to Nanoelectronics: Materials, Devices and Manufacturability offers a detailed overview of important recent scientific and technological developments in the rapidly evolving nanoelectronics arena. Under the editorial guidance and technical expertise of noted materials scientist Anupama B. Kaul of California Institute of Technology’s Jet Propulsion Lab, this book captures the ascent of microelectronics into the nanoscale realm. It addresses a wide variety of important scientific and technological issues in nanoelectronics research and development. The book also showcases some key application areas of micro-electro-mechanical-systems (MEMS) that have reached the commercial realm. Capitalizing on Dr. Kaul’s considerable technical experience with micro- and nanotechnologies and her extensive research in prestigious academic and industrial labs, the book offers a fresh perspective on application-driven research in micro- and nanoelectronics, including MEMS. Chapters explore how rapid developments in this area are transitioning from the lab to the market, where new and exciting materials, devices, and manufacturing technologies are revolutionizing the electronics industry. Although many micro- and nanotechnologies still face major scientific and technological challenges and remain within the realm of academic research labs, rapid advances in this area have led to the recent emergence of new applications and markets. This handbook encapsulates that exciting recent progress by providing high-quality content contributed by international experts from academia, leading industrial institutions—such as Hewlett-Packard—and government laboratories including the U.S. Department of Energy’s Sandia National Laboratory. Offering something for everyone, from students to scientists to entrepreneurs, this book showcases the broad spectrum of cutting-edge technologies that show significant promise for electronics and related applications in which nanotechnology plays a key role.


Book Synopsis Microelectronics to Nanoelectronics by : Anupama B. Kaul

Download or read book Microelectronics to Nanoelectronics written by Anupama B. Kaul and published by CRC Press. This book was released on 2017-12-19 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt: Composed of contributions from top experts, Microelectronics to Nanoelectronics: Materials, Devices and Manufacturability offers a detailed overview of important recent scientific and technological developments in the rapidly evolving nanoelectronics arena. Under the editorial guidance and technical expertise of noted materials scientist Anupama B. Kaul of California Institute of Technology’s Jet Propulsion Lab, this book captures the ascent of microelectronics into the nanoscale realm. It addresses a wide variety of important scientific and technological issues in nanoelectronics research and development. The book also showcases some key application areas of micro-electro-mechanical-systems (MEMS) that have reached the commercial realm. Capitalizing on Dr. Kaul’s considerable technical experience with micro- and nanotechnologies and her extensive research in prestigious academic and industrial labs, the book offers a fresh perspective on application-driven research in micro- and nanoelectronics, including MEMS. Chapters explore how rapid developments in this area are transitioning from the lab to the market, where new and exciting materials, devices, and manufacturing technologies are revolutionizing the electronics industry. Although many micro- and nanotechnologies still face major scientific and technological challenges and remain within the realm of academic research labs, rapid advances in this area have led to the recent emergence of new applications and markets. This handbook encapsulates that exciting recent progress by providing high-quality content contributed by international experts from academia, leading industrial institutions—such as Hewlett-Packard—and government laboratories including the U.S. Department of Energy’s Sandia National Laboratory. Offering something for everyone, from students to scientists to entrepreneurs, this book showcases the broad spectrum of cutting-edge technologies that show significant promise for electronics and related applications in which nanotechnology plays a key role.

Thermal Management of Microelectronic Equipment

Thermal Management of Microelectronic Equipment

Author: Lian-Tuu Yeh

Publisher: American Society of Mechanical Engineers

Published: 2002

Total Pages: 456

ISBN-13:

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With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.


Book Synopsis Thermal Management of Microelectronic Equipment by : Lian-Tuu Yeh

Download or read book Thermal Management of Microelectronic Equipment written by Lian-Tuu Yeh and published by American Society of Mechanical Engineers. This book was released on 2002 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.

Introduction to Microsystem Technology

Introduction to Microsystem Technology

Author: Gerald Gerlach

Publisher: John Wiley & Sons

Published: 2008-04-30

Total Pages: 376

ISBN-13: 0470770929

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Over half a century after the discovery of the piezoresistive effect, microsystem technology has experienced considerable developments. Expanding the opportunities of microelectronics to non-electronic systems, its number of application fields continues to increase. Microsensors are one of the most important fields, used in medical applications and micromechanics. Microfluidic systems are also a significant area, most commonly used in ink-jet printer heads. This textbook focuses on the essentials of microsystems technology, providing a knowledgeable grounding and a clear path through this well-established scientific dicipline. With a methodical, student-orientated approach, Introduction to Microsystem Technology covers the following: microsystem materials (including silicon, polymers and thin films), and the scaling effects of going micro; fabrication techniques based on different material properties, descriptions of their limitations and functional and shape elements produced by these techniques; sensors and actuators based on elements such as mechanical, fluidic, and thermal (yaw rate sensor components are described); the influence of technology parameters on microsystem properties, asking, for example, when is the function of a microsystem device robust and safe? The book presents problems at the end of each chapter so that you may test your understanding of the key concepts (full solutions for these are given on an accompanying website). Practical examples are included also, as well as case studies that enable a better understanding of the technology as a whole. With its extensive treatment on the fundamentals of microsystem technology, this book also serves as a compendium for engineers and technicians working with microsystem technology.


Book Synopsis Introduction to Microsystem Technology by : Gerald Gerlach

Download or read book Introduction to Microsystem Technology written by Gerald Gerlach and published by John Wiley & Sons. This book was released on 2008-04-30 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: Over half a century after the discovery of the piezoresistive effect, microsystem technology has experienced considerable developments. Expanding the opportunities of microelectronics to non-electronic systems, its number of application fields continues to increase. Microsensors are one of the most important fields, used in medical applications and micromechanics. Microfluidic systems are also a significant area, most commonly used in ink-jet printer heads. This textbook focuses on the essentials of microsystems technology, providing a knowledgeable grounding and a clear path through this well-established scientific dicipline. With a methodical, student-orientated approach, Introduction to Microsystem Technology covers the following: microsystem materials (including silicon, polymers and thin films), and the scaling effects of going micro; fabrication techniques based on different material properties, descriptions of their limitations and functional and shape elements produced by these techniques; sensors and actuators based on elements such as mechanical, fluidic, and thermal (yaw rate sensor components are described); the influence of technology parameters on microsystem properties, asking, for example, when is the function of a microsystem device robust and safe? The book presents problems at the end of each chapter so that you may test your understanding of the key concepts (full solutions for these are given on an accompanying website). Practical examples are included also, as well as case studies that enable a better understanding of the technology as a whole. With its extensive treatment on the fundamentals of microsystem technology, this book also serves as a compendium for engineers and technicians working with microsystem technology.

Electron-Beam Technology in Microelectronic Fabrication

Electron-Beam Technology in Microelectronic Fabrication

Author: George Brewer

Publisher: Elsevier

Published: 2012-12-02

Total Pages: 377

ISBN-13: 0323153410

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Electron-Beam Technology in Microelectronic Fabrication presents a unified description of the technology of high resolution lithography. This book is organized into six chapters, each treating a major segment of the technology of high resolution lithography. The book examines topics such as the physics of interaction of the electrons with the polymer resist in which the patterns are drawn, the machines that generate and control the beam, and ways of applying electron-beam lithography in device fabrication and in the making of masks for photolithographic replication. Chapter 2 discusses fundamental processes by which patterns are created in resist masks. Chapter 3 describes electron-beam lithography machines, including some details of each of the major elements in the electron-optical column and their effect on the focused electron beam. Chapter 4 presents the use of electron-beam lithography to make discrete devices and integrated circuits. Chapter 5 looks at the techniques and economics of mask fabrication by the use of electron beams. Finally, Chapter 6 presents a comprehensive description and evaluation of the several high resolution replication processes currently under development. This book will be of great value to students and to engineers who want to learn the unique features of high resolution lithography so that they can apply it in research, development, or production of the next generation of microelectronic devices and circuits.


Book Synopsis Electron-Beam Technology in Microelectronic Fabrication by : George Brewer

Download or read book Electron-Beam Technology in Microelectronic Fabrication written by George Brewer and published by Elsevier. This book was released on 2012-12-02 with total page 377 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electron-Beam Technology in Microelectronic Fabrication presents a unified description of the technology of high resolution lithography. This book is organized into six chapters, each treating a major segment of the technology of high resolution lithography. The book examines topics such as the physics of interaction of the electrons with the polymer resist in which the patterns are drawn, the machines that generate and control the beam, and ways of applying electron-beam lithography in device fabrication and in the making of masks for photolithographic replication. Chapter 2 discusses fundamental processes by which patterns are created in resist masks. Chapter 3 describes electron-beam lithography machines, including some details of each of the major elements in the electron-optical column and their effect on the focused electron beam. Chapter 4 presents the use of electron-beam lithography to make discrete devices and integrated circuits. Chapter 5 looks at the techniques and economics of mask fabrication by the use of electron beams. Finally, Chapter 6 presents a comprehensive description and evaluation of the several high resolution replication processes currently under development. This book will be of great value to students and to engineers who want to learn the unique features of high resolution lithography so that they can apply it in research, development, or production of the next generation of microelectronic devices and circuits.

Microelectronic Test Structures for CMOS Technology

Microelectronic Test Structures for CMOS Technology

Author: Manjul Bhushan

Publisher: Springer Science & Business Media

Published: 2011-08-26

Total Pages: 401

ISBN-13: 1441993770

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Microelectronic Test Structures for CMOS Technology and Products addresses the basic concepts of the design of test structures for incorporation within test-vehicles, scribe-lines, and CMOS products. The role of test structures in the development and monitoring of CMOS technologies and products has become ever more important with the increased cost and complexity of development and manufacturing. In this timely volume, IBM scientists Manjul Bhushan and Mark Ketchen emphasize high speed characterization techniques for digital CMOS circuit applications and bridging between circuit performance and characteristics of MOSFETs and other circuit elements. Detailed examples are presented throughout, many of which are equally applicable to other microelectronic technologies as well. The authors’ overarching goal is to provide students and technology practitioners alike a practical guide to the disciplined design and use of test structures that give unambiguous information on the parametrics and performance of digital CMOS technology.


Book Synopsis Microelectronic Test Structures for CMOS Technology by : Manjul Bhushan

Download or read book Microelectronic Test Structures for CMOS Technology written by Manjul Bhushan and published by Springer Science & Business Media. This book was released on 2011-08-26 with total page 401 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic Test Structures for CMOS Technology and Products addresses the basic concepts of the design of test structures for incorporation within test-vehicles, scribe-lines, and CMOS products. The role of test structures in the development and monitoring of CMOS technologies and products has become ever more important with the increased cost and complexity of development and manufacturing. In this timely volume, IBM scientists Manjul Bhushan and Mark Ketchen emphasize high speed characterization techniques for digital CMOS circuit applications and bridging between circuit performance and characteristics of MOSFETs and other circuit elements. Detailed examples are presented throughout, many of which are equally applicable to other microelectronic technologies as well. The authors’ overarching goal is to provide students and technology practitioners alike a practical guide to the disciplined design and use of test structures that give unambiguous information on the parametrics and performance of digital CMOS technology.