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Download or read book Microelectronics, II. written by and published by . This book was released on 1983 with total page 178 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author: Eugene Machlin
Publisher: Elsevier
Published: 2010-07-07
Total Pages: 228
ISBN-13: 0080460402
DOWNLOAD EBOOKThe subject matter of thin-films – which play a key role in microelectronics – divides naturally into two headings: the processing / structure relationship, and the structure / properties relationship. Part II of 'Materials Science in Microelectronics' focuses on the latter of these relationships, examining the effect of structure on the following: • Electrical properties • Magnetic properties • Optical properties • Mechanical properties • Mass transport properties • Interface and junction properties • Defects and properties Captures the importance of thin films to microelectronic development Examines the cause / effect relationship of structure on thin film properties
Download or read book Materials Science in Microelectronics II written by Eugene Machlin and published by Elsevier. This book was released on 2010-07-07 with total page 228 pages. Available in PDF, EPUB and Kindle. Book excerpt: The subject matter of thin-films – which play a key role in microelectronics – divides naturally into two headings: the processing / structure relationship, and the structure / properties relationship. Part II of 'Materials Science in Microelectronics' focuses on the latter of these relationships, examining the effect of structure on the following: • Electrical properties • Magnetic properties • Optical properties • Mechanical properties • Mass transport properties • Interface and junction properties • Defects and properties Captures the importance of thin films to microelectronic development Examines the cause / effect relationship of structure on thin film properties
Author: Rao Tummala
Publisher: Springer Science & Business Media
Published: 1997-01-31
Total Pages: 662
ISBN-13: 9780412084515
DOWNLOAD EBOOKThis thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
Download or read book Microelectronics Packaging Handbook written by Rao Tummala and published by Springer Science & Business Media. This book was released on 1997-01-31 with total page 662 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
Author: C. V. Thompson
Publisher:
Published: 1992-09-30
Total Pages: 352
ISBN-13:
DOWNLOAD EBOOKThe MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Download or read book Materials Reliability in Microelectronics II: Volume 265 written by C. V. Thompson and published by . This book was released on 1992-09-30 with total page 352 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Download or read book Materials Science in Microelectronics: The effects of structure on property in thin films written by E. S. Machlin and published by . This book was released on 1995 with total page 248 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author: Ken Kuang
Publisher: Springer Science & Business Media
Published: 2009-12-01
Total Pages: 295
ISBN-13: 1441909842
DOWNLOAD EBOOKRF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Download or read book RF and Microwave Microelectronics Packaging written by Ken Kuang and published by Springer Science & Business Media. This book was released on 2009-12-01 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Author: G.G. Harman
Publisher: Springer Science & Business Media
Published: 2012-12-06
Total Pages: 295
ISBN-13: 9401151350
DOWNLOAD EBOOKMICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.
Download or read book Microelectronic Interconnections and Assembly written by G.G. Harman and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.
Author: S. Luryi
Publisher: Springer Science & Business Media
Published: 2012-12-06
Total Pages: 417
ISBN-13: 9400917465
DOWNLOAD EBOOKSilicon technology has developed along virtually one single line: reducing the minimal size of lithographic features. But has this taken us to the point of diminishing returns? Are we now at a turning point in the logical evolution of microelectronics? Some believe that the semiconductor microelectronics industry has matured: the research game is over (comparisons with the steel industry are being made). Others believe that qualitative progress in hardware technology will come roaring back, based on innovative research. This debate, spirited as it is, is reflected in the pages of Future Trends in Microelectronics, where such questions are discussed. What kind of research does the silicon industry need to continue its expansion? What is the technical limit to shrinking Si devices? Is there any economic sense in pursuing this limit? What are the most attractive applications of optoelectronic hybrid systems? Are there any green pastures beyond the traditional semiconductor technologies? Identifying the scenario for the future evolution of microelectronics will present a tremendous opportunity for constructive action today.
Download or read book Future Trends in Microelectronics written by S. Luryi and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 417 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon technology has developed along virtually one single line: reducing the minimal size of lithographic features. But has this taken us to the point of diminishing returns? Are we now at a turning point in the logical evolution of microelectronics? Some believe that the semiconductor microelectronics industry has matured: the research game is over (comparisons with the steel industry are being made). Others believe that qualitative progress in hardware technology will come roaring back, based on innovative research. This debate, spirited as it is, is reflected in the pages of Future Trends in Microelectronics, where such questions are discussed. What kind of research does the silicon industry need to continue its expansion? What is the technical limit to shrinking Si devices? Is there any economic sense in pursuing this limit? What are the most attractive applications of optoelectronic hybrid systems? Are there any green pastures beyond the traditional semiconductor technologies? Identifying the scenario for the future evolution of microelectronics will present a tremendous opportunity for constructive action today.
Author: J. Berting
Publisher: Elsevier
Published: 2013-10-22
Total Pages: 276
ISBN-13: 1483146537
DOWNLOAD EBOOKThe Socio-Economic Impact of Microelectronics contains papers presented at an international conference on socio-economic problems and potentialities of the application of micro-electronics held in Zandvoort, the Netherlands, in September 1979. Organized into eight sections, this book begins with the technological evaluation of microelectronics. Subsequent sections focus on the social economic and political consequences of the widespread use of microelectronics; opportunities and problems for socialist countries brought about by microelectronics technology; effects of microelectronics on developing countries; as well as problems connected with industrial relations and organization of work. The influence of the technology on political/economic, epistemological, ethical/moral, and esthetic values and a broad concept of informatics introducing the notions of living and non-living environments as well as of human, non-human, constructed, natural, and abstract systems are explained. The last section contains the conclusions of the chairman of the conference on the application of microelectronics.
Download or read book The Socio-Economic Impact of Microelectronics written by J. Berting and published by Elsevier. This book was released on 2013-10-22 with total page 276 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Socio-Economic Impact of Microelectronics contains papers presented at an international conference on socio-economic problems and potentialities of the application of micro-electronics held in Zandvoort, the Netherlands, in September 1979. Organized into eight sections, this book begins with the technological evaluation of microelectronics. Subsequent sections focus on the social economic and political consequences of the widespread use of microelectronics; opportunities and problems for socialist countries brought about by microelectronics technology; effects of microelectronics on developing countries; as well as problems connected with industrial relations and organization of work. The influence of the technology on political/economic, epistemological, ethical/moral, and esthetic values and a broad concept of informatics introducing the notions of living and non-living environments as well as of human, non-human, constructed, natural, and abstract systems are explained. The last section contains the conclusions of the chairman of the conference on the application of microelectronics.
Author: Soumen Mandal
Publisher: Springer Nature
Published: 2024
Total Pages: 530
ISBN-13: 3031475569
DOWNLOAD EBOOKThis edited book covers a wide range of novel scientific and engineering aspects of diamond films produced from chemical vapor deposition. It focuses on the most recent developments and achievements in this rapidly growing field from scientists and engineers across the domains of chemistry, biology, medicine, physics, and semiconductor engineering. The latest volume of this consistently well-cited book brings an updated, systematic review of the latest developments in diamond research and application. Featuring contributed chapters from a mix of highly-active international researchers, this new edition presents recent research focusing on topics such as diamond for thermal management in high-power electronics, diamond MOSFETs, water treatment, application of machine learning for nanodiamonds, theoretical aspects of diamond growth, current trends in emerging diamond technologies, and the growth of doped single-crystal diamond. This book is especially appealing to interdisciplinary researchers and industry professionals working on advanced diamond devices and applications, as well as theoretical and computational methods for predicting and designing new diamond materials.
Download or read book Novel Aspects of Diamond II written by Soumen Mandal and published by Springer Nature. This book was released on 2024 with total page 530 pages. Available in PDF, EPUB and Kindle. Book excerpt: This edited book covers a wide range of novel scientific and engineering aspects of diamond films produced from chemical vapor deposition. It focuses on the most recent developments and achievements in this rapidly growing field from scientists and engineers across the domains of chemistry, biology, medicine, physics, and semiconductor engineering. The latest volume of this consistently well-cited book brings an updated, systematic review of the latest developments in diamond research and application. Featuring contributed chapters from a mix of highly-active international researchers, this new edition presents recent research focusing on topics such as diamond for thermal management in high-power electronics, diamond MOSFETs, water treatment, application of machine learning for nanodiamonds, theoretical aspects of diamond growth, current trends in emerging diamond technologies, and the growth of doped single-crystal diamond. This book is especially appealing to interdisciplinary researchers and industry professionals working on advanced diamond devices and applications, as well as theoretical and computational methods for predicting and designing new diamond materials.
