Minimum Number of Timing Signoff Corners

Minimum Number of Timing Signoff Corners

Author: Alexander Tetelbaum

Publisher: Alexander Tetelbaum

Published: 2024-05-09

Total Pages: 138

ISBN-13:

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This unique book outlines a brand-new approach of how to do timing signoff of complex microchips with the minimum number of corners. It is the first book in my planned series of books on global and local on-chip variations (OCV) and statistical, Monte-Carlo-based methods of timing signoff. I have spent more than 7 years on developing those new methods and now will share my results with the electronic design community. Each book will have a short version as a E-book that will be followed by a paperback/cover full version book with all important details. The books are mainly targeting microchip designers and software engineers in Electronic Design Automation (EDA) companies as well as companies that design and/or manufacture microchips. The number of timing signoff corners exponentially grows and makes microchip design very complex, time consuming, or even impossible to close timing. Additionally, there is a toll on microchip performance due to conservatism, which increases with the corner number. All delay, dimension, and other absolute values are scaled (or normalized) and do not represent real values/parameters of any particular technology node or design. Initially, I focus on factors impacting the corner number and how to find the minimum number of traditional Power, Voltage, Temperature (PVT), and Resistance, Capacitance (RC) corners. Then, I outline a break-through method with the absolute minimum of the corner number where instead of PVT/RC corners I introduce 4 min/max timing delay corners (so-called slack corners). Then, I discuss a new approach on how to design for the maximum profit by setting a proper target for the timing yield Y during timing signoff. Finally, I discuss possible enhancements in signoff paradigms, methods, and statistical STA tools. The importance of these pseudo- and fully statistical Monte Carlo-based post-STA methods is to study OCV variations in detail and justify all OCV derates for STA tools no matter whether the PVT/RC corners signoff is or the 4-slack corners is used.


Book Synopsis Minimum Number of Timing Signoff Corners by : Alexander Tetelbaum

Download or read book Minimum Number of Timing Signoff Corners written by Alexander Tetelbaum and published by Alexander Tetelbaum. This book was released on 2024-05-09 with total page 138 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique book outlines a brand-new approach of how to do timing signoff of complex microchips with the minimum number of corners. It is the first book in my planned series of books on global and local on-chip variations (OCV) and statistical, Monte-Carlo-based methods of timing signoff. I have spent more than 7 years on developing those new methods and now will share my results with the electronic design community. Each book will have a short version as a E-book that will be followed by a paperback/cover full version book with all important details. The books are mainly targeting microchip designers and software engineers in Electronic Design Automation (EDA) companies as well as companies that design and/or manufacture microchips. The number of timing signoff corners exponentially grows and makes microchip design very complex, time consuming, or even impossible to close timing. Additionally, there is a toll on microchip performance due to conservatism, which increases with the corner number. All delay, dimension, and other absolute values are scaled (or normalized) and do not represent real values/parameters of any particular technology node or design. Initially, I focus on factors impacting the corner number and how to find the minimum number of traditional Power, Voltage, Temperature (PVT), and Resistance, Capacitance (RC) corners. Then, I outline a break-through method with the absolute minimum of the corner number where instead of PVT/RC corners I introduce 4 min/max timing delay corners (so-called slack corners). Then, I discuss a new approach on how to design for the maximum profit by setting a proper target for the timing yield Y during timing signoff. Finally, I discuss possible enhancements in signoff paradigms, methods, and statistical STA tools. The importance of these pseudo- and fully statistical Monte Carlo-based post-STA methods is to study OCV variations in detail and justify all OCV derates for STA tools no matter whether the PVT/RC corners signoff is or the 4-slack corners is used.

Minimum Number of Timing Signoff Corners

Minimum Number of Timing Signoff Corners

Author: Alexander Tetelbaum

Publisher: Alexander Tetelbaum

Published: 2024-05-08

Total Pages: 0

ISBN-13:

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This unique book outlines a brand new approach how to timing the signoff of complex microchips with the minimum number of corners. It is the first book in my planned series of books on global and local on-chip variations (OCV) and statistical, Monte-Carlo-based methods of timing signoff. I have spent more than 7 years developing those new methods and now will share my results with the electronic design community. Each book will have a short version as a Kindle e-book that will be followed by a paperback/cover full version book with all important details. The books are mainly targeting microchip designers and software engineers in Electronic Design Automation (EDA) companies as well as companies that design and/or manufacture microchips. The number of timing signoff corners exponentially grows and makes microchip design very complex, time-consuming, or even impossible to close timing. Additionally, there is a toll on microchip performance due to conservatism, which increases with the corner number. All delay, dimension, and other absolute values are scaled (or normalized) and do not represent real values/parameters of any particular technology node or design. Initially, I focus on factors impacting the corner number and how to find the minimum number of traditional Power, Voltage, Temperature (PVT), and Resistance, Capacitance (RC) corners. Then, I describe a break-through method with the absolute minimum of the corner number where instead of PVT/RC corners I introduce 4 min/max timing delay corners (so-called slack corners). Then, I discuss a new approach on how to design for the maximum profit by setting a proper target for the timing yield Y during timing signoff. Finally, I discuss possible enhancements in signoff paradigms, methods, and statistical STA tools. The importance of these pseudo- and fully statistical Monte Carlo-based post-STA methods is to study OCV variations in detail and justify all OCV derates for STA tools no matter whether the PVT/RC corners signoff is or the 4-slack corners is used.


Book Synopsis Minimum Number of Timing Signoff Corners by : Alexander Tetelbaum

Download or read book Minimum Number of Timing Signoff Corners written by Alexander Tetelbaum and published by Alexander Tetelbaum. This book was released on 2024-05-08 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique book outlines a brand new approach how to timing the signoff of complex microchips with the minimum number of corners. It is the first book in my planned series of books on global and local on-chip variations (OCV) and statistical, Monte-Carlo-based methods of timing signoff. I have spent more than 7 years developing those new methods and now will share my results with the electronic design community. Each book will have a short version as a Kindle e-book that will be followed by a paperback/cover full version book with all important details. The books are mainly targeting microchip designers and software engineers in Electronic Design Automation (EDA) companies as well as companies that design and/or manufacture microchips. The number of timing signoff corners exponentially grows and makes microchip design very complex, time-consuming, or even impossible to close timing. Additionally, there is a toll on microchip performance due to conservatism, which increases with the corner number. All delay, dimension, and other absolute values are scaled (or normalized) and do not represent real values/parameters of any particular technology node or design. Initially, I focus on factors impacting the corner number and how to find the minimum number of traditional Power, Voltage, Temperature (PVT), and Resistance, Capacitance (RC) corners. Then, I describe a break-through method with the absolute minimum of the corner number where instead of PVT/RC corners I introduce 4 min/max timing delay corners (so-called slack corners). Then, I discuss a new approach on how to design for the maximum profit by setting a proper target for the timing yield Y during timing signoff. Finally, I discuss possible enhancements in signoff paradigms, methods, and statistical STA tools. The importance of these pseudo- and fully statistical Monte Carlo-based post-STA methods is to study OCV variations in detail and justify all OCV derates for STA tools no matter whether the PVT/RC corners signoff is or the 4-slack corners is used.

Emerging Technologies and Circuits

Emerging Technologies and Circuits

Author: Amara Amara

Publisher: Springer Science & Business Media

Published: 2010-09-28

Total Pages: 266

ISBN-13: 9048193796

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Emerging Technologies and Circuits contains a set of outstanding papers, keynote and tutorials presented during 3 days at the International Conference On Integrated Circuit Design and Technology (ICICDT) held in June 2008 in Minatec, Grenoble.


Book Synopsis Emerging Technologies and Circuits by : Amara Amara

Download or read book Emerging Technologies and Circuits written by Amara Amara and published by Springer Science & Business Media. This book was released on 2010-09-28 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: Emerging Technologies and Circuits contains a set of outstanding papers, keynote and tutorials presented during 3 days at the International Conference On Integrated Circuit Design and Technology (ICICDT) held in June 2008 in Minatec, Grenoble.

The Art of Timing Closure

The Art of Timing Closure

Author: Khosrow Golshan

Publisher: Springer Nature

Published: 2020-08-03

Total Pages: 212

ISBN-13: 3030496368

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The Art of Timing Closure is written using a hands-on approach to describe advanced concepts and techniques using Multi-Mode Multi-Corner (MMMC) for an advanced ASIC design implementation. It focuses on the physical design, Static Timing Analysis (STA), formal and physical verification. The scripts in this book are based on Cadence® Encounter SystemTM. However, if the reader uses a different EDA tool, that tool’s commands are similar to those shown in this book. The topics covered are as follows: Data Structures Multi-Mode Multi-Corner Analysis Design Constraints Floorplan and Timing Placement and Timing Clock Tree Synthesis Final Route and Timing Design Signoff Rather than go into great technical depth, the author emphasizes short, clear descriptions which are implemented by references to authoritative manuscripts. It is the goal of this book to capture the essence of physical design and timing analysis at each stage of the physical design, and to show the reader that physical design and timing analysis engineering should be viewed as a single area of expertise. This book is intended for anyone who is involved in ASIC design implementation -- starting from physical design to final design signoff. Target audiences for this book are practicing ASIC design implementation engineers and students undertaking advanced courses in ASIC design.


Book Synopsis The Art of Timing Closure by : Khosrow Golshan

Download or read book The Art of Timing Closure written by Khosrow Golshan and published by Springer Nature. This book was released on 2020-08-03 with total page 212 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Art of Timing Closure is written using a hands-on approach to describe advanced concepts and techniques using Multi-Mode Multi-Corner (MMMC) for an advanced ASIC design implementation. It focuses on the physical design, Static Timing Analysis (STA), formal and physical verification. The scripts in this book are based on Cadence® Encounter SystemTM. However, if the reader uses a different EDA tool, that tool’s commands are similar to those shown in this book. The topics covered are as follows: Data Structures Multi-Mode Multi-Corner Analysis Design Constraints Floorplan and Timing Placement and Timing Clock Tree Synthesis Final Route and Timing Design Signoff Rather than go into great technical depth, the author emphasizes short, clear descriptions which are implemented by references to authoritative manuscripts. It is the goal of this book to capture the essence of physical design and timing analysis at each stage of the physical design, and to show the reader that physical design and timing analysis engineering should be viewed as a single area of expertise. This book is intended for anyone who is involved in ASIC design implementation -- starting from physical design to final design signoff. Target audiences for this book are practicing ASIC design implementation engineers and students undertaking advanced courses in ASIC design.

Static Timing Analysis for Nanometer Designs

Static Timing Analysis for Nanometer Designs

Author: J. Bhasker

Publisher: Springer Science & Business Media

Published: 2009-04-03

Total Pages: 588

ISBN-13: 0387938206

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iming, timing, timing! That is the main concern of a digital designer charged with designing a semiconductor chip. What is it, how is it T described, and how does one verify it? The design team of a large digital design may spend months architecting and iterating the design to achieve the required timing target. Besides functional verification, the t- ing closure is the major milestone which dictates when a chip can be - leased to the semiconductor foundry for fabrication. This book addresses the timing verification using static timing analysis for nanometer designs. The book has originated from many years of our working in the area of timing verification for complex nanometer designs. We have come across many design engineers trying to learn the background and various aspects of static timing analysis. Unfortunately, there is no book currently ava- able that can be used by a working engineer to get acquainted with the - tails of static timing analysis. The chip designers lack a central reference for information on timing, that covers the basics to the advanced timing veri- cation procedures and techniques.


Book Synopsis Static Timing Analysis for Nanometer Designs by : J. Bhasker

Download or read book Static Timing Analysis for Nanometer Designs written by J. Bhasker and published by Springer Science & Business Media. This book was released on 2009-04-03 with total page 588 pages. Available in PDF, EPUB and Kindle. Book excerpt: iming, timing, timing! That is the main concern of a digital designer charged with designing a semiconductor chip. What is it, how is it T described, and how does one verify it? The design team of a large digital design may spend months architecting and iterating the design to achieve the required timing target. Besides functional verification, the t- ing closure is the major milestone which dictates when a chip can be - leased to the semiconductor foundry for fabrication. This book addresses the timing verification using static timing analysis for nanometer designs. The book has originated from many years of our working in the area of timing verification for complex nanometer designs. We have come across many design engineers trying to learn the background and various aspects of static timing analysis. Unfortunately, there is no book currently ava- able that can be used by a working engineer to get acquainted with the - tails of static timing analysis. The chip designers lack a central reference for information on timing, that covers the basics to the advanced timing veri- cation procedures and techniques.

ASIC Design Implementation Process

ASIC Design Implementation Process

Author: Khosrow Golshan

Publisher: Springer Nature

Published:

Total Pages: 143

ISBN-13: 3031586530

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Book Synopsis ASIC Design Implementation Process by : Khosrow Golshan

Download or read book ASIC Design Implementation Process written by Khosrow Golshan and published by Springer Nature. This book was released on with total page 143 pages. Available in PDF, EPUB and Kindle. Book excerpt:

An ASIC Low Power Primer

An ASIC Low Power Primer

Author: Rakesh Chadha

Publisher: Springer Science & Business Media

Published: 2012-12-05

Total Pages: 226

ISBN-13: 1461442710

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This book provides an invaluable primer on the techniques utilized in the design of low power digital semiconductor devices. Readers will benefit from the hands-on approach which starts form the ground-up, explaining with basic examples what power is, how it is measured and how it impacts on the design process of application-specific integrated circuits (ASICs). The authors use both the Unified Power Format (UPF) and Common Power Format (CPF) to describe in detail the power intent for an ASIC and then guide readers through a variety of architectural and implementation techniques that will help meet the power intent. From analyzing system power consumption, to techniques that can be employed in a low power design, to a detailed description of two alternate standards for capturing the power directives at various phases of the design, this book is filled with information that will give ASIC designers a competitive edge in low-power design.


Book Synopsis An ASIC Low Power Primer by : Rakesh Chadha

Download or read book An ASIC Low Power Primer written by Rakesh Chadha and published by Springer Science & Business Media. This book was released on 2012-12-05 with total page 226 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an invaluable primer on the techniques utilized in the design of low power digital semiconductor devices. Readers will benefit from the hands-on approach which starts form the ground-up, explaining with basic examples what power is, how it is measured and how it impacts on the design process of application-specific integrated circuits (ASICs). The authors use both the Unified Power Format (UPF) and Common Power Format (CPF) to describe in detail the power intent for an ASIC and then guide readers through a variety of architectural and implementation techniques that will help meet the power intent. From analyzing system power consumption, to techniques that can be employed in a low power design, to a detailed description of two alternate standards for capturing the power directives at various phases of the design, this book is filled with information that will give ASIC designers a competitive edge in low-power design.

The Fourth Terminal

The Fourth Terminal

Author: Sylvain Clerc

Publisher: Springer Nature

Published: 2020-04-25

Total Pages: 433

ISBN-13: 3030394964

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This book discusses the advantages and challenges of Body-Biasing for integrated circuits and systems, together with the deployment of the design infrastructure needed to generate this Body-Bias voltage. These new design solutions enable state of the art energy efficiency and system flexibility for the latest applications, such as Internet of Things and 5G communications.


Book Synopsis The Fourth Terminal by : Sylvain Clerc

Download or read book The Fourth Terminal written by Sylvain Clerc and published by Springer Nature. This book was released on 2020-04-25 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the advantages and challenges of Body-Biasing for integrated circuits and systems, together with the deployment of the design infrastructure needed to generate this Body-Bias voltage. These new design solutions enable state of the art energy efficiency and system flexibility for the latest applications, such as Internet of Things and 5G communications.

Handbook of 3D Integration, Volume 4

Handbook of 3D Integration, Volume 4

Author: Paul D. Franzon

Publisher: John Wiley & Sons

Published: 2019-01-25

Total Pages: 265

ISBN-13: 3527697047

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This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration. This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.


Book Synopsis Handbook of 3D Integration, Volume 4 by : Paul D. Franzon

Download or read book Handbook of 3D Integration, Volume 4 written by Paul D. Franzon and published by John Wiley & Sons. This book was released on 2019-01-25 with total page 265 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration. This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

Network-on-Chip

Network-on-Chip

Author: Santanu Kundu

Publisher: CRC Press

Published: 2018-09-03

Total Pages: 388

ISBN-13: 1466565276

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Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems.


Book Synopsis Network-on-Chip by : Santanu Kundu

Download or read book Network-on-Chip written by Santanu Kundu and published by CRC Press. This book was released on 2018-09-03 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems.