Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Author: Ephraim Suhir

Publisher: Springer Science & Business Media

Published: 2007-05-26

Total Pages: 1471

ISBN-13: 0387329897

DOWNLOAD EBOOK

This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.


Book Synopsis Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging by : Ephraim Suhir

Download or read book Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging written by Ephraim Suhir and published by Springer Science & Business Media. This book was released on 2007-05-26 with total page 1471 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Handbook of Optoelectronics (Two-Volume Set)

Handbook of Optoelectronics (Two-Volume Set)

Author: John P. Dakin

Publisher: CRC Press

Published: 2006-05-17

Total Pages: 832

ISBN-13: 9780750306461

DOWNLOAD EBOOK

A field as diverse as optoelectronics needs a reference that is equally versatile. From basic physics and light sources to devices and state-of-the-art applications, the Handbook of Optoelectronics provides comprehensive, self-contained coverage of fundamental concepts and practical applications across the entire spectrum of disciplines encompassed by optoelectronics. The handbook unifies a broad array of current research areas with a forward-looking focus on systems and applications. Beginning with an introduction to the relevant principles of physics, materials science, engineering, and optics, the book explores the details of optoelectronic devices and techniques including semiconductor lasers, optical detectors and receivers, optical fiber devices, modulators, amplifiers, integrated optics, LEDs, and engineered optical materials. Applications and systems then become the focus, with sections devoted to industrial, medical, and commercial applications, communications, imaging and displays, sensing and data processing, spectroscopic analysis, the art of practical optoelectronics, and future prospects. This extensive resource comprises the efforts of more than 70 world-renowned experts from leading industrial and academic institutions around the world and includes many references to contemporary works. Whether used as a field reference, as a research tool, or as a broad and self-contained introduction to the field, the Handbook of Optoelectronics places everything you need in a unified, conveniently organized format.


Book Synopsis Handbook of Optoelectronics (Two-Volume Set) by : John P. Dakin

Download or read book Handbook of Optoelectronics (Two-Volume Set) written by John P. Dakin and published by CRC Press. This book was released on 2006-05-17 with total page 832 pages. Available in PDF, EPUB and Kindle. Book excerpt: A field as diverse as optoelectronics needs a reference that is equally versatile. From basic physics and light sources to devices and state-of-the-art applications, the Handbook of Optoelectronics provides comprehensive, self-contained coverage of fundamental concepts and practical applications across the entire spectrum of disciplines encompassed by optoelectronics. The handbook unifies a broad array of current research areas with a forward-looking focus on systems and applications. Beginning with an introduction to the relevant principles of physics, materials science, engineering, and optics, the book explores the details of optoelectronic devices and techniques including semiconductor lasers, optical detectors and receivers, optical fiber devices, modulators, amplifiers, integrated optics, LEDs, and engineered optical materials. Applications and systems then become the focus, with sections devoted to industrial, medical, and commercial applications, communications, imaging and displays, sensing and data processing, spectroscopic analysis, the art of practical optoelectronics, and future prospects. This extensive resource comprises the efforts of more than 70 world-renowned experts from leading industrial and academic institutions around the world and includes many references to contemporary works. Whether used as a field reference, as a research tool, or as a broad and self-contained introduction to the field, the Handbook of Optoelectronics places everything you need in a unified, conveniently organized format.

Optoelectronic Packaging

Optoelectronic Packaging

Author: Michael R. Feldman

Publisher: SPIE-International Society for Optical Engineering

Published: 1996

Total Pages: 212

ISBN-13:

DOWNLOAD EBOOK


Book Synopsis Optoelectronic Packaging by : Michael R. Feldman

Download or read book Optoelectronic Packaging written by Michael R. Feldman and published by SPIE-International Society for Optical Engineering. This book was released on 1996 with total page 212 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Optoelectronic Integration: Physics, Technology and Applications

Optoelectronic Integration: Physics, Technology and Applications

Author: Osamu Wada

Publisher: Springer Science & Business Media

Published: 2013-11-27

Total Pages: 464

ISBN-13: 1461526868

DOWNLOAD EBOOK

As we approach the end of the present century, the elementary particles of light (photons) are seen to be competing increasingly with the elementary particles of charge (electrons/holes) in the task of transmitting and processing the insatiable amounts of infonnation needed by society. The massive enhancements in electronic signal processing that have taken place since the discovery of the transistor, elegantly demonstrate how we have learned to make use of the strong interactions that exist between assemblages of electrons and holes, disposed in suitably designed geometries, and replicated on an increasingly fine scale. On the other hand, photons interact extremely weakly amongst themselves and all-photonic active circuit elements, where photons control photons, are presently very difficult to realise, particularly in small volumes. Fortunately rapid developments in the design and understanding of semiconductor injection lasers coupled with newly recognized quantum phenomena, that arise when device dimensions become comparable with electronic wavelengths, have clearly demonstrated how efficient and fast the interaction between electrons and photons can be. This latter situation has therefore provided a strong incentive to devise and study monolithic integrated circuits which involve both electrons and photons in their operation. As chapter I notes, it is barely fifteen years ago since the first demonstration of simple optoelectronic integrated circuits were realised using m-V compound semiconductors; these combined either a laser/driver or photodetector/preamplifier combination.


Book Synopsis Optoelectronic Integration: Physics, Technology and Applications by : Osamu Wada

Download or read book Optoelectronic Integration: Physics, Technology and Applications written by Osamu Wada and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt: As we approach the end of the present century, the elementary particles of light (photons) are seen to be competing increasingly with the elementary particles of charge (electrons/holes) in the task of transmitting and processing the insatiable amounts of infonnation needed by society. The massive enhancements in electronic signal processing that have taken place since the discovery of the transistor, elegantly demonstrate how we have learned to make use of the strong interactions that exist between assemblages of electrons and holes, disposed in suitably designed geometries, and replicated on an increasingly fine scale. On the other hand, photons interact extremely weakly amongst themselves and all-photonic active circuit elements, where photons control photons, are presently very difficult to realise, particularly in small volumes. Fortunately rapid developments in the design and understanding of semiconductor injection lasers coupled with newly recognized quantum phenomena, that arise when device dimensions become comparable with electronic wavelengths, have clearly demonstrated how efficient and fast the interaction between electrons and photons can be. This latter situation has therefore provided a strong incentive to devise and study monolithic integrated circuits which involve both electrons and photons in their operation. As chapter I notes, it is barely fifteen years ago since the first demonstration of simple optoelectronic integrated circuits were realised using m-V compound semiconductors; these combined either a laser/driver or photodetector/preamplifier combination.

Introduction to Microsystem Packaging Technology

Introduction to Microsystem Packaging Technology

Author: Yufeng Jin

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 233

ISBN-13: 1351832972

DOWNLOAD EBOOK

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.


Book Synopsis Introduction to Microsystem Packaging Technology by : Yufeng Jin

Download or read book Introduction to Microsystem Packaging Technology written by Yufeng Jin and published by CRC Press. This book was released on 2017-12-19 with total page 233 pages. Available in PDF, EPUB and Kindle. Book excerpt: The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.

Materials in Microelectronic and Optoelectronic Packaging

Materials in Microelectronic and Optoelectronic Packaging

Author: Hung C. Ling

Publisher:

Published: 1993

Total Pages: 490

ISBN-13:

DOWNLOAD EBOOK


Book Synopsis Materials in Microelectronic and Optoelectronic Packaging by : Hung C. Ling

Download or read book Materials in Microelectronic and Optoelectronic Packaging written by Hung C. Ling and published by . This book was released on 1993 with total page 490 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Photonic Networks, Optical Technology and Infrastructure

Photonic Networks, Optical Technology and Infrastructure

Author: D. W. Faulkner

Publisher: IOS Press

Published: 1997

Total Pages: 316

ISBN-13: 9789051993417

DOWNLOAD EBOOK

All optical networks offer new possibilities for high bandwidth applications. New techniques are demonstrated for optical switching and network management for complex optical networks. WDM systems allow upgrading of the backbone optical network. This work explores the current state of research and future developments of optical network technology and applications. Photonic networks are discussed from a variety of viewpoints, including network analysis, modelling and simulation, active and passive devices, as well as packaging.


Book Synopsis Photonic Networks, Optical Technology and Infrastructure by : D. W. Faulkner

Download or read book Photonic Networks, Optical Technology and Infrastructure written by D. W. Faulkner and published by IOS Press. This book was released on 1997 with total page 316 pages. Available in PDF, EPUB and Kindle. Book excerpt: All optical networks offer new possibilities for high bandwidth applications. New techniques are demonstrated for optical switching and network management for complex optical networks. WDM systems allow upgrading of the backbone optical network. This work explores the current state of research and future developments of optical network technology and applications. Photonic networks are discussed from a variety of viewpoints, including network analysis, modelling and simulation, active and passive devices, as well as packaging.

Optoelectronic Interconnects, Integrated Circuits, and Packaging

Optoelectronic Interconnects, Integrated Circuits, and Packaging

Author: Louay A. Eldada

Publisher: SPIE-International Society for Optical Engineering

Published: 2002

Total Pages: 272

ISBN-13:

DOWNLOAD EBOOK


Book Synopsis Optoelectronic Interconnects, Integrated Circuits, and Packaging by : Louay A. Eldada

Download or read book Optoelectronic Interconnects, Integrated Circuits, and Packaging written by Louay A. Eldada and published by SPIE-International Society for Optical Engineering. This book was released on 2002 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Fiber Optic Data Communication

Fiber Optic Data Communication

Author: Casimer DeCusatis

Publisher: Academic Press

Published: 2002-03-08

Total Pages: 584

ISBN-13: 0122078926

DOWNLOAD EBOOK

History of fiber optics / Jeff D. Montgomery -- Market analysis and business planning / Yann Y. Morvan and Ronald C. Lasky -- Small form factor fiber optic connectors / John Fox and Casimer DeCusatis -- Specialty fiber optic cables / Casimer DeCusatis and John Fox -- Optical wavelength division multiplexing for data communication networks / Casimer DeCusatis -- Optical backplanes, board and chip interconnects / Rainer Michalzik -- Parallel computer architectures using fiber optics / David B. Sher and Casimer DeCusatis -- Packaging assembly techniques / Ronald C. Lasky, Adam Singer, and Prashant Chouta -- InfiniBand, the interconnect from backplane to fiber / Ali Ghiasi -- New devices for optoelectronics : smart pixels / Barry L. Shoop, Andre H. Sayles, and Daniel M. Litynski -- Emerging technology for fiber optic data communication / Chung-Sheng Li -- Manufacturing challenges / Eric Maass.


Book Synopsis Fiber Optic Data Communication by : Casimer DeCusatis

Download or read book Fiber Optic Data Communication written by Casimer DeCusatis and published by Academic Press. This book was released on 2002-03-08 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: History of fiber optics / Jeff D. Montgomery -- Market analysis and business planning / Yann Y. Morvan and Ronald C. Lasky -- Small form factor fiber optic connectors / John Fox and Casimer DeCusatis -- Specialty fiber optic cables / Casimer DeCusatis and John Fox -- Optical wavelength division multiplexing for data communication networks / Casimer DeCusatis -- Optical backplanes, board and chip interconnects / Rainer Michalzik -- Parallel computer architectures using fiber optics / David B. Sher and Casimer DeCusatis -- Packaging assembly techniques / Ronald C. Lasky, Adam Singer, and Prashant Chouta -- InfiniBand, the interconnect from backplane to fiber / Ali Ghiasi -- New devices for optoelectronics : smart pixels / Barry L. Shoop, Andre H. Sayles, and Daniel M. Litynski -- Emerging technology for fiber optic data communication / Chung-Sheng Li -- Manufacturing challenges / Eric Maass.

Advanced Materials for Integrated Optical Waveguides

Advanced Materials for Integrated Optical Waveguides

Author: Xingcun Colin Tong Ph.D

Publisher: Springer Science & Business Media

Published: 2013-10-17

Total Pages: 574

ISBN-13: 3319015508

DOWNLOAD EBOOK

This book provides a comprehensive introduction to integrated optical waveguides for information technology and data communications. Integrated coverage ranges from advanced materials, fabrication, and characterization techniques to guidelines for design and simulation. A concluding chapter offers perspectives on likely future trends and challenges. The dramatic scaling down of feature sizes has driven exponential improvements in semiconductor productivity and performance in the past several decades. However, with the potential of gigascale integration, size reduction is approaching a physical limitation due to the negative impact on resistance and inductance of metal interconnects with current copper-trace based technology. Integrated optics provides a potentially lower-cost, higher performance alternative to electronics in optical communication systems. Optical interconnects, in which light can be generated, guided, modulated, amplified, and detected, can provide greater bandwidth, lower power consumption, decreased interconnect delays, resistance to electromagnetic interference, and reduced crosstalk when integrated into standard electronic circuits. Integrated waveguide optics represents a truly multidisciplinary field of science and engineering, with continued growth requiring new developments in modeling, further advances in materials science, and innovations in integration platforms. In addition, the processing and fabrication of these new devices must be optimized in conjunction with the development of accurate and precise characterization and testing methods. Students and professionals in materials science and engineering will find Advanced Materials for Integrated Optical Waveguides to be an invaluable reference for meeting these research and development goals.


Book Synopsis Advanced Materials for Integrated Optical Waveguides by : Xingcun Colin Tong Ph.D

Download or read book Advanced Materials for Integrated Optical Waveguides written by Xingcun Colin Tong Ph.D and published by Springer Science & Business Media. This book was released on 2013-10-17 with total page 574 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive introduction to integrated optical waveguides for information technology and data communications. Integrated coverage ranges from advanced materials, fabrication, and characterization techniques to guidelines for design and simulation. A concluding chapter offers perspectives on likely future trends and challenges. The dramatic scaling down of feature sizes has driven exponential improvements in semiconductor productivity and performance in the past several decades. However, with the potential of gigascale integration, size reduction is approaching a physical limitation due to the negative impact on resistance and inductance of metal interconnects with current copper-trace based technology. Integrated optics provides a potentially lower-cost, higher performance alternative to electronics in optical communication systems. Optical interconnects, in which light can be generated, guided, modulated, amplified, and detected, can provide greater bandwidth, lower power consumption, decreased interconnect delays, resistance to electromagnetic interference, and reduced crosstalk when integrated into standard electronic circuits. Integrated waveguide optics represents a truly multidisciplinary field of science and engineering, with continued growth requiring new developments in modeling, further advances in materials science, and innovations in integration platforms. In addition, the processing and fabrication of these new devices must be optimized in conjunction with the development of accurate and precise characterization and testing methods. Students and professionals in materials science and engineering will find Advanced Materials for Integrated Optical Waveguides to be an invaluable reference for meeting these research and development goals.