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Download or read book The 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits written by and published by . This book was released on 2015 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the 8th International Workshop on the Electromagnetic Compatibility of Integrated Circuits written by and published by . This book was released on 2011 with total page 262 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author: IEEE Staff
Publisher:
Published: 2019-10-21
Total Pages:
ISBN-13: 9781728142630
DOWNLOAD EBOOKThe workshop will presents the state ofarts on IC electromagnetic compatibility related issues, not only fundamental improvements in modeling and measurement, but also novel design methodologies and standards
Download or read book 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) written by IEEE Staff and published by . This book was released on 2019-10-21 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The workshop will presents the state ofarts on IC electromagnetic compatibility related issues, not only fundamental improvements in modeling and measurement, but also novel design methodologies and standards
Author: Shojiro Asai
Publisher: Springer
Published: 2018-07-20
Total Pages: 800
ISBN-13: 4431565949
DOWNLOAD EBOOKThis book discusses the new roles that the VLSI (very-large-scale integration of semiconductor circuits) is taking for the safe, secure, and dependable design and operation of electronic systems. The book consists of three parts. Part I, as a general introduction to this vital topic, describes how electronic systems are designed and tested with particular emphasis on dependability engineering, where the simultaneous assessment of the detrimental outcome of failures and cost of their containment is made. This section also describes the related research project “Dependable VLSI Systems,” in which the editor and authors of the book were involved for 8 years. Part II addresses various threats to the dependability of VLSIs as key systems components, including time-dependent degradations, variations in device characteristics, ionizing radiation, electromagnetic interference, design errors, and tampering, with discussion of technologies to counter those threats. Part III elaborates on the design and test technologies for dependability in such applications as control of robots and vehicles, data processing, and storage in a cloud environment and heterogeneous wireless telecommunications. This book is intended to be used as a reference for engineers who work on the design and testing of VLSI systems with particular attention to dependability. It can be used as a textbook in graduate courses as well. Readers interested in dependable systems from social and industrial–economic perspectives will also benefit from the discussions in this book.
Download or read book VLSI Design and Test for Systems Dependability written by Shojiro Asai and published by Springer. This book was released on 2018-07-20 with total page 800 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the new roles that the VLSI (very-large-scale integration of semiconductor circuits) is taking for the safe, secure, and dependable design and operation of electronic systems. The book consists of three parts. Part I, as a general introduction to this vital topic, describes how electronic systems are designed and tested with particular emphasis on dependability engineering, where the simultaneous assessment of the detrimental outcome of failures and cost of their containment is made. This section also describes the related research project “Dependable VLSI Systems,” in which the editor and authors of the book were involved for 8 years. Part II addresses various threats to the dependability of VLSIs as key systems components, including time-dependent degradations, variations in device characteristics, ionizing radiation, electromagnetic interference, design errors, and tampering, with discussion of technologies to counter those threats. Part III elaborates on the design and test technologies for dependability in such applications as control of robots and vehicles, data processing, and storage in a cloud environment and heterogeneous wireless telecommunications. This book is intended to be used as a reference for engineers who work on the design and testing of VLSI systems with particular attention to dependability. It can be used as a textbook in graduate courses as well. Readers interested in dependable systems from social and industrial–economic perspectives will also benefit from the discussions in this book.
Author: IEEE Staff
Publisher:
Published: 2017-07-04
Total Pages:
ISBN-13: 9781538626900
DOWNLOAD EBOOKMeasurement and modeling of IC emissions and susceptibility, Signal Integrity and Power Integrity at IC and PCB level EMC aware IC Design and Guidelines, Tools to handle EMC at IC level Computational Electromagnetics for IC level EMC EMC issues in System on chip (SoC), System inPackage (SiP), and 3D ICs, EMC issues in smart power ICs EMC of ICs in wireless communications, EMC of ICs for biomedical applications, Materials for improved EMC of ICs, Harsh environment effects on IC level EMC, Long term electromagnetic robustness of ICs, Standards and regulations up to 6 GHz, Modern EMC education on IC level EMC, Influence of IC EMC on system design, Intentional Electromagnetic Interference
Download or read book 2017 11th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMCCompo) written by IEEE Staff and published by . This book was released on 2017-07-04 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Measurement and modeling of IC emissions and susceptibility, Signal Integrity and Power Integrity at IC and PCB level EMC aware IC Design and Guidelines, Tools to handle EMC at IC level Computational Electromagnetics for IC level EMC EMC issues in System on chip (SoC), System inPackage (SiP), and 3D ICs, EMC issues in smart power ICs EMC of ICs in wireless communications, EMC of ICs for biomedical applications, Materials for improved EMC of ICs, Harsh environment effects on IC level EMC, Long term electromagnetic robustness of ICs, Standards and regulations up to 6 GHz, Modern EMC education on IC level EMC, Influence of IC EMC on system design, Intentional Electromagnetic Interference
Author: IEEE Staff
Publisher:
Published: 2015-11-10
Total Pages:
ISBN-13: 9781467378987
DOWNLOAD EBOOKThe achievements in terms of operating frequency and integration of semiconductor technology are constantly creating new challenges in EMC, which must necessarily be addressed at both the integrated circuit and system level Keeping up to date is of paramount importance to be successful in this field The 10th International Workshop EMC Compo 2015 is intended to be a place for exchange of the latest research achievements and experience in IC level EMC and it is addressed to researchers and Engineers from industry and from academia The workshop is focused on emission and susceptibility issues in digital, analogue and mixed signal integrated circuits The most recent advances in simulation and measurement techniques, models, standards, tools and design methodologies will be discussed A Technical Exhibition will also be held James Clerk Maxwell was born in Edinburgh and there will be an opportunity for delegates to visit his birthplace, in recognition of 150 years of his equations
Download or read book 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) written by IEEE Staff and published by . This book was released on 2015-11-10 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The achievements in terms of operating frequency and integration of semiconductor technology are constantly creating new challenges in EMC, which must necessarily be addressed at both the integrated circuit and system level Keeping up to date is of paramount importance to be successful in this field The 10th International Workshop EMC Compo 2015 is intended to be a place for exchange of the latest research achievements and experience in IC level EMC and it is addressed to researchers and Engineers from industry and from academia The workshop is focused on emission and susceptibility issues in digital, analogue and mixed signal integrated circuits The most recent advances in simulation and measurement techniques, models, standards, tools and design methodologies will be discussed A Technical Exhibition will also be held James Clerk Maxwell was born in Edinburgh and there will be an opportunity for delegates to visit his birthplace, in recognition of 150 years of his equations
Author: IEEE Staff
Publisher:
Published: 2022-03-09
Total Pages:
ISBN-13: 9781665423816
DOWNLOAD EBOOKThe achievements in terms of operating frequency and integration of semiconductor technology are constantly creating new challenges in IC EMC, which must necessarily be addressed at both integrated circuits and system level Keeping up to date is of paramount importance to be successful in this field EMC Compo 2021 is intended to be a place for the exchange of the latest research achievements and experience in IC level EMC and it is addressed to researchers both from industry and from academia The most recent advances in simulation and measurement techniques, models, standards, tools, and design methodologies will be discussed A Technical Exhibition will provide tool and equipment manufacturers and suppliers an opportunity to display their products and services to potential clients
Download or read book 2021 13th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) written by IEEE Staff and published by . This book was released on 2022-03-09 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The achievements in terms of operating frequency and integration of semiconductor technology are constantly creating new challenges in IC EMC, which must necessarily be addressed at both integrated circuits and system level Keeping up to date is of paramount importance to be successful in this field EMC Compo 2021 is intended to be a place for the exchange of the latest research achievements and experience in IC level EMC and it is addressed to researchers both from industry and from academia The most recent advances in simulation and measurement techniques, models, standards, tools, and design methodologies will be discussed A Technical Exhibition will provide tool and equipment manufacturers and suppliers an opportunity to display their products and services to potential clients
Author: IEEE Staff
Publisher:
Published: 2011-11-06
Total Pages:
ISBN-13: 9781457708626
DOWNLOAD EBOOKDownload or read book 2011 8th Workshop on Electromagnetic Compatibility of Integrated Circuits written by IEEE Staff and published by . This book was released on 2011-11-06 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author: IEEE Staff
Publisher:
Published: 2013-12-15
Total Pages:
ISBN-13: 9781479950041
DOWNLOAD EBOOKThe International Workshop EMC Compo 2013 is focused on emission and susceptibility as well as power and signal integrity issues of digital, analogue and mixed signal integrated circuits, simulation, measurement, and modeling techniques
Download or read book 2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) written by IEEE Staff and published by . This book was released on 2013-12-15 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The International Workshop EMC Compo 2013 is focused on emission and susceptibility as well as power and signal integrity issues of digital, analogue and mixed signal integrated circuits, simulation, measurement, and modeling techniques
Author: Xing-Chang Wei
Publisher: CRC Press
Published: 2017-09-19
Total Pages: 322
ISBN-13: 1315305860
DOWNLOAD EBOOKModeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.
Download or read book Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging written by Xing-Chang Wei and published by CRC Press. This book was released on 2017-09-19 with total page 322 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.
