Semiconductor Process Reliability in Practice

Semiconductor Process Reliability in Practice

Author: Zhenghao Gan

Publisher: McGraw Hill Professional

Published: 2012-10-06

Total Pages: 623

ISBN-13: 0071754288

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Proven processes for ensuring semiconductor device reliability Co-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide. Coverage includes: Basic device physics Process flow for MOS manufacturing Measurements useful for device reliability characterization Hot carrier injection Gate-oxide integrity (GOI) and time-dependent dielectric breakdown (TDDB) Negative bias temperature instability Plasma-induced damage Electrostatic discharge protection of integrated circuits Electromigration Stress migration Intermetal dielectric breakdown


Book Synopsis Semiconductor Process Reliability in Practice by : Zhenghao Gan

Download or read book Semiconductor Process Reliability in Practice written by Zhenghao Gan and published by McGraw Hill Professional. This book was released on 2012-10-06 with total page 623 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proven processes for ensuring semiconductor device reliability Co-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide. Coverage includes: Basic device physics Process flow for MOS manufacturing Measurements useful for device reliability characterization Hot carrier injection Gate-oxide integrity (GOI) and time-dependent dielectric breakdown (TDDB) Negative bias temperature instability Plasma-induced damage Electrostatic discharge protection of integrated circuits Electromigration Stress migration Intermetal dielectric breakdown

Semiconductor Process Reliability in Practice

Semiconductor Process Reliability in Practice

Author: Zhenghao Gan

Publisher: McGraw Hill Professional

Published: 2012-10-10

Total Pages: 624

ISBN-13: 007175427X

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Proven processes for ensuring semiconductor device reliability Co-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide. Coverage includes: Basic device physics Process flow for MOS manufacturing Measurements useful for device reliability characterization Hot carrier injection Gate-oxide integrity (GOI) and time-dependent dielectric breakdown (TDDB) Negative bias temperature instability Plasma-induced damage Electrostatic discharge protection of integrated circuits Electromigration Stress migration Intermetal dielectric breakdown


Book Synopsis Semiconductor Process Reliability in Practice by : Zhenghao Gan

Download or read book Semiconductor Process Reliability in Practice written by Zhenghao Gan and published by McGraw Hill Professional. This book was released on 2012-10-10 with total page 624 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proven processes for ensuring semiconductor device reliability Co-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide. Coverage includes: Basic device physics Process flow for MOS manufacturing Measurements useful for device reliability characterization Hot carrier injection Gate-oxide integrity (GOI) and time-dependent dielectric breakdown (TDDB) Negative bias temperature instability Plasma-induced damage Electrostatic discharge protection of integrated circuits Electromigration Stress migration Intermetal dielectric breakdown

Semiconductor Device Reliability

Semiconductor Device Reliability

Author: A. Christou

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 571

ISBN-13: 9400924828

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This publication is a compilation of papers presented at the Semiconductor Device Reliabi lity Workshop sponsored by the NATO International Scientific Exchange Program. The Workshop was held in Crete, Greece from June 4 to June 9, 1989. The objective of the Workshop was to review and to further explore advances in the field of semiconductor reliability through invited paper presentations and discussions. The technical emphasis was on quality assurance and reliability of optoelectronic and high speed semiconductor devices. The primary support for the meeting was provided by the Scientific Affairs Division of NATO. We are indebted to NATO for their support and to Dr. Craig Sinclair, who admin isters this program. The chapters of this book follow the format and order of the sessions of the meeting. Thirty-six papers were presented and discussed during the five-day Workshop. In addi tion, two panel sessions were held, with audience participation, where the particularly controversial topics of bum-in and reliability modeling and prediction methods were dis cussed. A brief review of these sessions is presented in this book.


Book Synopsis Semiconductor Device Reliability by : A. Christou

Download or read book Semiconductor Device Reliability written by A. Christou and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 571 pages. Available in PDF, EPUB and Kindle. Book excerpt: This publication is a compilation of papers presented at the Semiconductor Device Reliabi lity Workshop sponsored by the NATO International Scientific Exchange Program. The Workshop was held in Crete, Greece from June 4 to June 9, 1989. The objective of the Workshop was to review and to further explore advances in the field of semiconductor reliability through invited paper presentations and discussions. The technical emphasis was on quality assurance and reliability of optoelectronic and high speed semiconductor devices. The primary support for the meeting was provided by the Scientific Affairs Division of NATO. We are indebted to NATO for their support and to Dr. Craig Sinclair, who admin isters this program. The chapters of this book follow the format and order of the sessions of the meeting. Thirty-six papers were presented and discussed during the five-day Workshop. In addi tion, two panel sessions were held, with audience participation, where the particularly controversial topics of bum-in and reliability modeling and prediction methods were dis cussed. A brief review of these sessions is presented in this book.

Semiconductor Process and Product Quality Assurance Techniques

Semiconductor Process and Product Quality Assurance Techniques

Author: Semyra Vasquez-Borucki

Publisher: Independently Published

Published: 2021-03-05

Total Pages: 290

ISBN-13:

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The text book "Semiconductor Process and Product Quality Assurance Techniques" provides an overview of quality assurance approaches as well as techniques which are required to evaluate and determine relevant quality related parameters. It covers- Physical Front End Process and Product Monitoring- Electrical Front End Process and Product Monitoring- Front End Defect and Contamination Engineering- Semiconductor Back End Test Methods and Product Reliability Monitoring


Book Synopsis Semiconductor Process and Product Quality Assurance Techniques by : Semyra Vasquez-Borucki

Download or read book Semiconductor Process and Product Quality Assurance Techniques written by Semyra Vasquez-Borucki and published by Independently Published. This book was released on 2021-03-05 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt: The text book "Semiconductor Process and Product Quality Assurance Techniques" provides an overview of quality assurance approaches as well as techniques which are required to evaluate and determine relevant quality related parameters. It covers- Physical Front End Process and Product Monitoring- Electrical Front End Process and Product Monitoring- Front End Defect and Contamination Engineering- Semiconductor Back End Test Methods and Product Reliability Monitoring

Semiconductor Reliability

Semiconductor Reliability

Author: John E. Shwop

Publisher:

Published: 1961

Total Pages: 332

ISBN-13:

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Book Synopsis Semiconductor Reliability by : John E. Shwop

Download or read book Semiconductor Reliability written by John E. Shwop and published by . This book was released on 1961 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Semiconductor Reliability

Semiconductor Reliability

Author: Vallabh H. Dhudsia

Publisher: Marcel Dekker Incorporated

Published: 2007-03-26

Total Pages:

ISBN-13: 9780824758288

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A guidebook to the fundamental principles and applications of reliability for the industry, this title provides readers with a working knowledge of reliability improvement without an in-depth examination of a deep mathematical theory of reliability.


Book Synopsis Semiconductor Reliability by : Vallabh H. Dhudsia

Download or read book Semiconductor Reliability written by Vallabh H. Dhudsia and published by Marcel Dekker Incorporated. This book was released on 2007-03-26 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: A guidebook to the fundamental principles and applications of reliability for the industry, this title provides readers with a working knowledge of reliability improvement without an in-depth examination of a deep mathematical theory of reliability.

Semiconductor Advanced Packaging

Semiconductor Advanced Packaging

Author: John H. Lau

Publisher: Springer Nature

Published: 2021-05-17

Total Pages: 513

ISBN-13: 9811613761

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The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.


Book Synopsis Semiconductor Advanced Packaging by : John H. Lau

Download or read book Semiconductor Advanced Packaging written by John H. Lau and published by Springer Nature. This book was released on 2021-05-17 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Electrostatic Discharge Protection

Electrostatic Discharge Protection

Author: Juin J. Liou

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 304

ISBN-13: 1482255898

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Electrostatic discharge (ESD) is one of the most prevalent threats to electronic components. In an ESD event, a finite amount of charge is transferred from one object (i.e., human body) to another (i.e., microchip). This process can result in a very high current passing through the microchip within a very short period of time. Thus, more than 35 percent of single-event chip damages can be attributed to ESD events, and designing ESD structures to protect integrated circuits against the ESD stresses is a high priority in the semiconductor industry. Electrostatic Discharge Protection: Advances and Applications delivers timely coverage of component- and system-level ESD protection for semiconductor devices and integrated circuits. Bringing together contributions from internationally respected researchers and engineers with expertise in ESD design, optimization, modeling, simulation, and characterization, this book bridges the gap between theory and practice to offer valuable insight into the state of the art of ESD protection. Amply illustrated with tables, figures, and case studies, the text: Instills a deeper understanding of ESD events and ESD protection design principles Examines vital processes including Si CMOS, Si BCD, Si SOI, and GaN technologies Addresses important aspects pertinent to the modeling and simulation of ESD protection solutions Electrostatic Discharge Protection: Advances and Applications provides a single source for cutting-edge information vital to the research and development of effective, robust ESD protection solutions for semiconductor devices and integrated circuits.


Book Synopsis Electrostatic Discharge Protection by : Juin J. Liou

Download or read book Electrostatic Discharge Protection written by Juin J. Liou and published by CRC Press. This book was released on 2017-12-19 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electrostatic discharge (ESD) is one of the most prevalent threats to electronic components. In an ESD event, a finite amount of charge is transferred from one object (i.e., human body) to another (i.e., microchip). This process can result in a very high current passing through the microchip within a very short period of time. Thus, more than 35 percent of single-event chip damages can be attributed to ESD events, and designing ESD structures to protect integrated circuits against the ESD stresses is a high priority in the semiconductor industry. Electrostatic Discharge Protection: Advances and Applications delivers timely coverage of component- and system-level ESD protection for semiconductor devices and integrated circuits. Bringing together contributions from internationally respected researchers and engineers with expertise in ESD design, optimization, modeling, simulation, and characterization, this book bridges the gap between theory and practice to offer valuable insight into the state of the art of ESD protection. Amply illustrated with tables, figures, and case studies, the text: Instills a deeper understanding of ESD events and ESD protection design principles Examines vital processes including Si CMOS, Si BCD, Si SOI, and GaN technologies Addresses important aspects pertinent to the modeling and simulation of ESD protection solutions Electrostatic Discharge Protection: Advances and Applications provides a single source for cutting-edge information vital to the research and development of effective, robust ESD protection solutions for semiconductor devices and integrated circuits.

Piezoelectric MEMS Resonators

Piezoelectric MEMS Resonators

Author: Harmeet Bhugra

Publisher: Springer

Published: 2017-01-09

Total Pages: 424

ISBN-13: 3319286889

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This book introduces piezoelectric microelectromechanical (pMEMS) resonators to a broad audience by reviewing design techniques including use of finite element modeling, testing and qualification of resonators, and fabrication and large scale manufacturing techniques to help inspire future research and entrepreneurial activities in pMEMS. The authors discuss the most exciting developments in the area of materials and devices for the making of piezoelectric MEMS resonators, and offer direct examples of the technical challenges that need to be overcome in order to commercialize these types of devices. Some of the topics covered include: Widely-used piezoelectric materials, as well as materials in which there is emerging interest Principle of operation and design approaches for the making of flexural, contour-mode, thickness-mode, and shear-mode piezoelectric resonators, and examples of practical implementation of these devices Large scale manufacturing approaches, with a focus on the practical aspects associated with testing and qualification Examples of commercialization paths for piezoelectric MEMS resonators in the timing and the filter markets ...and more! The authors present industry and academic perspectives, making this book ideal for engineers, graduate students, and researchers.


Book Synopsis Piezoelectric MEMS Resonators by : Harmeet Bhugra

Download or read book Piezoelectric MEMS Resonators written by Harmeet Bhugra and published by Springer. This book was released on 2017-01-09 with total page 424 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces piezoelectric microelectromechanical (pMEMS) resonators to a broad audience by reviewing design techniques including use of finite element modeling, testing and qualification of resonators, and fabrication and large scale manufacturing techniques to help inspire future research and entrepreneurial activities in pMEMS. The authors discuss the most exciting developments in the area of materials and devices for the making of piezoelectric MEMS resonators, and offer direct examples of the technical challenges that need to be overcome in order to commercialize these types of devices. Some of the topics covered include: Widely-used piezoelectric materials, as well as materials in which there is emerging interest Principle of operation and design approaches for the making of flexural, contour-mode, thickness-mode, and shear-mode piezoelectric resonators, and examples of practical implementation of these devices Large scale manufacturing approaches, with a focus on the practical aspects associated with testing and qualification Examples of commercialization paths for piezoelectric MEMS resonators in the timing and the filter markets ...and more! The authors present industry and academic perspectives, making this book ideal for engineers, graduate students, and researchers.

Cleanrooms

Cleanrooms

Author: Michael Kozicki

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 384

ISBN-13: 9401179506

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In writing this book, our goal was to produce a much needed teaching and reference text with a fresh approach to c1eanroom technology. The most obvious technological reason for bringing this book into being is that c1ean rooms have become vital to the manufacture and development of high technology products in both the commercial and military sectors, and there fore people have to develop an understanding of them. Examples of c1ean room applications include the manufacture of integrated circuits and other electronic components, preciSion mechanical assemblies, computer disks and drives, compact disks, optical components, medical implants and prostheses, pharmaceuticals and biochemicals, and so on. The book is written for anyone who is currently involved, or intends to become involved, with c1eanrooms. We intend it to be used by a wide range of professional groups including process engineers, production engineers, plant mechanical and electrical engineers, research engineers and scientists, managers, and so on. In addition, we believe it will be beneficial to those who design, build, service, and supply c1eanrooms, and may be used as a training aid for students who intend to pursue a career involving controlled environments and others such as c1eanroom operators and maintenance staff. We have attempted to steer clear of complex theory, which may be pursued in many other specialist texts, and keep the book as understandable and applicable as possible.


Book Synopsis Cleanrooms by : Michael Kozicki

Download or read book Cleanrooms written by Michael Kozicki and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 384 pages. Available in PDF, EPUB and Kindle. Book excerpt: In writing this book, our goal was to produce a much needed teaching and reference text with a fresh approach to c1eanroom technology. The most obvious technological reason for bringing this book into being is that c1ean rooms have become vital to the manufacture and development of high technology products in both the commercial and military sectors, and there fore people have to develop an understanding of them. Examples of c1ean room applications include the manufacture of integrated circuits and other electronic components, preciSion mechanical assemblies, computer disks and drives, compact disks, optical components, medical implants and prostheses, pharmaceuticals and biochemicals, and so on. The book is written for anyone who is currently involved, or intends to become involved, with c1eanrooms. We intend it to be used by a wide range of professional groups including process engineers, production engineers, plant mechanical and electrical engineers, research engineers and scientists, managers, and so on. In addition, we believe it will be beneficial to those who design, build, service, and supply c1eanrooms, and may be used as a training aid for students who intend to pursue a career involving controlled environments and others such as c1eanroom operators and maintenance staff. We have attempted to steer clear of complex theory, which may be pursued in many other specialist texts, and keep the book as understandable and applicable as possible.