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This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.
Book Synopsis Three-Dimensional Design Methodologies for Tree-based FPGA Architecture by : Vinod Pangracious
Download or read book Three-Dimensional Design Methodologies for Tree-based FPGA Architecture written by Vinod Pangracious and published by Springer. This book was released on 2015-06-25 with total page 239 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.
This book presents a new FPGA architecture known as tree-based FPGA architecture, due to its hierarchical nature. This type of architecture has been relatively unexplored despite their better performance and predictable routing behavior, as compared to mesh-based FPGA architectures. In this book, we explore and optimize the tree-based architecture and we evaluate it by comparing it to equivalent mesh-based FPGA architectures.
Book Synopsis Tree-based Heterogeneous FPGA Architectures by : Umer Farooq
Download or read book Tree-based Heterogeneous FPGA Architectures written by Umer Farooq and published by Springer Science & Business Media. This book was released on 2012-05-17 with total page 198 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a new FPGA architecture known as tree-based FPGA architecture, due to its hierarchical nature. This type of architecture has been relatively unexplored despite their better performance and predictable routing behavior, as compared to mesh-based FPGA architectures. In this book, we explore and optimize the tree-based architecture and we evaluate it by comparing it to equivalent mesh-based FPGA architectures.
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Book Synopsis Materials for Advanced Packaging by : Daniel Lu
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Brings novel insights to a vibrant research area with high application potential?covering materials, physics, architecture, and integration aspects of future generation CMOS electronics technology Over the last four decades we have seen tremendous growth in semiconductor electronics. This growth has been fueled by the matured complementary metal oxide semiconductor (CMOS) technology. This comprehensive book captures the novel device options in CMOS technology that can be realized using non-silicon semiconductors. It discusses germanium, III-V materials, carbon nanotubes and graphene as semiconducting materials for three-dimensional field-effect transistors. It also covers non-conventional materials such as nanowires and nanotubes. Additionally, nanoelectromechanical switches-based mechanical relays and wide bandgap semiconductor-based terahertz electronics are reviewed as essential add-on electronics for enhanced communication and computational capabilities. Advanced Nanoelectronics: Post-Silicon Materials and Devices begins with a discussion of the future of CMOS. It continues with comprehensive chapter coverage of: nanowire field effect transistors; two-dimensional materials for electronic applications; the challenges and breakthroughs of the integration of germanium into modern CMOS; carbon nanotube logic technology; tunnel field effect transistors; energy efficient computing with negative capacitance; spin-based devices for logic, memory and non-Boolean architectures; and terahertz properties and applications of GaN. -Puts forward novel approaches for future, state-of-the-art, nanoelectronic devices -Discusses emerging materials and architectures such as alternate channel material like germanium, gallium nitride, 1D nanowires/tubes, 2D graphene, and other dichalcogenide materials and ferroelectrics -Examines new physics such as spintronics, negative capacitance, quantum computing, and 3D-IC technology -Brings together the latest developments in the field for easy reference -Enables academic and R&D researchers in semiconductors to "think outside the box" and explore beyond silica An important resource for future generation CMOS electronics technology, Advanced Nanoelectronics: Post-Silicon Materials and Devices will appeal to materials scientists, semiconductor physicists, semiconductor industry, and electrical engineers.
Book Synopsis Advanced Nanoelectronics by : Muhammad Mustafa Hussain
Download or read book Advanced Nanoelectronics written by Muhammad Mustafa Hussain and published by John Wiley & Sons. This book was released on 2019-01-04 with total page 284 pages. Available in PDF, EPUB and Kindle. Book excerpt: Brings novel insights to a vibrant research area with high application potential?covering materials, physics, architecture, and integration aspects of future generation CMOS electronics technology Over the last four decades we have seen tremendous growth in semiconductor electronics. This growth has been fueled by the matured complementary metal oxide semiconductor (CMOS) technology. This comprehensive book captures the novel device options in CMOS technology that can be realized using non-silicon semiconductors. It discusses germanium, III-V materials, carbon nanotubes and graphene as semiconducting materials for three-dimensional field-effect transistors. It also covers non-conventional materials such as nanowires and nanotubes. Additionally, nanoelectromechanical switches-based mechanical relays and wide bandgap semiconductor-based terahertz electronics are reviewed as essential add-on electronics for enhanced communication and computational capabilities. Advanced Nanoelectronics: Post-Silicon Materials and Devices begins with a discussion of the future of CMOS. It continues with comprehensive chapter coverage of: nanowire field effect transistors; two-dimensional materials for electronic applications; the challenges and breakthroughs of the integration of germanium into modern CMOS; carbon nanotube logic technology; tunnel field effect transistors; energy efficient computing with negative capacitance; spin-based devices for logic, memory and non-Boolean architectures; and terahertz properties and applications of GaN. -Puts forward novel approaches for future, state-of-the-art, nanoelectronic devices -Discusses emerging materials and architectures such as alternate channel material like germanium, gallium nitride, 1D nanowires/tubes, 2D graphene, and other dichalcogenide materials and ferroelectrics -Examines new physics such as spintronics, negative capacitance, quantum computing, and 3D-IC technology -Brings together the latest developments in the field for easy reference -Enables academic and R&D researchers in semiconductors to "think outside the box" and explore beyond silica An important resource for future generation CMOS electronics technology, Advanced Nanoelectronics: Post-Silicon Materials and Devices will appeal to materials scientists, semiconductor physicists, semiconductor industry, and electrical engineers.
This book constitutes the thoroughly refereed conference proceedings of the 9th International Symposium on Reconfigurable Computing: Architectures, Tools and Applications, ARC 2013, held in Los Angeles, CA, USA, in March 2013. The 28 revised papers presented, consisting of 20 full papers and 11 poster papers were carefully selected from 41 submissions. The topics covered are applications, arithmetic, design optimization for FPGAs, architectures, place and routing.
Book Synopsis Reconfigurable Computing: Architectures, Tools and Applications by : Philip Brisk
Download or read book Reconfigurable Computing: Architectures, Tools and Applications written by Philip Brisk and published by Springer. This book was released on 2013-03-12 with total page 253 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the thoroughly refereed conference proceedings of the 9th International Symposium on Reconfigurable Computing: Architectures, Tools and Applications, ARC 2013, held in Los Angeles, CA, USA, in March 2013. The 28 revised papers presented, consisting of 20 full papers and 11 poster papers were carefully selected from 41 submissions. The topics covered are applications, arithmetic, design optimization for FPGAs, architectures, place and routing.
In this work, the benefits of using 3-D integration in the fabrication of Field Programmable Gate Arrays (FPGAs) are analyzed. A CAD tool has been developed to specify 3-dimensional FPGA architectures and map RTL descriptions of circuits to these 3-D FPGAs. The CAD tool was created from the widely used Versatile Place and Route (VPR) CAD tool for 2-D FPGAs. The tool performs timing-driven placement of logic blocks in the 3-dimensional grid of the FPGA using a two-stage Simulated Annealing (SA) process. The SA algorithm in the original VPR tool has been modified to focus more directly on minimizing the critical path delay of the circuit and hence maximizing the performance of the mapped circuit. After placing the logic blocks, the tool generates a Routing-Resource graph from the 3-D FPGA architecture for the VPR router. This allows the efficient Pathfinder-based VPR router to be used without any modification for the 3-D architecture. The CAD tool that was developed for mapping circuits to the fabricated 3-D FPGA is also used for exploring the design space for the 3-D FPGA architecture. A significant contribution of this work is a dual-interconnect architecture for the 3-D FPGA which has parasitic capacitance comparable to 2-D FPGAs. The nets routed in a 3-D FPGA are divided into intra-layer nets and inter-layer nets, which are routed on separate interconnect systems. This work also proposes a technique called I/O pipelining which pipelines the primary inputs and outputs of the FPGA through unused registers. This 3-D architecture and I/O pipelining technique have not been found in any of the works proposed so far, in the area of 3-D FPGA design. It is shown that the Dual-Interconnect I/O pipelined 3-D FPGA on an average achieves 43% delay improvement and in the best case, up to 54% for the MCNC'91 benchmark circuits.
Book Synopsis CAD for a 3-D FPGA by : Vikram Chandrasekhar
Download or read book CAD for a 3-D FPGA written by Vikram Chandrasekhar and published by . This book was released on 2007 with total page 154 pages. Available in PDF, EPUB and Kindle. Book excerpt: In this work, the benefits of using 3-D integration in the fabrication of Field Programmable Gate Arrays (FPGAs) are analyzed. A CAD tool has been developed to specify 3-dimensional FPGA architectures and map RTL descriptions of circuits to these 3-D FPGAs. The CAD tool was created from the widely used Versatile Place and Route (VPR) CAD tool for 2-D FPGAs. The tool performs timing-driven placement of logic blocks in the 3-dimensional grid of the FPGA using a two-stage Simulated Annealing (SA) process. The SA algorithm in the original VPR tool has been modified to focus more directly on minimizing the critical path delay of the circuit and hence maximizing the performance of the mapped circuit. After placing the logic blocks, the tool generates a Routing-Resource graph from the 3-D FPGA architecture for the VPR router. This allows the efficient Pathfinder-based VPR router to be used without any modification for the 3-D architecture. The CAD tool that was developed for mapping circuits to the fabricated 3-D FPGA is also used for exploring the design space for the 3-D FPGA architecture. A significant contribution of this work is a dual-interconnect architecture for the 3-D FPGA which has parasitic capacitance comparable to 2-D FPGAs. The nets routed in a 3-D FPGA are divided into intra-layer nets and inter-layer nets, which are routed on separate interconnect systems. This work also proposes a technique called I/O pipelining which pipelines the primary inputs and outputs of the FPGA through unused registers. This 3-D architecture and I/O pipelining technique have not been found in any of the works proposed so far, in the area of 3-D FPGA design. It is shown that the Dual-Interconnect I/O pipelined 3-D FPGA on an average achieves 43% delay improvement and in the best case, up to 54% for the MCNC'91 benchmark circuits.
This book contains extended and revised versions of the best papers that were p- sented during the 16th edition of the IFIP/IEEE WG10.5 International Conference on Very Large Scale Integration, a global System-on-a-Chip Design & CAD conference. The 16th conference was held at the Grand Hotel of Rhodes Island, Greece (October 13–15, 2008). Previous conferences have taken place in Edinburgh, Trondheim, V- couver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier, Darmstadt, Perth, Nice and Atlanta. VLSI-SoC 2008 was the 16th in a series of international conferences sponsored by IFIP TC 10 Working Group 10.5 and IEEE CEDA that explores the state of the art and the new developments in the field of VLSI systems and their designs. The purpose of the conference was to provide a forum to exchange ideas and to present industrial and research results in the fields of VLSI/ULSI systems, embedded systems and - croelectronic design and test.
Book Synopsis VLSI-SoC: Design Methodologies for SoC and SiP by : Christian Piguet
Download or read book VLSI-SoC: Design Methodologies for SoC and SiP written by Christian Piguet and published by Springer Science & Business Media. This book was released on 2010-04-06 with total page 297 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains extended and revised versions of the best papers that were p- sented during the 16th edition of the IFIP/IEEE WG10.5 International Conference on Very Large Scale Integration, a global System-on-a-Chip Design & CAD conference. The 16th conference was held at the Grand Hotel of Rhodes Island, Greece (October 13–15, 2008). Previous conferences have taken place in Edinburgh, Trondheim, V- couver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier, Darmstadt, Perth, Nice and Atlanta. VLSI-SoC 2008 was the 16th in a series of international conferences sponsored by IFIP TC 10 Working Group 10.5 and IEEE CEDA that explores the state of the art and the new developments in the field of VLSI systems and their designs. The purpose of the conference was to provide a forum to exchange ideas and to present industrial and research results in the fields of VLSI/ULSI systems, embedded systems and - croelectronic design and test.
Decision diagram (DD) techniques are very popular in the electronic design automation (EDA) of integrated circuits, and for good reason. They can accurately simulate logic design, can show where to make reductions in complexity, and can be easily modified to model different scenarios. Presenting DD techniques from an applied perspective, Decision Diagram Techniques for Micro- and Nanoelectronic Design Handbook provides a comprehensive, up-to-date collection of DD techniques. Experts with more than forty years of combined experience in both industrial and academic settings demonstrate how to apply the techniques to full advantage with more than 400 examples and illustrations. Beginning with the fundamental theory, data structures, and logic underlying DD techniques, they explore a breadth of topics from arithmetic and word-level representations to spectral techniques and event-driven analysis. The book also includes abundant references to more detailed information and additional applications. Decision Diagram Techniques for Micro- and Nanoelectronic Design Handbook collects the theory, methods, and practical knowledge necessary to design more advanced circuits and places it at your fingertips in a single, concise reference.
Book Synopsis Decision Diagram Techniques for Micro- and Nanoelectronic Design Handbook by : Svetlana N. Yanushkevich
Download or read book Decision Diagram Techniques for Micro- and Nanoelectronic Design Handbook written by Svetlana N. Yanushkevich and published by CRC Press. This book was released on 2018-10-03 with total page 960 pages. Available in PDF, EPUB and Kindle. Book excerpt: Decision diagram (DD) techniques are very popular in the electronic design automation (EDA) of integrated circuits, and for good reason. They can accurately simulate logic design, can show where to make reductions in complexity, and can be easily modified to model different scenarios. Presenting DD techniques from an applied perspective, Decision Diagram Techniques for Micro- and Nanoelectronic Design Handbook provides a comprehensive, up-to-date collection of DD techniques. Experts with more than forty years of combined experience in both industrial and academic settings demonstrate how to apply the techniques to full advantage with more than 400 examples and illustrations. Beginning with the fundamental theory, data structures, and logic underlying DD techniques, they explore a breadth of topics from arithmetic and word-level representations to spectral techniques and event-driven analysis. The book also includes abundant references to more detailed information and additional applications. Decision Diagram Techniques for Micro- and Nanoelectronic Design Handbook collects the theory, methods, and practical knowledge necessary to design more advanced circuits and places it at your fingertips in a single, concise reference.
This book constitutes the thoroughly refereed post-conference proceedings of 18th International Workshop on Power and Timing Modeling, Optimization and Simulation, PATMOS 2008, featuring Integrated Circuit and System Design, held in Lisbon, Portugal during September 10-12, 2008. The 31 revised full papers and 10 revised poster papers presented together with 3 invited talks and 4 papers from a special session on reconfigurable architectures were carefully reviewed and selected from numerous submissions. The papers are organized in topical sections on low-leakage and subthreshold circuits, low-power methods and models, arithmetic and memories, variability and statistical timing, synchronization and interconnect, power supplies and switching noise, low-power circuits; reconfigurable architectures, circuits and methods, power and delay modeling, as well as power optimizations addressing reconfigurable architectures.
Book Synopsis Integrated Circuit and System Design. Power and Timing Modeling, Optimization and Simulation by : Lars Svensson
Download or read book Integrated Circuit and System Design. Power and Timing Modeling, Optimization and Simulation written by Lars Svensson and published by Springer Science & Business Media. This book was released on 2009-02-13 with total page 474 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the thoroughly refereed post-conference proceedings of 18th International Workshop on Power and Timing Modeling, Optimization and Simulation, PATMOS 2008, featuring Integrated Circuit and System Design, held in Lisbon, Portugal during September 10-12, 2008. The 31 revised full papers and 10 revised poster papers presented together with 3 invited talks and 4 papers from a special session on reconfigurable architectures were carefully reviewed and selected from numerous submissions. The papers are organized in topical sections on low-leakage and subthreshold circuits, low-power methods and models, arithmetic and memories, variability and statistical timing, synchronization and interconnect, power supplies and switching noise, low-power circuits; reconfigurable architectures, circuits and methods, power and delay modeling, as well as power optimizations addressing reconfigurable architectures.
