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Tribology In Chemical-Mechanical Planarization

Author: Hong Liang

Publisher: CRC Press

Published: 2005-03-01

Total Pages: 199

ISBN-13: 1420028391

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Illustrating their intersecting role in manufacturing and technological development, this book examines tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects as well as friction, lubrication fundamentals, and the basics of wear. The book concludes its focus with mechanical aspects of CMP, pad materials, elastic modulus, and cell buckling. As the first source to integrate CMP and tribology, Tribology in Chemical-Mechanical Planarization provides applied scientists and engineers in the fields of semiconductors and microelectronics with clear foresight to the future of this technology.

Book Synopsis Tribology In Chemical-Mechanical Planarization by : Hong Liang

Download or read book Tribology In Chemical-Mechanical Planarization written by Hong Liang and published by CRC Press. This book was released on 2005-03-01 with total page 199 pages. Available in PDF, EPUB and Kindle. Book excerpt: Illustrating their intersecting role in manufacturing and technological development, this book examines tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects as well as friction, lubrication fundamentals, and the basics of wear. The book concludes its focus with mechanical aspects of CMP, pad materials, elastic modulus, and cell buckling. As the first source to integrate CMP and tribology, Tribology in Chemical-Mechanical Planarization provides applied scientists and engineers in the fields of semiconductors and microelectronics with clear foresight to the future of this technology.

Mechnical and Tribological Properties of Chemical Mechanical Planarization

Author: Frank A. Giglio

Publisher:

Published: 2003

Total Pages: 126

ISBN-13:

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Book Synopsis Mechnical and Tribological Properties of Chemical Mechanical Planarization by : Frank A. Giglio

Download or read book Mechnical and Tribological Properties of Chemical Mechanical Planarization written by Frank A. Giglio and published by . This book was released on 2003 with total page 126 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Chemical-Mechanical Planarization of Semiconductor Materials

Author: M.R. Oliver

Publisher: Springer Science & Business Media

Published: 2004-01-26

Total Pages: 444

ISBN-13: 9783540431817

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This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Book Synopsis Chemical-Mechanical Planarization of Semiconductor Materials by : M.R. Oliver

Download or read book Chemical-Mechanical Planarization of Semiconductor Materials written by M.R. Oliver and published by Springer Science & Business Media. This book was released on 2004-01-26 with total page 444 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Advances in Chemical Mechanical Planarization (CMP)

Author: Babu Suryadevara

Publisher: Woodhead Publishing

Published: 2021-09-10

Total Pages: 650

ISBN-13: 0128218193

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Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP

Book Synopsis Advances in Chemical Mechanical Planarization (CMP) by : Babu Suryadevara

Download or read book Advances in Chemical Mechanical Planarization (CMP) written by Babu Suryadevara and published by Woodhead Publishing. This book was released on 2021-09-10 with total page 650 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP

Study of Tribological Properties and Modeling of Removal Rate of Low-k and Copper in Chemical Mechanical Planarization Process

Author: Swetha C. Thagella

Publisher:

Published: 2003

Total Pages: 186

ISBN-13:

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Book Synopsis Study of Tribological Properties and Modeling of Removal Rate of Low-k and Copper in Chemical Mechanical Planarization Process by : Swetha C. Thagella

Download or read book Study of Tribological Properties and Modeling of Removal Rate of Low-k and Copper in Chemical Mechanical Planarization Process written by Swetha C. Thagella and published by . This book was released on 2003 with total page 186 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

Author: Jie Cheng

Publisher: Springer

Published: 2017-09-06

Total Pages: 148

ISBN-13: 9811061653

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This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.

Book Synopsis Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect by : Jie Cheng

Download or read book Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect written by Jie Cheng and published by Springer. This book was released on 2017-09-06 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.

Proceedings of the World Tribology Congress III--2005

Author:

Publisher:

Published: 2005

Total Pages: 1040

ISBN-13:

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Book Synopsis Proceedings of the World Tribology Congress III--2005 by :

Download or read book Proceedings of the World Tribology Congress III--2005 written by and published by . This book was released on 2005 with total page 1040 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Tribology of Abrasive Machining Processes

Author: Ioan D. Marinescu

Publisher: William Andrew

Published: 2012-12-07

Total Pages: 602

ISBN-13: 1437734677

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This book draws upon the science of tribology to understand, predict and improve abrasive machining processes. Pulling together information on how abrasives work, the authors, who are renowned experts in abrasive technology, demonstrate how tribology can be applied as a tool to improve abrasive machining processes. Each of the main elements of the abrasive machining system are looked at, and the tribological factors that control the efficiency and quality of the processes are described. Since grinding is by far the most commonly employed abrasive machining process, it is dealt with in particular detail. Solutions are posed to many of the most commonly experienced industrial problems, such as poor accuracy, poor surface quality, rapid wheel wear, vibrations, work-piece burn and high process costs. This practical approach makes this book an essential tool for practicing engineers. Uses the science of tribology to improve understanding and of abrasive machining processes in order to increase performance, productivity and surface quality of final products A comprehensive reference on how abrasives work, covering kinematics, heat transfer, thermal stresses, molecular dynamics, fluids and the tribology of lubricants Authoritative and ground-breaking in its first edition, the 2nd edition includes 30% new and updated material, including new topics such as CMP (Chemical Mechanical Polishing) and precision machining for micro-and nano-scale applications

Book Synopsis Tribology of Abrasive Machining Processes by : Ioan D. Marinescu

Download or read book Tribology of Abrasive Machining Processes written by Ioan D. Marinescu and published by William Andrew. This book was released on 2012-12-07 with total page 602 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book draws upon the science of tribology to understand, predict and improve abrasive machining processes. Pulling together information on how abrasives work, the authors, who are renowned experts in abrasive technology, demonstrate how tribology can be applied as a tool to improve abrasive machining processes. Each of the main elements of the abrasive machining system are looked at, and the tribological factors that control the efficiency and quality of the processes are described. Since grinding is by far the most commonly employed abrasive machining process, it is dealt with in particular detail. Solutions are posed to many of the most commonly experienced industrial problems, such as poor accuracy, poor surface quality, rapid wheel wear, vibrations, work-piece burn and high process costs. This practical approach makes this book an essential tool for practicing engineers. Uses the science of tribology to improve understanding and of abrasive machining processes in order to increase performance, productivity and surface quality of final products A comprehensive reference on how abrasives work, covering kinematics, heat transfer, thermal stresses, molecular dynamics, fluids and the tribology of lubricants Authoritative and ground-breaking in its first edition, the 2nd edition includes 30% new and updated material, including new topics such as CMP (Chemical Mechanical Polishing) and precision machining for micro-and nano-scale applications

Process Optimization and Consumable Development for Chemical Mechanical Planarization (CMP) Processes

Author: Subrahmanya R. Mudhivarthi

Publisher:

Published: 2007

Total Pages:

ISBN-13:

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ABSTRACT: Chemical Mechanical Planarization (CMP) is one of the most critical processing steps that enables fabrication of multilevel interconnects. The success of CMP process is limited by the implementation of an optimized process and reduction of process generated defects along with post CMP surface characteristics such as dishing and erosion. This thesis investigates to identify various sources of defects and studies the effect of factors that can be used to optimize the process. The major contributions of this work are: Understanding the effect of temperature rise on surface tribology, electrochemistry and post CMP pattern effects during the CMP process; investigating the effect of pad conditioning temperature and slurry flow rate on tribology and post CMP characteristics; development of novel slurries using polymer hybrid particles and improvement in slurry metrology to reduce surface damage during CMP. From the current research, it was shown that the effect of temperature on CMP tribology is predominantly affected by the polishing parameters and the polishing pad characteristics more than the chemical nature of the slurry. The effect of temperature is minimal on the resulting surface roughness but the with-in die non-uniformity is significantly affected by the temperature at the interface. Secondly, in this research it was shown that the effectiveness and aggressiveness of the pad conditioning process is highly influenced by the conditioning temperature. This aspect can be utilized to optimize the parameters for the pad conditioning process. Further, post CMP characteristics such as dishing, erosion and metal loss on patterned samples were shown to decrease with increase in slurry flow rate. This research then concentrates on the development of novel low defect slurry using polymer hybrid abrasive particles. Several varieties of surface functionalized polymer particles were employed to make oxide CMP slurries. These novel slurries proved to be potential candidates to reduce surface damage during CMP as they resulted in low coefficient of friction and much less surface scratches as compared to conventional abrasives. Thus, this research helps to reduce defects and non-planarity issues during CMP process thereby improving yield and reducing the cost of ownership.

Book Synopsis Process Optimization and Consumable Development for Chemical Mechanical Planarization (CMP) Processes by : Subrahmanya R. Mudhivarthi

Download or read book Process Optimization and Consumable Development for Chemical Mechanical Planarization (CMP) Processes written by Subrahmanya R. Mudhivarthi and published by . This book was released on 2007 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: ABSTRACT: Chemical Mechanical Planarization (CMP) is one of the most critical processing steps that enables fabrication of multilevel interconnects. The success of CMP process is limited by the implementation of an optimized process and reduction of process generated defects along with post CMP surface characteristics such as dishing and erosion. This thesis investigates to identify various sources of defects and studies the effect of factors that can be used to optimize the process. The major contributions of this work are: Understanding the effect of temperature rise on surface tribology, electrochemistry and post CMP pattern effects during the CMP process; investigating the effect of pad conditioning temperature and slurry flow rate on tribology and post CMP characteristics; development of novel slurries using polymer hybrid particles and improvement in slurry metrology to reduce surface damage during CMP. From the current research, it was shown that the effect of temperature on CMP tribology is predominantly affected by the polishing parameters and the polishing pad characteristics more than the chemical nature of the slurry. The effect of temperature is minimal on the resulting surface roughness but the with-in die non-uniformity is significantly affected by the temperature at the interface. Secondly, in this research it was shown that the effectiveness and aggressiveness of the pad conditioning process is highly influenced by the conditioning temperature. This aspect can be utilized to optimize the parameters for the pad conditioning process. Further, post CMP characteristics such as dishing, erosion and metal loss on patterned samples were shown to decrease with increase in slurry flow rate. This research then concentrates on the development of novel low defect slurry using polymer hybrid abrasive particles. Several varieties of surface functionalized polymer particles were employed to make oxide CMP slurries. These novel slurries proved to be potential candidates to reduce surface damage during CMP as they resulted in low coefficient of friction and much less surface scratches as compared to conventional abrasives. Thus, this research helps to reduce defects and non-planarity issues during CMP process thereby improving yield and reducing the cost of ownership.

Journal of Tribology

Author:

Publisher:

Published: 2005

Total Pages: 476

ISBN-13:

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Book Synopsis Journal of Tribology by :

Download or read book Journal of Tribology written by and published by . This book was released on 2005 with total page 476 pages. Available in PDF, EPUB and Kindle. Book excerpt: