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The main focus of this book is ULSI front-end technology. It covers from the early history of semiconductor science & technology from 1874 to state-of-the-art FINFET technology in 2016. Some ULSI back-end technology is also covered, for example, the science and technology of MIM capacitors for analog CMOS has been included in this book.
Book Synopsis Ulsi Front-end Technology: Covering From The First Semiconductor Paper To Cmos Finfet Technology by : Wai Shing Lau
Download or read book Ulsi Front-end Technology: Covering From The First Semiconductor Paper To Cmos Finfet Technology written by Wai Shing Lau and published by World Scientific. This book was released on 2017-08-23 with total page 247 pages. Available in PDF, EPUB and Kindle. Book excerpt: The main focus of this book is ULSI front-end technology. It covers from the early history of semiconductor science & technology from 1874 to state-of-the-art FINFET technology in 2016. Some ULSI back-end technology is also covered, for example, the science and technology of MIM capacitors for analog CMOS has been included in this book.
"The main focus of this book is ULSI front-end technology. It covers from the early history of semiconductor science & technology from 1874 to state-of-the-art FINFET technology in 2016. Some ULSI back-end technology is also covered, for example, the science and technology of MIM capacitors for analog CMOS has been included in this book."--Publisher's website.
Book Synopsis ULSI Front-end Technology by : Lau Wai Shing
Download or read book ULSI Front-end Technology written by Lau Wai Shing and published by . This book was released on 2017 with total page 247 pages. Available in PDF, EPUB and Kindle. Book excerpt: "The main focus of this book is ULSI front-end technology. It covers from the early history of semiconductor science & technology from 1874 to state-of-the-art FINFET technology in 2016. Some ULSI back-end technology is also covered, for example, the science and technology of MIM capacitors for analog CMOS has been included in this book."--Publisher's website.
This collection of essays documents and investigates the conflicts in the European, Russia and China that sparked populist revolts against the established globalist order in the European Union. It shows that the populist surge was not an anomaly. It was a
Book Synopsis ULSI Front-End Technology: Covering from the First Scientific Paper on Semiconductor to State-Of-the-Art CMOS Finfet Technology by : Wai Shing Lau
Download or read book ULSI Front-End Technology: Covering from the First Scientific Paper on Semiconductor to State-Of-the-Art CMOS Finfet Technology written by Wai Shing Lau and published by World Scientific Publishing Company. This book was released on 2017-06-29 with total page 248 pages. Available in PDF, EPUB and Kindle. Book excerpt: This collection of essays documents and investigates the conflicts in the European, Russia and China that sparked populist revolts against the established globalist order in the European Union. It shows that the populist surge was not an anomaly. It was a
Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.
Book Synopsis Atomic Layer Deposition for Semiconductors by : Cheol Seong Hwang
Download or read book Atomic Layer Deposition for Semiconductors written by Cheol Seong Hwang and published by Springer Science & Business Media. This book was released on 2013-10-18 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.
In this book, Quirk and Serda introduce the terminology, concepts, processes, products, and equipment commonly used in the manufacture of ultra large scale integrated (ULSI) semiconductors. The book provides helpful, up-to-date technical information about semiconductor manufacturing and strikes an effective balance between the process and equipment technology found in wafer fabrications. Topics include copper interconnect; dual damascene additive process for metallization; deep UV sub-micron photolithography (.18 micron and below); low-k dielectric processing; chemical mechanical planarization; a comprehensive model of manufacturing process; chemical-mechanical polish (CMP); and maintenance and troubleshooting. For practicing semiconductor manufacturing technicians or those interested in semiconductor manufacturing technology and processes.
Book Synopsis Semiconductor Manufacturing Technology by : Michael Quirk
Download or read book Semiconductor Manufacturing Technology written by Michael Quirk and published by Pearson. This book was released on 2001 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: In this book, Quirk and Serda introduce the terminology, concepts, processes, products, and equipment commonly used in the manufacture of ultra large scale integrated (ULSI) semiconductors. The book provides helpful, up-to-date technical information about semiconductor manufacturing and strikes an effective balance between the process and equipment technology found in wafer fabrications. Topics include copper interconnect; dual damascene additive process for metallization; deep UV sub-micron photolithography (.18 micron and below); low-k dielectric processing; chemical mechanical planarization; a comprehensive model of manufacturing process; chemical-mechanical polish (CMP); and maintenance and troubleshooting. For practicing semiconductor manufacturing technicians or those interested in semiconductor manufacturing technology and processes.
Based on the authors' expansive collection of notes taken over the years, Nano-CMOS Circuit and Physical Design bridges the gap between physical and circuit design and fabrication processing, manufacturability, and yield. This innovative book covers: process technology, including sub-wavelength optical lithography; impact of process scaling on circuit and physical implementation and low power with leaky transistors; and DFM, yield, and the impact of physical implementation.
Book Synopsis Nano-CMOS Circuit and Physical Design by : Ban Wong
Download or read book Nano-CMOS Circuit and Physical Design written by Ban Wong and published by Wiley-IEEE Press. This book was released on 2005 with total page 426 pages. Available in PDF, EPUB and Kindle. Book excerpt: Based on the authors' expansive collection of notes taken over the years, Nano-CMOS Circuit and Physical Design bridges the gap between physical and circuit design and fabrication processing, manufacturability, and yield. This innovative book covers: process technology, including sub-wavelength optical lithography; impact of process scaling on circuit and physical implementation and low power with leaky transistors; and DFM, yield, and the impact of physical implementation.
In this book, a variety of topics related to Very-Large-Scale Integration (VLSI) is extensively discussed. The topics encompass the physics of VLSI transistors, the process of integrated chip design and fabrication and the applications of VLSI devices. It is intended to provide information on the latest advancement of VLSI technology to researchers, physicists as well as engineers working in the field of semiconductor manufacturing and VLSI design.
Book Synopsis Very-Large-Scale Integration by : Kim Ho Yeap
Download or read book Very-Large-Scale Integration written by Kim Ho Yeap and published by BoD – Books on Demand. This book was released on 2018-02-28 with total page 161 pages. Available in PDF, EPUB and Kindle. Book excerpt: In this book, a variety of topics related to Very-Large-Scale Integration (VLSI) is extensively discussed. The topics encompass the physics of VLSI transistors, the process of integrated chip design and fabrication and the applications of VLSI devices. It is intended to provide information on the latest advancement of VLSI technology to researchers, physicists as well as engineers working in the field of semiconductor manufacturing and VLSI design.
The power consumption of microprocessors is one of the most important challenges of high-performance chips and portable devices. In chapters drawn from Piguet's recently published Low-Power Electronics Design, Low-Power CMOS Circuits: Technology, Logic Design, and CAD Tools addresses the design of low-power circuitry in deep submicron technologies. It provides a focused reference for specialists involved in designing low-power circuitry, from transistors to logic gates. The book is organized into three broad sections for convenient access. The first examines the history of low-power electronics along with a look at emerging and possible future technologies. It also considers other technologies, such as nanotechnologies and optical chips, that may be useful in designing integrated circuits. The second part explains the techniques used to reduce power consumption at low levels. These include clock gating, leakage reduction, interconnecting and communication on chips, and adiabatic circuits. The final section discusses various CAD tools for designing low-power circuits. This section includes three chapters that demonstrate the tools and low-power design issues at three major companies that produce logic synthesizers. Providing detailed examinations contributed by leading experts, Low-Power CMOS Circuits: Technology, Logic Design, and CAD Tools supplies authoritative information on how to design and model for high performance with low power consumption in modern integrated circuits. It is a must-read for anyone designing modern computers or embedded systems.
Book Synopsis Low-Power CMOS Circuits by : Christian Piguet
Download or read book Low-Power CMOS Circuits written by Christian Piguet and published by CRC Press. This book was released on 2018-10-03 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt: The power consumption of microprocessors is one of the most important challenges of high-performance chips and portable devices. In chapters drawn from Piguet's recently published Low-Power Electronics Design, Low-Power CMOS Circuits: Technology, Logic Design, and CAD Tools addresses the design of low-power circuitry in deep submicron technologies. It provides a focused reference for specialists involved in designing low-power circuitry, from transistors to logic gates. The book is organized into three broad sections for convenient access. The first examines the history of low-power electronics along with a look at emerging and possible future technologies. It also considers other technologies, such as nanotechnologies and optical chips, that may be useful in designing integrated circuits. The second part explains the techniques used to reduce power consumption at low levels. These include clock gating, leakage reduction, interconnecting and communication on chips, and adiabatic circuits. The final section discusses various CAD tools for designing low-power circuits. This section includes three chapters that demonstrate the tools and low-power design issues at three major companies that produce logic synthesizers. Providing detailed examinations contributed by leading experts, Low-Power CMOS Circuits: Technology, Logic Design, and CAD Tools supplies authoritative information on how to design and model for high performance with low power consumption in modern integrated circuits. It is a must-read for anyone designing modern computers or embedded systems.
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Book Synopsis Wafer Bonding by : Marin Alexe
Download or read book Wafer Bonding written by Marin Alexe and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
This book is the first to explain FinFET modeling for IC simulation and the industry standard – BSIM-CMG - describing the rush in demand for advancing the technology from planar to 3D architecture, as now enabled by the approved industry standard. The book gives a strong foundation on the physics and operation of FinFET, details aspects of the BSIM-CMG model such as surface potential, charge and current calculations, and includes a dedicated chapter on parameter extraction procedures, providing a step-by-step approach for the efficient extraction of model parameters. With this book you will learn: Why you should use FinFET The physics and operation of FinFET Details of the FinFET standard model (BSIM-CMG) Parameter extraction in BSIM-CMG FinFET circuit design and simulation Authored by the lead inventor and developer of FinFET, and developers of the BSIM-CM standard model, providing an experts’ insight into the specifications of the standard The first book on the industry-standard FinFET model - BSIM-CMG
Book Synopsis FinFET Modeling for IC Simulation and Design by : Yogesh Singh Chauhan
Download or read book FinFET Modeling for IC Simulation and Design written by Yogesh Singh Chauhan and published by Academic Press. This book was released on 2015-03-17 with total page 305 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is the first to explain FinFET modeling for IC simulation and the industry standard – BSIM-CMG - describing the rush in demand for advancing the technology from planar to 3D architecture, as now enabled by the approved industry standard. The book gives a strong foundation on the physics and operation of FinFET, details aspects of the BSIM-CMG model such as surface potential, charge and current calculations, and includes a dedicated chapter on parameter extraction procedures, providing a step-by-step approach for the efficient extraction of model parameters. With this book you will learn: Why you should use FinFET The physics and operation of FinFET Details of the FinFET standard model (BSIM-CMG) Parameter extraction in BSIM-CMG FinFET circuit design and simulation Authored by the lead inventor and developer of FinFET, and developers of the BSIM-CM standard model, providing an experts’ insight into the specifications of the standard The first book on the industry-standard FinFET model - BSIM-CMG